TWI404153B - Method for managing wafer processing results - Google Patents

Abstract

The present invention provides a method for managing the manufacturing result of the crystal plate on the base that the managing of manufacturing quality is easy when do bulk production and expects that the secular change of the surface quality can be affirmed by eyesight. Every time it makes the formed cutting groove locating at the screening device and do screening and lancing checking (process S108), it correlates the generated cutting groove date and the image information together to the position information and accumulate and store it in the storage installation (process S110), besides, when display the shape of the crystal plate and the mode chart of the dividing prescribed line as the wafer map, it also display the mark which represents the position information of the lancing checking at the wafer map (process S111), it can simultaneously make the cutting groove date and the image information reappear at the display panel with assigning the expected lacing checking position which uses the make.

Description

Wafer processing result management method

The present invention relates to a wafer processing result management method for a processing apparatus such as a cutting device.

A wafer in which a plurality of devices such as ICs and LSIs are formed is formed by polishing a back surface to form a predetermined thickness, and is divided into individual devices by a processing device such as a cutting device, and used for an electronic device such as a mobile phone or a computer. Here, when the wafer is cut by the blade by the cutting device, a notch (tipping) is formed on the cut surface, or it is affected by the thermal deformation of the rotating shaft or the blade, and the kerf is made. The position deviates from the center of the fine line.

Therefore, the cutting device performs the cleavage inspection of the blade at a predetermined timing. The cleavage inspection function to monitor the cutting condition is to capture the kerf cut by the blade with an electron microscope, and to process the image information captured by the image processing, and calculate the measurement value of the cleavage position, which is set in advance by the offset. In the case of the reference position (fine line), it is automatically corrected (aligned with the fine line). Also, the width of the grooving or the size of the collapse is also measured. In the case of such a cleavage inspection, information for the offset (eccentric amount), the grooving width, and the collapse size of the dicing position and the reference value is displayed on the display screen for the operator to check.

[Patent Document 1] Japanese Patent Laid-Open No. 7-130806

However, in the past, in order to perform hair-line matching, a kerf check function was performed, and detailed cleavage inspection data was updated every time the cleavage inspection function was performed, and the analogy data was only recorded. Numerical data. Therefore, in the production management such as the quality confirmation of the mass production project, it is necessary to use the cleavage to check the measurement data, and only extract the gully inspection measurement data from the analog data and output it, which is time consuming. In addition, since there is no image information of the position of the cleavage inspection, it is impossible to reconfirm the indispensable surface quality at the time of management, and it is reliable to use the cleavage inspection measurement data from the viewpoint of quality management. There will be problems in sex.

The present invention has been made in view of the above-described invention, and an object of the invention is to provide a wafer processing result management which can easily manage the processing quality at the time of mass production and can visually confirm the surface quality over time. method.

In order to solve the above problems, a method for managing a wafer processing result according to the present invention includes: a jig table for holding a wafer; and an image capturing means for capturing a wafer held by the jig table; and displaying the image capturing means a display panel for the image to be photographed; and a processing means for processing the wafer held by the jig table; and a processing and transporting means for processing the processing means in the X-axis direction relative to the jig table; and The method for managing the processing result of the wafer processing device of the processing device for dividing and transporting the processing means and the jig table in the Y-axis direction The cutting device includes: a cutting step of forming a cutting groove on the planned dividing line of the wafer by the processing means by the processing means and the dividing conveying means; and the cutting groove cut in the cutting step, periodically or Arbitrarily positioning the imaging means to capture the cutting groove to generate image information and generate cutting groove data, and to associate with the position information indicating the position of the imaging means and the wafer by XY coordinates, and to perform the cutting information and the cutting The groove data is memorized in a memory step of the memory means; and a pattern diagram of the shape of the wafer and the planned line of division is displayed in a wafer map on the display panel, and a display indicating the mark of the position information memorized in the memory step is displayed And repeating the reproduction step of the display panel by specifying the image information displayed on the display step and the corresponding image information and the cutting groove data.

In the above invention, the ID information of the specific wafer is memorized together with the wafer map of each wafer and the image information of the wafer and the wafer information of the cutting groove data. In the memory means, the wafer information of the corresponding wafer is outputted to the display panel by the memory means according to the specified ID information.

In the above-described invention, the information stored in the memory step and the display step is stored in a memory medium having a transportability.

In the above-described invention, the cutting groove data is an amount of deviation between the fine marking line indicating the center position of the imaging means and the center of the cutting groove.

A method for managing a processing result of a wafer according to the present invention, in the above invention In the above, the cutting groove data includes any one of the width of the cutting groove and the size of the chipping.

According to the method for managing the processing result of the wafer according to the present invention, each of the groove inspections is performed by positioning the formed cutting groove at the image capturing means, and the generated cutting groove data is related to the position information and the portrait information. Since the memory is accumulated together in memory, it is easy to manage the processing quality during the mass production of a plurality of wafers, and the image information is also memorized for each cleavage inspection. A pattern diagram showing the shape of the wafer and the planned line to be divided, and a symbol indicating the position information of the cleavage inspection is also displayed on the wafer map, and the desired cleavage inspection portion is easily judged by using the symbol By designating and reproducing the image information together with the cutting groove data on the display panel, it is possible to visually confirm the change in the surface quality over time during processing or after processing, and it is also possible to use it for processing in the back. Effect.

Moreover, by the method for managing the processing result of the wafer of the present invention, it is possible to continuously process a plurality of wafers, for example, in the form of wafers, and the ID information of the specific wafer, and the crystal of each wafer. The wafer information of the circular image and the image information and the cutting groove data are memorized together in the memory means, and the wafer information of the corresponding wafer is output to the display panel by the memory means according to the specified ID information, about the same wafer If the desired wafer is processed, if the ID information of the wafer is specified when desired, the effect of the cleavage inspection result including the portrait information can be reappeared on the display panel. .

[Best form for carrying out the invention]

Hereinafter, a method for managing a processing result of a wafer for carrying out the best mode of the present invention will be described with reference to the drawings.

1 is a schematic perspective view showing a configuration example of a processing apparatus for carrying out a wafer processing result management method according to an embodiment of the present invention, and FIG. 2 is a plan view showing a configuration example of a wafer to which the present embodiment is applied. The figure is a schematic front view showing a configuration example of a processing means and the like. The processing apparatus 10 of the present embodiment is applied to a double-cutting type cutting apparatus that cuts the wafer W along a predetermined dividing line, and basically has a configuration in which the jig table 11 holding the wafer W, the imaging means 12, and the display are provided. The panel 13, the processing means 14, the processing conveyance means 15, the division conveyance means 16 (refer to FIG. 3), the conveyance/transport means 17, the conveyance means 18, the washing means 19, and the conveyance means 20.

First, as shown in FIG. 2, the wafer W is adhered to the surface of the tape T attached to the frame F of the ring shape, and is supported by the wafer frame 21 in a state of being supported by the annular frame F via the tape T. . Here, one wafer 21 can hold, for example, 25 wafers W, and the two wafers 21 are stacked in two stages, and can accommodate up to 50 wafer W sets. As shown in FIG. 2, the wafer W is formed by dividing a plurality of predetermined lines S in a lattice shape on the surface Wa to form a plurality of regions, and a semiconductor wafer 22 such as an IC or an LSI is formed in the region of the region. The wafer W thus constituted is attached to the tape T attached to the frame F of the ring shape, and is adhered to the back surface with the surface Wa as the upper side.

The carry-out/porting means 17 transports the wafer W accommodated in the wafer 21, carries the mounting area which can be conveyed by the conveyance means 18, and carries the cut-processed wafer W to the wafer 21. The transport means 18 transports the wafer W transported out of the mounting area to the jig table 11 by the carry-out/porting means 17. Further, the cleaning means 19 cleans the wafer W which has been processed by the processing means 14. The transport means 20 transports the wafer W that has been processed by the processing means 14 from the jig table 11 to the cleaning means 19.

The jig table 11 is coupled to a drive source (not shown) and is rotatable. In addition, the jig table 11 is provided so as to be movable in the X-axis direction by a machining conveyance means 15 having a known configuration such as a screw, a nut, or a pulse motor, and the wafer W to be mounted is processed. 14 is relatively processed in the X-axis direction.

The imaging means 12 is an electron microscope equipped with a CCD camera or the like for photographing the surface Wa of the wafer W held by the jig table 11, and is used for alignment and grooving inspection. Here, in the case of alignment, the area to be cut is detected based on the image information acquired by the imaging means 12, and the positioning operation by the processing means 14 is performed. Further, in the case of the grooving inspection, the cut groove is positioned at the imaging position of the imaging device 12, and the cutting groove is imaged to generate image information, and the cutting groove data generated by the image processing is provided.

The processing means 14 is formed by cutting the extremely thin cutting edges 22a, 22b of the wafer W held by the jig table 11 at the same time or separately along the dividing line S as shown in Fig. 3. The double machining cutting configuration, the cutting edges 22a, 22b are provided with a pair of rotating shafts 23a, 23b installed at the front end . The pair of rotating shafts 23a and 23b are arranged on the same straight line so as to be parallel to each other, and can be independently driven by the cutting and conveying means 24a and 24b of a screw, a nut, a pulse motor or the like. The movement in the Z-axis direction is set. Further, the divided transport means 16 for dividing and transporting the processing means 14 in the Y-axis direction with respect to the jig table 11 is an individual divided transport mechanism 16a for dividing and transporting the cutting edges 22a and 22b individually in the Y-axis direction, 16b and the entire divided transport mechanism 16c that divides and transports the entire processing means 14 in the Y-axis direction, and the individual divided transport mechanisms 16a and 16b and the entire divided transport mechanism 16c are: a screw, a nut, and a pulse motor. Waiting for it to form.

The display panel 13 is disposed at a position that is easy to view and easy to operate in the processing apparatus 10, and is used to display various information required for processing and the like in addition to the image taken by the image pickup means 12, and is also used for processing. The touch panel of the operation panel displayed by the button of the input operation required for processing, etc.

In the processing apparatus 10 having such a configuration, the cutting blades 22a and 22b that rotate at a high speed are cut into the wafer W at a predetermined depth of cut, and the processing means 14 is relatively processed in the X-axis direction by the processing conveyance means 15 The jig table 11 simultaneously cuts two planned dividing lines S on the wafer W to form a cutting groove (cutting groove). Then, for example, the cutting edges 22a and 22b are used by the outer peripheral side of the wafer W toward the inner peripheral side (or the opposite inner peripheral side toward the outer peripheral side), and the dividing and conveying means 16 are sequentially used at intervals of the dividing line S. The conveyance is relatively divided in the Y-axis direction, and the cutting grooves can be formed for all the division planned lines S (channels 1) in the same direction. It After that, the wafer W is rotated by 90° by the rotation of the jig table 11, and the same cutting process is repeated by the processing means 14 for all the planned dividing lines S (channels 2) arranged in the X-axis direction. The semiconductor body 22 can be divided into individual pieces.

Next, the configuration of the control system in which the processing apparatus 10 of the present embodiment is incorporated will be described. Fig. 4 is a schematic block diagram showing a configuration example of the control unit 30 in which the processing apparatus 10 of the embodiment is incorporated. The controller 30 is mainly constituted by a microprocessor 31 and a memory means 32 that are controlled by a calculation processing device including a CPU or the like, or a processing device 10 such as a ROM or a RAM. The processing means 14, the processing transport means 15, the divided transport means 16, and the cut-in transport means 24a, 24b are connected to the microprocessor 31, and the microprocessor 31 controls the operation of the machining operation or the like. Further, in the microprocessor 31, the display information necessary for the display panel 13 is read by the memory means 32 or the panel display pattern memory unit 33, and the display content is controlled by the display control unit 34, and is analyzed on the display panel 13 The input information of the operation indicated above is provided to provide motion control, display control, and the like of each part.

Further, the microprocessor 31 controls the imaging operation at the time of alignment or cleavage inspection by the imaging means 12, and performs processing control of the image information captured by the imaging means 12. In the processing control of the image information, the image information captured by the image capturing means 12 is still stored in the memory means 32, or the image processing unit 35 performs image processing on the image information to generate the cutting groove data and the like. The cutting groove data and the like are memorized in the control of the memory means 32. Here, the image processing according to the image processing unit 35 is performed. In the present embodiment, the generated cutting groove data includes a fine line deviation amount [mm] indicating the amount of deviation between the fine marking line indicating the center position of the imaging means 12 and the center of the formed cutting groove, and indicates that the cutting groove data is formed. The width of the cutting groove [mm], the maximum value of the collapse of the size of the collapse [mm], and the area [pix]. Further, the external connection port 36 is provided with a memory medium 37 which is detachably provided with data which can be downloaded and memorized in the memory means 32 and which is portable. In the present embodiment, the memory medium 37 uses, for example, a USB memory.

Further, the memory means 32 includes a data memory unit 32a, an image memory unit 32b, and a wafer memory unit 32c. The portrait memory unit 32b is for storing portrait information having a large amount of information. In the present embodiment, the image information captured by the imaging means 12 is sequentially stored every time the cleavage inspection is performed. The wafer pattern memory unit 32c has a contour shape (circular shape) of each wafer W which is generated in advance in order to confirm the progress of cutting by the cutting edges 22a (Z1 axis) and 22B (Z2 axis) on the workpiece image. The pattern diagram of the division planned line S is stored as a material of the wafer map in the channel of each wafer W.

The data memory portion 32a is mainly used to store numerical data formed by the cutting groove data according to the cleavage inspection. In the present embodiment, the fine line offset amount [mm], the cutting groove width [mm], the collapse maximum value [mm], and the region [pix] are stored in the data memory portion 32a as each time. The grooving inspection is performed on the image information captured by the image capturing means 12 by the image processing unit 35, and the cutting groove data calculated by the measurement result obtained by the image processing is performed.

Here, in the present embodiment, in order to correspond to the maximum amount of two crystals, 50 The wafer of the slice is set in the data memory 32a as shown in Fig. 5, and is set to be: wafer bar a, wafer ID column b, channel column c, cleavage check coordinate (X, Y) column d , fine line offset column e, cutting groove width column f, collapse maximum column g, collapse range column h, cleavage inspection image indicator column i, and wafer map indicator column j, and memory every groove Check the data corresponding to each column. That is, the position information shown in the XY coordinates (the relative coordinates of the center of any of the X and Y coordinate systems) is stored in the cleavage check coordinate (X, Y) column. d, in relation to the position information, the cutting data is memorized in the corresponding columns e, f, g, h, and further, in order to specify the corresponding portrait information, the memory is indicated in the slash inspection image indicator column I. The indicator of the storage of the image information on the image memory unit 32b shown in FIG. 6 is further stored in the wafer map indicator column j in order to specify the corresponding wafer map, as shown in FIG. An indicator of the storage location of the wafer map data on the wafer memory portion 32c.

Further, in order to obtain the correspondence of the cutting groove data, the wafer ID information specifying the ID information of each wafer, the data related to the wafers and the channels are also recorded in the maximum of 50 wafers. Columns a, b, c. Here, the wafer ID information is, for example, a wafer number that is accommodated in two wafers 21 and sequentially numbered from top to bottom (or in reverse order). For the wafer 21, the upper segment is 1 and the lower segment is 2 (or vice versa)

Next, the processing result management method of the wafer in accordance with the cutting operation operation along the line dividing line of the wafer W executed by the microprocessor 31 will be described with reference to Figs. 8 to 12 . Figure 8 shows the cut FIG. 9 is a schematic flow chart showing an example of the processing of the dicing information display interruption in the processing of the eighth drawing, and FIG. 10 is a flowchart showing the processing in the processing of the dicing information display interrupting the processing of FIG. FIG. 11 is a schematic front view showing a display example of the display panel 13 in the cleavage inspection data display, and FIG. 12 is a display panel 13 for selecting a cleavage inspection result. A schematic front view of the display example.

First, before the processing, the device data is created for each wafer W, and it is judged whether or not the condition setting (step S101) for creating the device data is ended. At this time, in addition to the processing conditions for the wafer W or the data for automatic alignment, the data type to be input includes the setting of the cleavage inspection data. The setting of the cleavage inspection data includes a grooving inspection for a plurality of lines dividing the predetermined line S, or a cleavage inspection for each channel 1/2. In the present embodiment, for example, 1/2 of each channel and each wafer W are set, and dicing inspection is performed periodically at two places on the third line from the outer peripheral side of the wafer W.

When the condition setting is completed (step S101, Yes), it is determined whether or not the semi-automatic button displayed on the start screen of the display panel 13 is pressed (step S102), and if pressed (step S102, Yes), that is, along the division The predetermined line S is moved to a semi-automatic operation that automatically performs cutting.

First, the wafer W to be subjected to the cutting process is carried from the wafer 21 to the jig table 11 (step S103). Then, the wafer W to be carried is positioned at the imaging device 12 and imaged, and based on the image information acquired by the imaging device 12, the planned dividing line S to be cut is detected and executed. The automatic alignment (processing position identification) processing of the division transport means 16 is performed (step S104). This processing is performed for channels 1 and 2. Then, the cutting conveyance means 24a, 24b and the machining conveyance means 15 are actuated, and the cutting process of the cutting groove by the cutting edges 22a, 22b is performed on the target division line S (step S105; cutting step).

In such processing, the wafer pattern is set in the line mode, and the wafer map is displayed on the display panel 13 (step S106). Referring to Fig. 10 showing a display example in the processing, the dicing image button 41a, the checkpoint button 41b, the wafer map button 41c, and the XIS (shown in the peripheral portion of the main panel 41 of the display panel 13 are disposed). The extended interface system button 41d, the workpiece mode button 41e, the line mode button 41f, the upper reel button 41g, the lower reel button 41h, the cutting-time stop button 41i, the cleavage inspection data display button 41j, and the like are displayed for inspection. The wafer button line pattern of the dot button 41b, the wafer map button 41c, the line mode button 41f, and the groove inspection material display button 41j, and the wafer pattern of the wafer pattern line pattern are displayed in the center of the main region 41. 42. The wafer pattern 42 is a pattern diagram showing the shape (circular shape) of the wafer W and the predetermined dividing line (a plurality of horizontal lines), and the cutting of the cutting edges 22a and 22b on the wafer image can be visually observed. situation. In the example of the drawing, on the wafer pattern 42, a region 42a indicated by oblique lines is a cut-completed region indicating a planned dividing line S by the cutting edge 22a (Z1 axis), and a region 42b indicated by a different oblique line is applied. It is a cut-completed area indicating the planned dividing line S by the cutting edge 22b (Z2 axis) (actually, for example, the area 42a is represented by a blue display, and the area 42b is represented by a green display, and the uncut division is performed. The predetermined line S is presented in gray.

Further, in Fig. 10, the dicing image button 41a selects whether or not the button for capturing the image of the imaging means 12 is displayed only on the background of the main area 41 during the cutting operation. The checkpoint button 41b selects a button to be displayed on the line of the wafer map 42 displayed on the main area 41. In the present embodiment, the display position information is formed on the line (divided line) on which the cleavage inspection is performed. The mark, for example, is set to display a star mark. The wafer map button 41c is switched to a button indicating the mode of the wafer map, and the XIS button 41d is a button for switching the imaging means 12 to the XIS mode display for performing focus adjustment or the like during the stop of the cutting operation. The workpiece mode button 41e is used in the wafer map mode, and is used to search for a mode setting button such as a target for the teaching of automatic alignment, and the line mode button 41f is displayed as shown in FIG. The mode setting button of the wafer map 42 is shown. The upper reel button 41g is a button for moving the selection line on the wafer pattern 42 to a line when the cutting operation is stopped, and the lower reel button 41h is for selecting the wafer pattern 42 when the cutting operation is stopped. The line moves to the button below a line. The cleavage inspection data display button 41j is a button for displaying detailed information on the selected line on the wafer map 42.

Further, in Fig. 10, the lower column area of the display panel 13 is provided with, for example, a soft keyboard area 44 of the function keys F1 to F10 which are switched by the software in accordance with the operation of the four function switching buttons 43.

Then, in the predetermined division planned line S, the cleavage inspection line of the division planned line S is set in advance after the cutting process (step S107, Yes), and the position of the jig table 11 is moved to be formed in the division plan. Line s The cutting groove is positioned in the imaging means 12, and the cutting groove is imaged by the imaging means 12, and the grooving inspection process is performed (step S108). In other words, the image forming means 12 captures the image information of the cutting groove, and the image information is image-processed by the image processing unit 35 to generate the cutting groove data (fine line offset amount, cutting groove width, collapse maximum value, and In the collapsed area, positional information indicating the positional relationship between the imaging means 12 and the wafer W for performing the dicing inspection is generated by the XY coordinates. The image information of the dicing inspection position thus generated, the cutting groove data, and the like are displayed on the main area 41 of the display panel 13 (step S1O9). The display of this case is the same as the case of Fig. 11 which will be described later.

Further, the image information of the current image and the position information of the cutting groove data indicating the cleavage inspection by the XY coordinates are stored in the memory means 32 (step S110; memory step). At this time, the information on the wafer W in the cutting process of the cutting groove acquires the type of the wafer 21 to be supplied, the wafer ID, and the channel information. As shown in FIG. 5, the wafer ID is used. The second portrait information, the cutting groove data, and even the wafer map information are memorized in the memory means 32. In the memory of such information, image information or wafer map information having a large amount of information is stored in the image memory unit 32b or the wafer memory unit 32c as shown in FIGS. 6 and 7, respectively. The memory unit 32a stores index information indicating the storage location on the image memory unit 32b or the wafer memory unit 32c, and is related to the location information.

Further, in the dicing inspection position displayed on the dividing line (cutting groove) of the dicing inspection of the wafer pattern 42 of the display panel 13, the dicing inspection mark 45 of the star mark is displayed (step) (step) S111; Show step).

Then, in the case of the non-cutting inspection line (No in step S107), it is determined whether or not the formation of the cutting groove for all the planned dividing lines S for the channel 1 is completed (step S112), and if it is not finished (step) S112, No), returning to the cutting processing for the subsequent division planned line S (step S105).

