TWI406806B - 用於微加工一材料之方法與裝置 - Google Patents

用於微加工一材料之方法與裝置 Download PDF

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Publication number
TWI406806B
TWI406806B TW096122741A TW96122741A TWI406806B TW I406806 B TWI406806 B TW I406806B TW 096122741 A TW096122741 A TW 096122741A TW 96122741 A TW96122741 A TW 96122741A TW I406806 B TWI406806 B TW I406806B
Authority
TW
Taiwan
Prior art keywords
illumination
location
radiation
image
wavelength
Prior art date
Application number
TW096122741A
Other languages
English (en)
Chinese (zh)
Other versions
TW200800792A (en
Inventor
Zvi Kotler
Eliezer Lipman
Golan Hanina
Boris Greenberg
Michael Zenou
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of TW200800792A publication Critical patent/TW200800792A/zh
Application granted granted Critical
Publication of TWI406806B publication Critical patent/TWI406806B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
TW096122741A 2006-06-26 2007-06-23 用於微加工一材料之方法與裝置 TWI406806B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81633206P 2006-06-26 2006-06-26

Publications (2)

Publication Number Publication Date
TW200800792A TW200800792A (en) 2008-01-01
TWI406806B true TWI406806B (zh) 2013-09-01

Family

ID=39012034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096122741A TWI406806B (zh) 2006-06-26 2007-06-23 用於微加工一材料之方法與裝置

Country Status (5)

Country Link
JP (1) JP2008030119A (ja)
KR (1) KR101414867B1 (ja)
CN (2) CN101098620B (ja)
IL (1) IL184060A0 (ja)
TW (1) TWI406806B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2458463B (en) * 2008-03-17 2013-02-20 Dek Int Gmbh Imaging system and method
TW201716167A (zh) * 2011-08-18 2017-05-16 奧寶科技有限公司 用於電路之檢測/維修/再檢測系統及雷射寫入系統
US20130164457A1 (en) * 2011-12-27 2013-06-27 Rigaku Innovative Technologies, Inc. Method of manufacturing patterned x-ray optical elements
CN102974964B (zh) * 2012-10-23 2014-05-21 廖怀宝 一种利用mark点定位功能固定PCB板的方法
JP5715113B2 (ja) * 2012-12-14 2015-05-07 株式会社片岡製作所 レーザ加工機
US9274064B2 (en) * 2013-05-30 2016-03-01 Seagate Technology Llc Surface feature manager
EP2957378A1 (de) * 2014-06-16 2015-12-23 Synova SA Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle
JP6367886B2 (ja) * 2016-10-14 2018-08-01 ファナック株式会社 レーザ加工装置
JP7436208B2 (ja) * 2017-01-18 2024-02-21 アイピージー フォトニクス コーポレーション 材料の改変についてのコヒーレント撮像およびフィードバック制御のための方法およびシステム
CN107309554A (zh) * 2017-03-16 2017-11-03 融之航信息科技（苏州）有限公司 一种复合材料损伤区域的激光去除装置及其方法
CN107433391B (zh) * 2017-07-03 2020-01-17 武汉逸飞激光设备有限公司 一种基于图像识别的焊接校准方法及系统
JP7388917B2 (ja) 2019-12-26 2023-11-29 株式会社キーエンス レーザ加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0884128A1 (en) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1294788C (zh) * 1997-12-11 2007-01-10 伊比登株式会社 多层印刷电路板的制造方法
TW528879B (en) * 2001-02-22 2003-04-21 Ishikawajima Harima Heavy Ind Illumination optical system and laser processor having the same
JP3863389B2 (ja) 2001-05-31 2006-12-27 三菱電機株式会社 レーザ加工方法および装置
JP2003202216A (ja) * 2002-01-08 2003-07-18 Canon Inc 三次元画像処理方法、三次元画像処理装置、三次元画像処理システムおよび三次元画像処理プログラム
JP2004066327A (ja) * 2002-08-09 2004-03-04 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP4338378B2 (ja) * 2002-11-18 2009-10-07 オムロンレーザーフロント株式会社 レーザ加工装置
JP4288484B2 (ja) * 2003-11-05 2009-07-01 株式会社日立ハイテクノロジーズ 基板の欠陥修正装置及びその方法並びに液晶基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0884128A1 (en) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board

Also Published As

Publication number Publication date
CN101098620B (zh) 2012-09-05
KR101414867B1 (ko) 2014-07-03
JP2008030119A (ja) 2008-02-14
CN101098620A (zh) 2008-01-02
CN102626827A (zh) 2012-08-08
TW200800792A (en) 2008-01-01
IL184060A0 (en) 2008-01-20
KR20070122374A (ko) 2007-12-31
CN102626827B (zh) 2015-08-19

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