TWI411792B - 用於測試電測試樣本之電測試設備及電測試方法 - Google Patents
用於測試電測試樣本之電測試設備及電測試方法 Download PDFInfo
- Publication number
- TWI411792B TWI411792B TW98122111A TW98122111A TWI411792B TW I411792 B TWI411792 B TW I411792B TW 98122111 A TW98122111 A TW 98122111A TW 98122111 A TW98122111 A TW 98122111A TW I411792 B TWI411792 B TW I411792B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- conductor substrate
- electrical
- reinforcing device
- spacer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200810034918 DE102008034918B4 (de) | 2008-07-26 | 2008-07-26 | Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201007184A TW201007184A (en) | 2010-02-16 |
TWI411792B true TWI411792B (zh) | 2013-10-11 |
Family
ID=41334518
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101112772A TWI465740B (zh) | 2008-07-26 | 2009-06-30 | 用於測試電測試樣本之電測試設備及電測試方法 |
TW98122111A TWI411792B (zh) | 2008-07-26 | 2009-06-30 | 用於測試電測試樣本之電測試設備及電測試方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101112772A TWI465740B (zh) | 2008-07-26 | 2009-06-30 | 用於測試電測試樣本之電測試設備及電測試方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8217675B2 (fr) |
EP (2) | EP2458392A3 (fr) |
JP (2) | JP5112397B2 (fr) |
CN (2) | CN101634682B (fr) |
DE (1) | DE102008034918B4 (fr) |
SG (1) | SG158795A1 (fr) |
TW (2) | TWI465740B (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8278956B2 (en) * | 2010-04-08 | 2012-10-02 | Advantest America, Inc | Probecard system and method |
US8427104B2 (en) * | 2010-04-22 | 2013-04-23 | The Raymond Corporation | Method of allocating batteries for use on specific industrial vehicles in a fleet |
CN103579890B (zh) * | 2012-07-18 | 2015-09-23 | 纬创资通股份有限公司 | 自动对位装置 |
DE102012016449A1 (de) * | 2012-08-16 | 2014-03-13 | Feinmetall Gmbh | Prüfkopf für die elektrische Prüfung eines Prüflings |
DE102013203536B4 (de) * | 2013-03-01 | 2016-03-31 | Multitest Elektronische Systeme Gmbh | Vorrichtung zum Prüfen von elektronischen Bauteilen |
CN104107085B (zh) * | 2013-04-17 | 2016-03-23 | 上海市同济医院 | 一种具有药物剂量精确缓释功能的构件连接杆 |
JP2015021726A (ja) * | 2013-07-16 | 2015-02-02 | 日置電機株式会社 | プローブユニットおよび基板検査装置 |
EP3114489B1 (fr) | 2014-03-06 | 2018-08-01 | Technoprobe S.p.A | Carte de sonde pour un appareil d'essai de dispositifs électroniques, en particulier pour des applications à des températures extrêmes |
CN106104280B (zh) * | 2014-03-06 | 2019-08-06 | 泰克诺探头公司 | 用于电子器件的测试装置的高平面性探针卡 |
SG11201608288UA (en) | 2014-04-04 | 2016-11-29 | Feinmetall Gmbh | Contact-distance transformer, electrical testing device, and method for producing a contact-distance transformer |
TWI610080B (zh) * | 2016-05-12 | 2018-01-01 | 中華精測科技股份有限公司 | 探針卡總成 |
WO2018063251A1 (fr) * | 2016-09-29 | 2018-04-05 | Cummins Inc. | Systèmes et procédés de réception de perte d'historique de charge de batterie |
IT201700046645A1 (it) | 2017-04-28 | 2018-10-28 | Technoprobe Spa | Scheda di misura per un’apparecchiatura di test di dispositivi elettronici |
JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
DE102017209443A1 (de) * | 2017-06-02 | 2018-12-06 | Feinmetall Gmbh | Kontaktmodul zur elektrischen Berührungskontaktierung eines Bauteils und Kontaktsystem |
CN110133502A (zh) * | 2019-05-13 | 2019-08-16 | 安徽中磁高科有限公司 | 一种新能源汽车电机测试台架的快速对中装置 |
CN110426536A (zh) * | 2019-07-29 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | Pcb导电布测试线路板 |
JP7313315B2 (ja) * | 2020-05-19 | 2023-07-24 | 三菱電機株式会社 | 半導体装置の製造方法及び電力制御回路の製造方法 |
TWI817183B (zh) * | 2021-08-23 | 2023-10-01 | 鴻勁精密股份有限公司 | 壓接機構、測試裝置及作業機 |
CN117434311B (zh) * | 2023-09-28 | 2024-07-12 | 海信家电集团股份有限公司 | 功率器件的测试装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW488001B (en) * | 2001-03-30 | 2002-05-21 | Fujitsu Ltd | Semiconductor device, manufacturing method thereof, and semiconductor substrate |
TW200409582A (en) * | 2002-06-24 | 2004-06-01 | Nanonexus Inc | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
TW200425310A (en) * | 2002-10-31 | 2004-11-16 | Strasbaugh | Method of preparing whole semiconductor wafer for analysis |
US20050275418A1 (en) * | 2000-05-23 | 2005-12-15 | Chong Fu C | High density interconnect system having rapid fabrication cycle |
US20060255814A1 (en) * | 2005-04-19 | 2006-11-16 | Formfactor | Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996015551A1 (fr) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Montage de composants electroniques sur une carte a circuits imprimees |
JP2000338134A (ja) * | 1999-05-31 | 2000-12-08 | Tokyo Cathode Laboratory Co Ltd | プローブカード及びその製造方法 |
US7579848B2 (en) * | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
US6441629B1 (en) * | 2000-05-31 | 2002-08-27 | Advantest Corp | Probe contact system having planarity adjustment mechanism |
US6756797B2 (en) | 2001-01-31 | 2004-06-29 | Wentworth Laboratories Inc. | Planarizing interposer for thermal compensation of a probe card |
JP3621938B2 (ja) * | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
DE102004023987B4 (de) * | 2004-05-14 | 2008-06-19 | Feinmetall Gmbh | Elektrische Prüfeinrichtung |
DE102004027887B4 (de) * | 2004-05-28 | 2010-07-29 | Feinmetall Gmbh | Prüfeinrichtung zur elektrischen Prüfung eines Prüflings |
US7230437B2 (en) * | 2004-06-15 | 2007-06-12 | Formfactor, Inc. | Mechanically reconfigurable vertical tester interface for IC probing |
KR100675487B1 (ko) * | 2005-06-02 | 2007-01-30 | 주식회사 파이컴 | 프로브 카드 |
US7498825B2 (en) * | 2005-07-08 | 2009-03-03 | Formfactor, Inc. | Probe card assembly with an interchangeable probe insert |
US7504822B2 (en) | 2005-10-28 | 2009-03-17 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
US7541819B2 (en) | 2005-10-28 | 2009-06-02 | Teradyne, Inc. | Modularized device interface with grounding insert between two strips |
JP4860242B2 (ja) * | 2005-11-11 | 2012-01-25 | 東京エレクトロン株式会社 | プローブ装置 |
DE102006054735A1 (de) * | 2005-12-05 | 2007-06-06 | Feinmetall Gmbh | Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings |
US7365553B2 (en) * | 2005-12-22 | 2008-04-29 | Touchdown Technologies, Inc. | Probe card assembly |
US7898272B2 (en) * | 2006-06-08 | 2011-03-01 | Nhk Spring Co., Ltd. | Probe card |
US7439751B2 (en) | 2006-09-27 | 2008-10-21 | Taiwan Semiconductor Manufacturing Co, Ltd. | Apparatus and method for testing conductive bumps |
-
2008
- 2008-07-26 DE DE200810034918 patent/DE102008034918B4/de not_active Expired - Fee Related
-
2009
- 2009-06-29 EP EP20120000464 patent/EP2458392A3/fr not_active Withdrawn
- 2009-06-29 EP EP20090008436 patent/EP2148209A3/fr not_active Withdrawn
- 2009-06-29 SG SG200904432-2A patent/SG158795A1/en unknown
- 2009-06-30 TW TW101112772A patent/TWI465740B/zh not_active IP Right Cessation
- 2009-06-30 TW TW98122111A patent/TWI411792B/zh not_active IP Right Cessation
- 2009-07-21 US US12/506,822 patent/US8217675B2/en not_active Expired - Fee Related
- 2009-07-23 CN CN200910151186XA patent/CN101634682B/zh not_active Expired - Fee Related
- 2009-07-23 CN CN2012100540975A patent/CN102590569A/zh active Pending
- 2009-07-24 JP JP2009172653A patent/JP5112397B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-24 JP JP2012011631A patent/JP5430687B2/ja not_active Expired - Fee Related
- 2012-01-24 US US13/356,991 patent/US9116175B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050275418A1 (en) * | 2000-05-23 | 2005-12-15 | Chong Fu C | High density interconnect system having rapid fabrication cycle |
TW488001B (en) * | 2001-03-30 | 2002-05-21 | Fujitsu Ltd | Semiconductor device, manufacturing method thereof, and semiconductor substrate |
TW200409582A (en) * | 2002-06-24 | 2004-06-01 | Nanonexus Inc | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
TW200425310A (en) * | 2002-10-31 | 2004-11-16 | Strasbaugh | Method of preparing whole semiconductor wafer for analysis |
US20060255814A1 (en) * | 2005-04-19 | 2006-11-16 | Formfactor | Apparatus And Method For Managing Thermally Induced Motion Of A Probe Card Assembly |
Also Published As
Publication number | Publication date |
---|---|
JP5430687B2 (ja) | 2014-03-05 |
US20100019788A1 (en) | 2010-01-28 |
EP2148209A3 (fr) | 2013-03-06 |
DE102008034918B4 (de) | 2012-09-27 |
US9116175B2 (en) | 2015-08-25 |
SG158795A1 (en) | 2010-02-26 |
JP5112397B2 (ja) | 2013-01-09 |
JP2012123010A (ja) | 2012-06-28 |
JP2010032519A (ja) | 2010-02-12 |
CN102590569A (zh) | 2012-07-18 |
US20120119774A1 (en) | 2012-05-17 |
TW201237435A (en) | 2012-09-16 |
EP2458392A3 (fr) | 2013-03-13 |
DE102008034918A1 (de) | 2010-02-04 |
EP2458392A2 (fr) | 2012-05-30 |
TW201007184A (en) | 2010-02-16 |
US8217675B2 (en) | 2012-07-10 |
EP2148209A2 (fr) | 2010-01-27 |
CN101634682A (zh) | 2010-01-27 |
TWI465740B (zh) | 2014-12-21 |
CN101634682B (zh) | 2013-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |