TWI417128B - Method and device for managing coolant of wire saw - Google Patents
Method and device for managing coolant of wire saw Download PDFInfo
- Publication number
- TWI417128B TWI417128B TW099106341A TW99106341A TWI417128B TW I417128 B TWI417128 B TW I417128B TW 099106341 A TW099106341 A TW 099106341A TW 99106341 A TW99106341 A TW 99106341A TW I417128 B TWI417128 B TW I417128B
- Authority
- TW
- Taiwan
- Prior art keywords
- coolant
- wire saw
- centrifugal separator
- steel wire
- slurry
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009107353A JP2010253621A (ja) | 2009-04-27 | 2009-04-27 | ワイヤソーのクーラント管理方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201043322A TW201043322A (en) | 2010-12-16 |
TWI417128B true TWI417128B (zh) | 2013-12-01 |
Family
ID=43315143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099106341A TWI417128B (zh) | 2009-04-27 | 2010-03-04 | Method and device for managing coolant of wire saw |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2010253621A (ja) |
TW (1) | TWI417128B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5624449B2 (ja) * | 2010-12-16 | 2014-11-12 | 株式会社Ihi回転機械 | ワイヤソーのスラリ管理装置 |
CN105235078B (zh) * | 2015-10-15 | 2018-03-27 | 天津英利新能源有限公司 | 一种浆料冷却系统 |
JP6819619B2 (ja) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | ワーク切断方法及びワイヤソー |
CN110789014B (zh) * | 2019-10-15 | 2021-11-30 | 江苏吉星新材料有限公司 | 一种碳化硅衬底片的切片方法 |
CN113894679A (zh) * | 2021-10-09 | 2022-01-07 | 厦门惟度新材料有限公司 | 一种线锯浸没式切割冷却装置 |
CN114147288A (zh) * | 2021-12-13 | 2022-03-08 | 上海德瀛睿创半导体科技有限公司 | 线锯机及线锯系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW363914B (en) * | 1996-02-21 | 1999-07-11 | Shinetsu Handotai Kk | Recycling system for water soluble sludge waste |
TW434093B (en) * | 1996-09-06 | 2001-05-16 | Sharp Kk | A multi-wire saw |
US6422067B1 (en) * | 1999-04-26 | 2002-07-23 | Super Silicon Crystal Research Institute Corporation | Slurry useful for wire-saw slicing and evaluation of slurry |
EP1685927A1 (en) * | 2003-10-27 | 2006-08-02 | Mitsubishi Denki Kabushiki Kaisha | Multi-wire saw |
TW200841991A (en) * | 2006-12-22 | 2008-11-01 | Garbo S R L | Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component |
EP2075160A2 (en) * | 2007-11-27 | 2009-07-01 | Calsonic Kansei Corporation | Console box structure |
-
2009
- 2009-04-27 JP JP2009107353A patent/JP2010253621A/ja not_active Withdrawn
-
2010
- 2010-03-04 TW TW099106341A patent/TWI417128B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW363914B (en) * | 1996-02-21 | 1999-07-11 | Shinetsu Handotai Kk | Recycling system for water soluble sludge waste |
TW434093B (en) * | 1996-09-06 | 2001-05-16 | Sharp Kk | A multi-wire saw |
US6422067B1 (en) * | 1999-04-26 | 2002-07-23 | Super Silicon Crystal Research Institute Corporation | Slurry useful for wire-saw slicing and evaluation of slurry |
EP1685927A1 (en) * | 2003-10-27 | 2006-08-02 | Mitsubishi Denki Kabushiki Kaisha | Multi-wire saw |
TW200841991A (en) * | 2006-12-22 | 2008-11-01 | Garbo S R L | Process and apparatus for treating exhausted abrasive slurries from the lapping process for the recovery of their reusable abrasive component |
EP2075160A2 (en) * | 2007-11-27 | 2009-07-01 | Calsonic Kansei Corporation | Console box structure |
Also Published As
Publication number | Publication date |
---|---|
JP2010253621A (ja) | 2010-11-11 |
TW201043322A (en) | 2010-12-16 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |