TWI412898B - 評估方法,控制方法,曝光設備,及記憶體媒體 - Google Patents
評估方法,控制方法,曝光設備,及記憶體媒體 Download PDFInfo
- Publication number
- TWI412898B TWI412898B TW098100652A TW98100652A TWI412898B TW I412898 B TWI412898 B TW I412898B TW 098100652 A TW098100652 A TW 098100652A TW 98100652 A TW98100652 A TW 98100652A TW I412898 B TWI412898 B TW I412898B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical system
- projection optical
- value
- polarization
- change
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000011156 evaluation Methods 0.000 title claims description 18
- 230000015654 memory Effects 0.000 title claims description 14
- 230000003287 optical effect Effects 0.000 claims abstract description 201
- 230000010287 polarization Effects 0.000 claims abstract description 124
- 230000008859 change Effects 0.000 claims abstract description 101
- 238000003384 imaging method Methods 0.000 claims abstract description 98
- 238000004364 calculation method Methods 0.000 claims abstract description 39
- 239000011159 matrix material Substances 0.000 claims description 41
- 238000005286 illumination Methods 0.000 claims description 24
- 230000004075 alteration Effects 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 230000006870 function Effects 0.000 claims description 11
- 238000004590 computer program Methods 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 2
- 230000010365 information processing Effects 0.000 description 37
- 230000035945 sensitivity Effects 0.000 description 12
- 238000012634 optical imaging Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- 210000001747 pupil Anatomy 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000003504 photosensitizing agent Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000012888 cubic function Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/54—Lamp housings; Illuminating means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/72—Controlling or varying light intensity, spectral composition, or exposure time in photographic printing apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J4/00—Measuring polarisation of light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008003641A JP5055141B2 (ja) | 2008-01-10 | 2008-01-10 | 評価方法、調整方法、露光装置、およびプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200942981A TW200942981A (en) | 2009-10-16 |
| TWI412898B true TWI412898B (zh) | 2013-10-21 |
Family
ID=40850354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098100652A TWI412898B (zh) | 2008-01-10 | 2009-01-09 | 評估方法,控制方法,曝光設備,及記憶體媒體 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8520190B2 (enExample) |
| JP (1) | JP5055141B2 (enExample) |
| KR (1) | KR101031715B1 (enExample) |
| TW (1) | TWI412898B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5539148B2 (ja) * | 2010-10-19 | 2014-07-02 | キヤノン株式会社 | レジストパターンの算出方法及び算出プログラム |
| JP2012255843A (ja) * | 2011-06-07 | 2012-12-27 | Konica Minolta Business Technologies Inc | 画像形成装置、画像形成システムおよび画像形成プログラム |
| KR101831320B1 (ko) | 2013-11-20 | 2018-02-22 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 방법 및 장치 |
| JP6606800B2 (ja) * | 2015-04-23 | 2019-11-20 | 株式会社トーメーコーポレーション | 偏光情報を利用した光干渉断層計 |
| EP3278720B1 (en) * | 2016-08-05 | 2019-05-29 | Tomey Corporation | Optical coherence tomographic device |
| JP7547185B2 (ja) * | 2020-12-10 | 2024-09-09 | キヤノン株式会社 | 情報処理装置、露光装置、及び物品の製造方法。 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024612A1 (en) * | 2002-03-01 | 2005-02-03 | Nikon Corporation | Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method and exposure apparatus, program, and device manufacturing method |
| US20070046921A1 (en) * | 2005-07-22 | 2007-03-01 | Kazuhiro Takahashi | Exposure apparatus and method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176733A (ja) * | 1997-12-15 | 1999-07-02 | Nikon Corp | 露光方法および装置 |
| US6870668B2 (en) * | 2000-10-10 | 2005-03-22 | Nikon Corporation | Method for evaluating image formation performance |
| JP4436029B2 (ja) * | 2001-02-13 | 2010-03-24 | 株式会社ニコン | 投影光学系の製造方法及び調整方法、露光装置及びその製造方法、デバイス製造方法、並びにコンピュータシステム |
| JP3805323B2 (ja) | 2003-05-21 | 2006-08-02 | キヤノン株式会社 | 露光装置、収差低減方法及び光学部材調整機構 |
| JP2006173305A (ja) * | 2004-12-15 | 2006-06-29 | Canon Inc | 露光装置及び方法、並びに、デバイス製造方法 |
| JP2006237109A (ja) * | 2005-02-23 | 2006-09-07 | Nikon Corp | 光学系の評価方法、光学系、露光装置、および露光方法 |
| JP4793683B2 (ja) | 2006-01-23 | 2011-10-12 | 株式会社ニコン | 算出方法、調整方法及び露光方法、並びに像形成状態調整システム及び露光装置 |
| JP2007198896A (ja) * | 2006-01-26 | 2007-08-09 | Canon Inc | 計測方法 |
| EP1818658A1 (en) | 2006-02-08 | 2007-08-15 | Carl Zeiss SMT AG | Method for approximating the influence of an optical system on the state of polarisation of optical radiation |
| US8126669B2 (en) * | 2008-06-09 | 2012-02-28 | Carl Zeiss Smt Gmbh | Optimization and matching of optical systems by use of orientation Zernike polynomials |
-
2008
- 2008-01-10 JP JP2008003641A patent/JP5055141B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-09 KR KR1020090002096A patent/KR101031715B1/ko not_active Expired - Fee Related
- 2009-01-09 TW TW098100652A patent/TWI412898B/zh not_active IP Right Cessation
- 2009-01-09 US US12/351,019 patent/US8520190B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024612A1 (en) * | 2002-03-01 | 2005-02-03 | Nikon Corporation | Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method and exposure apparatus, program, and device manufacturing method |
| US20070046921A1 (en) * | 2005-07-22 | 2007-03-01 | Kazuhiro Takahashi | Exposure apparatus and method |
Non-Patent Citations (1)
| Title |
|---|
| 【Polarization aberrations in hyper-numerical-aperture projection printing: a comparison of various representations】 Journal of Micro/Nanolithography, MEMS, and MOEMS 5(03), 033001, (1 Jul 2006)。 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090180093A1 (en) | 2009-07-16 |
| TW200942981A (en) | 2009-10-16 |
| KR101031715B1 (ko) | 2011-04-29 |
| JP5055141B2 (ja) | 2012-10-24 |
| KR20090077726A (ko) | 2009-07-15 |
| US8520190B2 (en) | 2013-08-27 |
| JP2009170466A (ja) | 2009-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |