TWI396774B - A substrate manufacturing method and a copper surface treatment agent used therefor - Google Patents

A substrate manufacturing method and a copper surface treatment agent used therefor Download PDF

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Publication number
TWI396774B
TWI396774B TW097108875A TW97108875A TWI396774B TW I396774 B TWI396774 B TW I396774B TW 097108875 A TW097108875 A TW 097108875A TW 97108875 A TW97108875 A TW 97108875A TW I396774 B TWI396774 B TW I396774B
Authority
TW
Taiwan
Prior art keywords
copper
compound
solder resist
copper alloy
barrier layer
Prior art date
Application number
TW097108875A
Other languages
English (en)
Chinese (zh)
Other versions
TW200840883A (en
Inventor
Mutsuyuki Kawaguchi
Original Assignee
Mec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Co Ltd filed Critical Mec Co Ltd
Publication of TW200840883A publication Critical patent/TW200840883A/zh
Application granted granted Critical
Publication of TWI396774B publication Critical patent/TWI396774B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW097108875A 2007-04-02 2008-03-13 A substrate manufacturing method and a copper surface treatment agent used therefor TWI396774B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007096682 2007-04-02
JP2007097741A JP4364252B2 (ja) 2007-04-02 2007-04-03 基板の製造方法及びこれに用いる銅表面処理剤

Publications (2)

Publication Number Publication Date
TW200840883A TW200840883A (en) 2008-10-16
TWI396774B true TWI396774B (zh) 2013-05-21

Family

ID=40013096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097108875A TWI396774B (zh) 2007-04-02 2008-03-13 A substrate manufacturing method and a copper surface treatment agent used therefor

Country Status (4)

Country Link
JP (1) JP4364252B2 (ko)
KR (1) KR101084815B1 (ko)
CN (1) CN101280426B (ko)
TW (1) TWI396774B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5571938B2 (ja) * 2009-11-17 2014-08-13 日本パーカライジング株式会社 銅材料の下地処理方法および下地処理被膜付き銅材料
JP5940843B2 (ja) * 2012-03-14 2016-06-29 四国化成工業株式会社 銅または銅合金の表面処理剤およびその利用
JP2014185332A (ja) * 2013-02-21 2014-10-02 Fujifilm Corp 酸化防止処理方法、これを用いた電子デバイスの製造方法、及びこれらに用いられる金属防食剤
WO2015037085A1 (ja) * 2013-09-11 2015-03-19 四国化成工業株式会社 銅または銅合金の表面処理剤およびその利用
CN107406578B (zh) * 2014-12-02 2020-12-01 英特尔公司 固化性树脂组合物、固化性树脂成形体、固化物、层叠体、复合体和多层印刷布线板
WO2019082681A1 (ja) * 2017-10-23 2019-05-02 メック株式会社 膜形成基材の製造方法、膜形成基材及び表面処理剤
JP2023043634A (ja) * 2021-09-16 2023-03-29 株式会社東芝 洗浄剤及び半導体装置の製造方法
JP2024065371A (ja) 2022-10-31 2024-05-15 コニカミノルタ株式会社 非感光性表面改質剤、処理液及び積層体
JP2024077030A (ja) 2022-11-28 2024-06-07 コニカミノルタ株式会社 表面改質剤、及びプリント配線板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183505A (ja) * 1998-12-14 2000-06-30 Mitsubishi Gas Chem Co Inc 耐熱性レジスト塗布前の銅箔処理方法
JP2002194573A (ja) * 2000-12-27 2002-07-10 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1024981C (zh) * 1991-02-04 1994-06-08 陈晓旼 粘结铜和树脂的方法
JP3909920B2 (ja) 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
JP4191881B2 (ja) * 2000-08-10 2008-12-03 メルテックス株式会社 銅酸化物還元用の処理液および処理方法
JP4309602B2 (ja) * 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
EP1662020B1 (en) * 2003-07-03 2008-05-14 Mec Company Ltd. Method for producing a copper thin film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183505A (ja) * 1998-12-14 2000-06-30 Mitsubishi Gas Chem Co Inc 耐熱性レジスト塗布前の銅箔処理方法
JP2002194573A (ja) * 2000-12-27 2002-07-10 Mitsubishi Gas Chem Co Inc 銅および銅合金の表面処理剤

Also Published As

Publication number Publication date
CN101280426B (zh) 2011-03-16
JP2008274311A (ja) 2008-11-13
KR20080090272A (ko) 2008-10-08
TW200840883A (en) 2008-10-16
JP4364252B2 (ja) 2009-11-11
CN101280426A (zh) 2008-10-08
KR101084815B1 (ko) 2011-11-21

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