TWI415703B - 雷射加工裝置及基板位置檢測方法 - Google Patents

雷射加工裝置及基板位置檢測方法 Download PDF

Info

Publication number
TWI415703B
TWI415703B TW099143916A TW99143916A TWI415703B TW I415703 B TWI415703 B TW I415703B TW 099143916 A TW099143916 A TW 099143916A TW 99143916 A TW99143916 A TW 99143916A TW I415703 B TWI415703 B TW I415703B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
mark
processing
imaging
Prior art date
Application number
TW099143916A
Other languages
English (en)
Chinese (zh)
Other versions
TW201210725A (en
Inventor
Koichi Indo
Atsuhiro Kaneda
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201210725A publication Critical patent/TW201210725A/zh
Application granted granted Critical
Publication of TWI415703B publication Critical patent/TWI415703B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW099143916A 2010-09-01 2010-12-15 雷射加工裝置及基板位置檢測方法 TWI415703B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/064948 WO2012029142A1 (ja) 2010-09-01 2010-09-01 レーザ加工装置および基板位置検出方法

Publications (2)

Publication Number Publication Date
TW201210725A TW201210725A (en) 2012-03-16
TWI415703B true TWI415703B (zh) 2013-11-21

Family

ID=45772278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099143916A TWI415703B (zh) 2010-09-01 2010-12-15 雷射加工裝置及基板位置檢測方法

Country Status (5)

Country Link
JP (1) JP5383920B2 (ja)
KR (1) KR101435352B1 (ja)
CN (1) CN103079746A (ja)
TW (1) TWI415703B (ja)
WO (1) WO2012029142A1 (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2969373A4 (en) * 2013-03-13 2016-11-16 Applied Materials Inc LASER DISPLAY PLATFORM FOR SOLAR CELLS
JP6174906B2 (ja) * 2013-05-23 2017-08-02 中村留精密工業株式会社 機械の自己診断及び機械精度の補正方法
DE102013217126B4 (de) 2013-08-28 2015-09-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Feststellen von Abweichungen einer Ist-Lage eines Laserbearbeitungskopfes von einer Soll-Lage, Laserbearbeitungsmaschine und Computerprogrammprodukt
CN103528513B (zh) * 2013-09-30 2016-08-17 上海大学 Oled玻璃基板对准方法及装置
CN103852801A (zh) * 2014-01-10 2014-06-11 凯迈(洛阳)电子有限公司 一种红外枪在位检测装置
CN104439726B (zh) * 2014-11-19 2017-01-25 苏州德龙激光股份有限公司 激光实时纠偏装置及其纠偏方法
CN107003118B (zh) * 2014-12-02 2019-09-24 三菱电机株式会社 位移传感器、位移检测装置及位移检测方法
CN104708158A (zh) * 2015-02-13 2015-06-17 佛山市中科源自动化设备有限公司 一种电路板自动焊接方法
JP2017113788A (ja) * 2015-12-24 2017-06-29 株式会社リコー 光加工装置
TWI641933B (zh) * 2016-01-15 2018-11-21 施教競 Processing method of processing machine
JP6594545B2 (ja) * 2016-07-14 2019-10-23 三菱電機株式会社 基板計測装置およびレーザ加工システム
JP6919622B2 (ja) * 2018-04-26 2021-08-18 オムロン株式会社 制御システム、制御方法、および制御プログラム
JP7084227B2 (ja) * 2018-06-22 2022-06-14 株式会社Ｓｃｒｅｅｎホールディングス マーク位置検出装置、描画装置およびマーク位置検出方法
WO2020090075A1 (ja) * 2018-10-31 2020-05-07 株式会社ニコン 加工システム、及び、加工方法
US20220176493A1 (en) * 2019-03-20 2022-06-09 Bobst Mex Sa Characterization method and system for a laser processing machine with a moving sheet or web
JP7344047B2 (ja) * 2019-08-22 2023-09-13 株式会社ジェーイーエル 基板の位置合わせ方法
CN113059516A (zh) * 2021-04-30 2021-07-02 湖州铭沅科技合伙企业(有限合伙) 一种可旋转真空吸气移动工作平台装置
CN113298076B (zh) * 2021-06-18 2022-08-26 蓝思智能机器人(长沙)有限公司 平面加工设备的校正数据采集方法、装置、设备及介质
CN113532316B (zh) * 2021-07-05 2023-01-20 深圳市先地图像科技有限公司 一种能同时检测多块pcb板形位偏差的装置及检测方法
TWI789068B (zh) * 2021-10-22 2023-01-01 健鼎科技股份有限公司 電路板的漲縮值的計算方法及多層電路板的孔洞成形方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007017763A (ja) * 2005-07-08 2007-01-25 Fujifilm Holdings Corp 画像位置計測装置及び露光装置
JP2010085210A (ja) * 2008-09-30 2010-04-15 Toray Ind Inc 欠陥検査装置
TWI323683B (ja) * 2004-01-16 2010-04-21 Hitachi Via Mechanics Ltd
JP2010162559A (ja) * 2009-01-13 2010-07-29 Mitsubishi Electric Corp レーザ加工方法および加工装置並びに被加工物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593877A (en) * 1993-03-11 1997-01-14 The Rockefeller University Nucleic acid and recombinant production of vespid venom hyaluronidase
JPH10323783A (ja) * 1997-05-26 1998-12-08 Japan Tobacco Inc 帯状材の開孔装置
JP3855684B2 (ja) * 2001-06-05 2006-12-13 松下電器産業株式会社 レーザ加工装置およびレーザ加工方法
CN201076969Y (zh) * 2007-09-28 2008-06-25 北京工业大学 紫外激光微加工精确定位系统
JP4951036B2 (ja) * 2009-07-14 2012-06-13 株式会社ブイ・テクノロジー 露光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI323683B (ja) * 2004-01-16 2010-04-21 Hitachi Via Mechanics Ltd
JP2007017763A (ja) * 2005-07-08 2007-01-25 Fujifilm Holdings Corp 画像位置計測装置及び露光装置
JP2010085210A (ja) * 2008-09-30 2010-04-15 Toray Ind Inc 欠陥検査装置
JP2010162559A (ja) * 2009-01-13 2010-07-29 Mitsubishi Electric Corp レーザ加工方法および加工装置並びに被加工物

Also Published As

Publication number Publication date
KR101435352B1 (ko) 2014-08-28
KR20130042035A (ko) 2013-04-25
WO2012029142A1 (ja) 2012-03-08
JP5383920B2 (ja) 2014-01-08
JPWO2012029142A1 (ja) 2013-10-28
TW201210725A (en) 2012-03-16
CN103079746A (zh) 2013-05-01

Similar Documents

Publication Publication Date Title
TWI415703B (zh) 雷射加工裝置及基板位置檢測方法
KR101698269B1 (ko) 레이저 가공기, 레이저 가공기의 워크 왜곡 보정 방법
JP5089827B1 (ja) レーザ加工方法およびレーザ加工装置
KR102127109B1 (ko) 기판 계측 장치 및 레이저 가공 시스템
JP4912246B2 (ja) 電子部品装着方法及び電子部品装着装置
KR20070107047A (ko) 묘화 방법, 묘화 장치, 묘화 시스템, 및 보정 방법
KR20200002916A (ko) 레이저 가공 장치
KR100771496B1 (ko) 레이저 마킹 시스템의 보정 장치 및 방법
WO2017064776A1 (ja) 部品実装装置
JP5457665B2 (ja) 電子部品装着装置
JP3644846B2 (ja) 描画装置の移動誤差検出装置及びその方法
WO2020202440A1 (ja) レーザ加工装置、レーザ加工方法、および誤差調整方法
JP2009212251A (ja) 部品移載装置
WO2017138113A1 (ja) 表面実装機、認識誤差補正方法
JP5572247B2 (ja) 画像歪補正方法
TW201940272A (zh) 雷射標記裝置
JP6706164B2 (ja) アライメント装置、露光装置、およびアライメント方法
JP2008083520A (ja) 露光装置およびアライメント方法
JP6006133B2 (ja) 基板製造装置の調整方法、基板製造方法、及び基板製造装置
TWI604906B (zh) 雷射加工裝置及雷射加工方法
KR20230113395A (ko) 노광 방법 및 노광 장치
JP2022137850A (ja) 露光方法および露光装置
CN118575600A (zh) 元件安装装置
JP2006010761A (ja) 描画装置および描画方法
JP2010015234A (ja) 工程処理装置および工程処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees