TWI406400B - 感測元件及其驅動方法,及輸入裝置,具有輸入功能之顯示裝置及通訊元件 - Google Patents
感測元件及其驅動方法,及輸入裝置,具有輸入功能之顯示裝置及通訊元件 Download PDFInfo
- Publication number
- TWI406400B TWI406400B TW098130971A TW98130971A TWI406400B TW I406400 B TWI406400 B TW I406400B TW 098130971 A TW098130971 A TW 098130971A TW 98130971 A TW98130971 A TW 98130971A TW I406400 B TWI406400 B TW I406400B
- Authority
- TW
- Taiwan
- Prior art keywords
- diode
- diode element
- gate
- electrode
- elements
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000004891 communication Methods 0.000 title claims description 12
- 238000012905 input function Methods 0.000 title claims description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 163
- 239000000758 substrate Substances 0.000 claims description 29
- 239000003990 capacitor Substances 0.000 claims description 25
- 230000000630 rising effect Effects 0.000 claims description 12
- 210000004508 polar body Anatomy 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 description 38
- 239000010409 thin film Substances 0.000 description 23
- 238000012986 modification Methods 0.000 description 21
- 230000004048 modification Effects 0.000 description 21
- 230000006870 function Effects 0.000 description 8
- 238000005286 illumination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 6
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- 101000685663 Homo sapiens Sodium/nucleoside cotransporter 1 Proteins 0.000 description 4
- 101000821827 Homo sapiens Sodium/nucleoside cotransporter 2 Proteins 0.000 description 4
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- BCZWPKDRLPGFFZ-UHFFFAOYSA-N azanylidynecerium Chemical compound [Ce]#N BCZWPKDRLPGFFZ-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 239000012769 display material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/107—Integrated devices having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
- H10F55/17—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive semiconductor devices have potential barriers
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Light Receiving Elements (AREA)
- Thin Film Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Electronic Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008258862A JP5275739B2 (ja) | 2008-10-03 | 2008-10-03 | センサ素子およびその駆動方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201027726A TW201027726A (en) | 2010-07-16 |
| TWI406400B true TWI406400B (zh) | 2013-08-21 |
Family
ID=42075438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098130971A TWI406400B (zh) | 2008-10-03 | 2009-09-14 | 感測元件及其驅動方法,及輸入裝置,具有輸入功能之顯示裝置及通訊元件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8456460B2 (enExample) |
| JP (1) | JP5275739B2 (enExample) |
| KR (1) | KR20100038160A (enExample) |
| CN (1) | CN101714566B (enExample) |
| TW (1) | TWI406400B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011040094A1 (ja) * | 2009-09-30 | 2011-04-07 | シャープ株式会社 | 表示装置 |
| JP5398842B2 (ja) | 2009-09-30 | 2014-01-29 | シャープ株式会社 | 表示装置 |
| CN105336752B (zh) * | 2014-06-23 | 2018-08-21 | 上海箩箕技术有限公司 | 面阵传感器装置及其形成方法 |
| CN105097941B (zh) * | 2015-05-28 | 2019-02-26 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制造方法、阵列基板、显示装置 |
| JP6704802B2 (ja) * | 2016-06-10 | 2020-06-03 | 株式会社ジャパンディスプレイ | 入力検出装置および電子装置 |
| FR3083975B1 (fr) | 2018-07-20 | 2020-10-16 | Univ Sorbonne | Dispositif d'observation oculaire |
| KR20230089247A (ko) * | 2021-12-13 | 2023-06-20 | 엘지디스플레이 주식회사 | 픽셀 회로 및 표시 장치 |
| CN115290953B (zh) * | 2022-06-24 | 2024-05-17 | 杭州格蓝丰科技有限公司 | 一种基于动态二极管的自驱动机械信号传感器及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200521540A (en) * | 2003-08-25 | 2005-07-01 | Toshiba Matsushita Display Tec | Display device and photoelectric converter |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6051857A (en) * | 1998-01-07 | 2000-04-18 | Innovision, Inc. | Solid-state imaging device and method of detecting optical signals using the same |
| JP2004119719A (ja) * | 2002-09-26 | 2004-04-15 | Toshiba Matsushita Display Technology Co Ltd | 光センサ用ダイオード、これを用いた画像入力回路、および画像入力回路の駆動方法 |
| US7265740B2 (en) * | 2002-08-30 | 2007-09-04 | Toshiba Matsushita Display Technology Co., Ltd. | Suppression of leakage current in image acquisition |
| JP4565815B2 (ja) * | 2003-06-27 | 2010-10-20 | 三洋電機株式会社 | 表示装置 |
| JP4737956B2 (ja) * | 2003-08-25 | 2011-08-03 | 東芝モバイルディスプレイ株式会社 | 表示装置および光電変換素子 |
| JP2007524197A (ja) * | 2003-12-15 | 2007-08-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光センサーを備えたアクティブマトリックス型画素デバイス |
| JP4599985B2 (ja) * | 2004-10-21 | 2010-12-15 | セイコーエプソン株式会社 | 光検出回路、電気光学装置、および電子機器 |
| US8300031B2 (en) * | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| US7636078B2 (en) * | 2005-05-20 | 2009-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| US8059109B2 (en) * | 2005-05-20 | 2011-11-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic apparatus |
| JP2007248956A (ja) * | 2006-03-17 | 2007-09-27 | Epson Imaging Devices Corp | 電気光学装置および電子機器 |
| JP2007310628A (ja) * | 2006-05-18 | 2007-11-29 | Hitachi Displays Ltd | 画像表示装置 |
| JP2008122659A (ja) * | 2006-11-13 | 2008-05-29 | Seiko Epson Corp | 液晶表示装置及び液晶表示装置の製造方法並びに電子機器 |
| US8514165B2 (en) * | 2006-12-28 | 2013-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4301297B2 (ja) * | 2007-01-19 | 2009-07-22 | エプソンイメージングデバイス株式会社 | 電気光学装置 |
| CN101625996B (zh) * | 2008-07-08 | 2011-03-23 | 中芯国际集成电路制造(上海)有限公司 | 用以减少暗电流的ono侧墙刻蚀工艺 |
-
2008
- 2008-10-03 JP JP2008258862A patent/JP5275739B2/ja not_active Expired - Fee Related
-
2009
- 2009-09-14 TW TW098130971A patent/TWI406400B/zh not_active IP Right Cessation
- 2009-09-18 US US12/562,317 patent/US8456460B2/en not_active Expired - Fee Related
- 2009-10-01 KR KR1020090093985A patent/KR20100038160A/ko not_active Withdrawn
- 2009-10-09 CN CN2009101794110A patent/CN101714566B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200521540A (en) * | 2003-08-25 | 2005-07-01 | Toshiba Matsushita Display Tec | Display device and photoelectric converter |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010092935A (ja) | 2010-04-22 |
| US20100085339A1 (en) | 2010-04-08 |
| US8456460B2 (en) | 2013-06-04 |
| TW201027726A (en) | 2010-07-16 |
| CN101714566A (zh) | 2010-05-26 |
| CN101714566B (zh) | 2012-01-04 |
| JP5275739B2 (ja) | 2013-08-28 |
| KR20100038160A (ko) | 2010-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |