TWI399420B - Circuit connecting adhesive film, connection structure and a manufacturing method - Google Patents

Circuit connecting adhesive film, connection structure and a manufacturing method Download PDF

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Publication number
TWI399420B
TWI399420B TW097114352A TW97114352A TWI399420B TW I399420 B TWI399420 B TW I399420B TW 097114352 A TW097114352 A TW 097114352A TW 97114352 A TW97114352 A TW 97114352A TW I399420 B TWI399420 B TW I399420B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
circuit
circuit member
connection
connection terminal
Prior art date
Application number
TW097114352A
Other languages
English (en)
Chinese (zh)
Other versions
TW200911950A (en
Inventor
有福征宏
望月日臣
小林宏治
中澤孝
小島和良
廣澤幸壽
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW200911950A publication Critical patent/TW200911950A/zh
Application granted granted Critical
Publication of TWI399420B publication Critical patent/TWI399420B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
TW097114352A 2007-04-19 2008-04-18 Circuit connecting adhesive film, connection structure and a manufacturing method TWI399420B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
TW200911950A TW200911950A (en) 2009-03-16
TWI399420B true TWI399420B (zh) 2013-06-21

Family

ID=40147951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097114352A TWI399420B (zh) 2007-04-19 2008-04-18 Circuit connecting adhesive film, connection structure and a manufacturing method

Country Status (4)

Country Link
JP (1) JP5181220B2 (cg-RX-API-DMAC10.html)
KR (1) KR101139073B1 (cg-RX-API-DMAC10.html)
CN (2) CN101611659B (cg-RX-API-DMAC10.html)
TW (1) TWI399420B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1149152A (ja) * 1997-08-08 1999-02-23 Hitachi Kasei Fuirutetsuku Kk 包装用ラップフィルムの収納ケース
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
JP3915512B2 (ja) * 2000-04-25 2007-05-16 日立化成工業株式会社 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1149152A (ja) * 1997-08-08 1999-02-23 Hitachi Kasei Fuirutetsuku Kk 包装用ラップフィルムの収納ケース
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Also Published As

Publication number Publication date
CN102638944B (zh) 2014-12-10
CN101611659B (zh) 2012-05-23
JP5181220B2 (ja) 2013-04-10
KR20100002284A (ko) 2010-01-06
TW200911950A (en) 2009-03-16
CN101611659A (zh) 2009-12-23
KR101139073B1 (ko) 2012-04-30
JP2008288551A (ja) 2008-11-27
CN102638944A (zh) 2012-08-15

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