If the processing of the channel 1 portion is completed (Yes in step S112), that is, it is judged whether or not the processing of the channel 2 portion is finished (step S113), and if it is not finished (step S113, No), it is judged whether or not the wafer W has been rotated. 90° (step S114). When the 90° rotation is not completed (step S114, No), the channel 1 is updated and recorded in the wafer map memory portion 32c with the corresponding wafer map information (step S115), and the jig table 11 is rotated by 90°. The wafer W is rotated by 90° (step S116). In step S115, all the lines are cut and the data of the wafer pattern 42 of the mark 45 is given at the grooving inspection, and is stored and stored in the wafer map memory portion 32c. When the wafer W is rotated by 90° or rotated by 90° (step S114, Yes, step S116), the wafer W is returned to the cutting process for the channel 2 (step S105).

If the processing of the channel 2 portion is completed (Yes in step S113), the channel 2 is updated and recorded to the wafer map memory portion 32c by the corresponding wafer map information (step S117). That is, all the lines are cut and the data of the wafer pattern 42 of the mark 45 is given at the dicing inspection, and is stored and stored in the wafer memory portion 32c.

Thereafter, the wafer W that has been subjected to the cutting process is attached from the jig table 11. It is carried out, and is carried into the wafer 21 through a washing process or the like (step S118). Next, it is judged whether or not the unprocessed wafer W remains in the wafer 21 (step S119), and if there is any remaining (step S119, Yes), the above-described processes of steps S103 to S118 are similarly repeated. Then, when all the wafers W in the wafer 21 are subjected to the cutting process and the unprocessed wafer W is not left in the wafer 21 (step S119, No), a series of semi-automatic processes are ended.

Further, in the series of processes, once the operator instructs the data storage of the external memory medium 37 at the desired timing, the memory data stored in the memory means 32 is archived in the additional memory medium 37.

When the processing is completed, the data memory unit 32a, the image memory unit 32b, and the wafer memory unit 32c are stored as shown in Figs. 5 to 7 to store the result of the cleavage inspection for all the cleavage inspection points. The status of the wafer information. If it is in the middle of processing, the state of the wafer information about the results of the trench inspection of all the trench inspection sites before the stage is stored.

Next, an example of the interruptible grooving information display interruption processing in the processing processing shown in Fig. 8 or at any time after the processing is explained with reference to Fig. 9. For example, in the display of the wafer pattern 42 shown in FIG. 10, the line on the extension line in the x direction of the position where the finger 46 contacts is selected when the finger 46 comes into contact with the inside of the main area 41 outside the wafer pattern 42. In this way, the division planned line S (cutting groove) can be selected, and when the predetermined icon display symbol 45 is divided into the predetermined line S (cutting groove), the cleavage inspection line is selected. The line selection can also be the operation of the upper reel button 41g or the lower reel button 41h. The selected line is indicated, for example, in red.

Then, it is monitored whether or not there is a selection instruction of the groove inspection line (step S201), and in the case of the selection instruction of the division planned line S (cutting groove) having the icon display symbol 45 (step S201, Yes), the icon is displayed. The data in the memory means 42 is searched based on the position information (X, Y) of the groove inspection position of the symbol 45, and the corresponding key image information is read from the image memory unit 32b and reproduced on the main area 41 ( Step S202: regeneration step). Further, it is determined whether or not the cleavage inspection data display button 41j for detailed display is pressed (step S203). When it is pressed (step S203, Yes), the correspondence is read from the data storage unit 32a of the memory means 32. The cutting groove data of the position information is inspected by the cutting of the indication, and is reproduced and displayed on the main area 41 (step S204: regeneration step).

Referring to Fig. 11 showing a display example of the display panel 13 in the cleavage inspection data display, the portrait information 51 of the result of the grooving inspection by the imaging means 12 is displayed in the main area 41. The portrait information 51, 51a indicates a semiconductor wafer portion, 51b indicates a cutting groove generated by cutting a predetermined dividing line, 51c indicates a fine marking line at the center of the imaging means 12, and 51d indicates a cutting groove center. Further, the cutting groove data is represented by a part of the portrait information 51 that avoids the cutting groove portion. Further, the right side of the portrait information 51 indicates, for example, the cutting result of the cutting of the first line, the cutting start position on the X-axis, the cutting end position on the X-axis, the Y coordinate at the time of cutting, the blade height, and the conveying speed. The result shows column 52. Further, the upper portion of the result display column 52 indicates that the information currently displayed is the result of using the cutting edge 22a (Z1 axis) or the Z1 axis/Z2 axis display field 53 as a result of the cutting edge 22b (Z2 axis).

When the cleavage inspection data display button 41j is pressed again (Yes in step S205), the original wafer map display state as shown in Fig. 10 is returned (step S206).

On the other hand, for example, in the display of the wafer map 42 shown in FIG. 10, whether or not the cleavage check result button assigned to the function button F1 among the function keys F1 to F10 of the software keyboard area 44 is pressed is pressed ( In step S207), when the cleavage inspection result button is pressed (Yes in step S207), the grooving inspection result shown in Fig. 12 is selected and displayed on the display panel 13 (step S208). That is, in order to select the desired wafer 21, wafer W, and channel, the wafer selection operation column 61a, the wafer ID selection operation column 61b, and the channel selection operation column 61c are displayed. 61d is a display button for indicating display processing, and 61e is used to return to the exit button of the general display as shown in FIG.

Then, in the operations related to the wafer selection operation column 61a, the wafer ID selection operation column 61b, and the channel selection operation column 61c, the desired wafer 21, wafer ID, and channel selection instruction are provided (step S209, Yes). Once the display button 61d is pressed (Yes in step S210), the wafer map information corresponding to the wafer 21 of the selected indication, the wafer ID, and the wafer W of the channel is read from the memory means 32, and is in the main area. The wafer map 42 is displayed (step S211). The wafer pattern 42 shown in Fig. 12 shows a display example corresponding to the entire processed wafer W, and is divided into two by regions 42a and 42b. Further, the symbol 45 indicating the cleavage inspection position is also reproduced and displayed.

Then, when the exit button 61e is pressed (step S212, No), the process returns to the determination process of step S201, and the wafer map displayed in the main area 41 is displayed. The selection of the cleavage inspection line of 42 can be targeted to the position of the mark 45. That is, steps S201 to S204 as described above can be processed. Thereby, it is possible to reproduce the grooving inspection result of the already processed wafer W carried into the wafer 21 as needed, including the image.

As described above, according to the present embodiment, each of the groove inspections is performed by positioning the formed cutting groove on the imaging means 12, and the generated cutting groove data is associated with the position information and accumulated together with the image information. Since the memory means 32 is stored, it is easy to manage the processing quality at the time of mass production of the continuous processing of the plurality of wafers W. In addition, since the image information is also memorized in each dicing inspection, the pattern of the wafer and the pattern of the planned dividing line are displayed on the wafer map 42, and the symbol 45 indicating the position information of the grooving inspection is also displayed together. On the wafer pattern 42, the image information is reproduced on the display panel 13 together with the cutting groove data by using the designation of the desired cleavage inspection position which is easily judged by the mark 45, so that it is expected during processing or after processing. In time, it is possible to visually confirm the change in the surface quality over time, and it can also be used for processing which is reflected later. In particular, a plurality of wafers W are processed continuously in units of wafers 21, and wafer maps, image information of each wafer W, and wafer information of the cutting trench data are all stored together with the ID information of the designated wafer W. The memory means 32 outputs the wafer information of the wafer W corresponding to the specified ID information to the display panel 13 by the memory means 32, and the processed wafers in the same wafer 21 are processed. If the ID information of the wafer is specified as desired, the cleavage inspection result including the portrait information can be reappeared on the display panel 13.

Further, according to the present embodiment, various kinds of information including the image information stored in the memory means 32 are also stored in the memory medium 37 such as a USB memory, and a desired computer or the like other than the processing apparatus 10 can be used in any At the time, the result of the cleavage inspection including the portrait information appears again.

Further, in the present embodiment, the application example of the double-machining type processing apparatus will be described, but the same applies to the step cutting in which the same division line is cut and processed in two stages using two cutting edges. A type of processing device or a single processing and cutting type processing device using one cutting edge.

Further, the present invention is not limited to the case where the cleavage inspection process is performed periodically, and the same applies to the case of the randomization method. Moreover, the timing and number of times of the grooving inspection process can be changed for each channel or each wafer. Further, the wafer 21 is not limited to the case where the two stages overlap, and it is also possible to use only one wafer 21. Further, the memory medium 37 is not limited to the USB memory, and various other types of memory media such as CD-R and DVD-R can be used, and a corresponding driving device can be used. Further, the memory medium 37 may transfer the information of the memory means 32 to an external computer or the like for memory management using a wired/wireless LAN.

W‧‧‧ wafer

10‧‧‧Processing device

11‧‧‧Clamping table

12‧‧‧Photography

13‧‧‧ display panel

14‧‧‧Processing means

15‧‧‧Processing means

16‧‧‧Divided means of transport

17‧‧‧Transfer/port means

18‧‧‧Transportation means

19‧‧‧ Washing means

20‧‧‧Transportation means

21‧‧‧Crystal

22a, 22b‧‧‧ cutting edge

23a, 23b‧‧‧ shaft

24a, 24b‧‧‧cutting means

31‧‧‧Microprocessor

32‧‧‧ memory means

32a‧‧‧Data Memory Department

32b‧‧‧Portrait Memory Department

32c‧‧‧ Wafer Memory

33‧‧‧ Panel display pattern memory

34‧‧‧Display Control Department

35‧‧‧Portrait Processing Department

36‧‧‧External connection埠

37‧‧‧Memory Media

41‧‧‧Main area

41a‧‧‧cutting image button

41b‧‧‧Checkpoint button

41c‧‧‧ wafer map button

41d‧‧‧XIS (Extended Interface System) button

41e‧‧‧Workpiece mode button

41f‧‧‧Line mode button

41g‧‧‧Upper scroll button

41h‧‧‧Reel button

41i‧‧‧ stop button when cutting

41j‧‧‧cutting inspection data display button

42‧‧‧ wafer map

42a, 42b‧‧‧ area

45‧‧‧ icon shows the mark

46‧‧‧ fingers

51‧‧‧Portrait Information

51a‧‧‧Semiconductor chip section

51b‧‧‧Cutting trench

51c‧‧‧fine marking line

51d‧‧‧ cutting groove center

52‧‧‧ Results display

53‧‧‧Z1 axis/Z2 axis display bar

61a‧‧‧Crystal selection operation bar

61b‧‧‧ wafer ID selection operation bar

61c‧‧‧Channel selection operation bar

61d‧‧‧ display button

61e‧‧‧Exit button

F‧‧‧Frame

T‧‧‧ Tape

S‧‧‧ dividing line

Wa‧‧‧ surface

1 is a schematic perspective view showing a configuration example of a processing apparatus that performs a method of managing a processing result of a wafer according to an embodiment of the present invention.

Fig. 2 is a plan view showing a configuration example of a wafer to which the embodiment is applied.

Fig. 3 is a schematic front view showing a configuration example of a processing means and the like.

Fig. 4 is a schematic block diagram showing a configuration example of a control unit in which the processing apparatus of the embodiment is incorporated.

Fig. 5 is an explanatory diagram showing a data storage example of the data memory unit in the mode.

Fig. 6 is an explanatory diagram showing a data storage example of the image memory unit in the mode.

Fig. 7 is an explanatory diagram showing a data storage example of the wafer map memory unit in a mode.

Fig. 8 is a schematic flow chart showing a method of managing the processing result of the wafer in accordance with the cutting operation.

Fig. 9 is a schematic flow chart showing an example of the cleavage information display interruption processing which can interrupt the processing of Fig. 8.

Fig. 10 is a schematic front view showing a display example of a display panel in a processing process.

Fig. 11 is a schematic front view showing a display example of the display panel in the cleavage inspection data display.

Fig. 12 is a schematic front view showing a display example of a display panel for selecting a cleavage inspection result.

Claims (4)

A method for managing a processing result of a wafer, comprising: a chucking station for holding a wafer; and an image capturing means for capturing a wafer held on the fixture table; and a display panel for displaying an image taken by the image capturing means; and processing a processing means for holding the wafer on the jig table; and a processing conveyance means for processing the processing means in a direction opposite to the jig table in the X-axis direction; and the processing means and the jig table are opposite to the Y The wafer processing result management method of the processing apparatus of the dividing and conveying means for dividing and conveying in the axial direction is characterized in that the processing means and the dividing conveying means are actuated, and the dividing line of the wafer is formed by the processing means Forming a cutting step of the cutting groove; and positioning the cutting groove cut in the cutting step periodically or randomly on the image capturing means, and photographing the cutting groove to generate image information, and generating cutting groove data, and The coordinates indicate that the image capturing means is related to the position information of the position of the wafer, and the image information is cut out as described above. The grooving data is memorized in a memory step of the memory means; and a pattern diagram of the shape of the wafer and the predetermined line of division is displayed in a wafer map on the display panel, and a symbol indicating the position information stored in the memory step is displayed a display step; and designating, in the display step, the corresponding image information and the cutting groove data to be reproduced in the reproducing step of the display panel, wherein the cutting groove data includes a center position indicating the image capturing means The offset of the fine marking line and the center of the cutting groove, the wafer pattern shows the progress of the cutting in a visual manner. The wafer processing result management method according to the first aspect of the invention, wherein the ID information of the specific wafer, and the wafer pattern and the image information for each wafer and the wafer of the cutting groove data are used. The information is stored together in the memory means, and the wafer information of the corresponding wafer is outputted to the display panel by the memory means according to the specified ID information. The wafer processing result management method according to the first or second aspect of the invention, wherein the information stored in the memory step and the display step is stored in a memory medium having a transportability. The wafer processing result management method according to the first aspect of the invention, wherein the cutting groove data includes any one of a width of the cutting groove and a size of the chipping.