TWI395255B - 工作站間之移送室 - Google Patents

工作站間之移送室 Download PDF

Info

Publication number
TWI395255B
TWI395255B TW095111131A TW95111131A TWI395255B TW I395255 B TWI395255 B TW I395255B TW 095111131 A TW095111131 A TW 095111131A TW 95111131 A TW95111131 A TW 95111131A TW I395255 B TWI395255 B TW I395255B
Authority
TW
Taiwan
Prior art keywords
workstation
chamber
transport
substrate
manufacturing facility
Prior art date
Application number
TW095111131A
Other languages
English (en)
Chinese (zh)
Other versions
TW200644050A (en
Inventor
克林頓哈里斯
Original Assignee
布魯克斯自動機械公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 布魯克斯自動機械公司 filed Critical 布魯克斯自動機械公司
Publication of TW200644050A publication Critical patent/TW200644050A/zh
Application granted granted Critical
Publication of TWI395255B publication Critical patent/TWI395255B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095111131A 2005-03-30 2006-03-30 工作站間之移送室 TWI395255B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/093,480 US9099506B2 (en) 2005-03-30 2005-03-30 Transfer chamber between workstations

Publications (2)

Publication Number Publication Date
TW200644050A TW200644050A (en) 2006-12-16
TWI395255B true TWI395255B (zh) 2013-05-01

Family

ID=37054076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111131A TWI395255B (zh) 2005-03-30 2006-03-30 工作站間之移送室

Country Status (6)

Country Link
US (1) US9099506B2 (https=)
JP (2) JP5751690B2 (https=)
KR (2) KR101567917B1 (https=)
CN (1) CN101189713B (https=)
TW (1) TWI395255B (https=)
WO (1) WO2006105195A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8531678B2 (en) * 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
DE102008062080A1 (de) * 2008-12-12 2010-06-17 Karlsruher Institut für Technologie Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
US8974601B2 (en) 2011-07-29 2015-03-10 Semes Co., Ltd. Apparatuses, systems and methods for treating substrate
JP5923288B2 (ja) * 2011-12-01 2016-05-24 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理装置の運転方法
SG11202009105YA (en) * 2018-03-20 2020-10-29 Tokyo Electron Ltd Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
SG11202009243SA (en) * 2018-03-23 2020-10-29 Brooks Automation Inc Automated cryogenic storage and retrieval system
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
JP2024131483A (ja) * 2023-03-16 2024-09-30 キオクシア株式会社 半導体製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5695564A (en) * 1994-08-19 1997-12-09 Tokyo Electron Limited Semiconductor processing system
US20040105737A1 (en) * 1998-11-17 2004-06-03 Tokyo Electron Limited Vacuum process system

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
JPH04298059A (ja) 1991-03-27 1992-10-21 Hitachi Ltd 真空処理装置
JPH06151552A (ja) * 1992-11-10 1994-05-31 Hitachi Ltd 半導体製造装置およびそれを用いた半導体製造方法
KR970011065B1 (ko) 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
JP3453223B2 (ja) 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JPH08151552A (ja) 1994-11-29 1996-06-11 Japan Synthetic Rubber Co Ltd ハードコートフィルム
JP2981844B2 (ja) 1996-05-16 1999-11-22 住友重機械工業株式会社 薄膜製造装置
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6038490A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Automated data storage library dual picker interference avoidance
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP2000150618A (ja) 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
JP4256551B2 (ja) 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
US6662076B1 (en) * 1999-02-10 2003-12-09 Advanced Micro Devices, Inc. Management of move requests from a factory system to an automated material handling system
JP2000312463A (ja) 1999-04-27 2000-11-07 Shinko Electric Co Ltd リニアモータのレール接続構造
TW504941B (en) * 1999-07-23 2002-10-01 Semiconductor Energy Lab Method of fabricating an EL display device, and apparatus for forming a thin film
JP2001315960A (ja) 2000-05-09 2001-11-13 Meidensha Corp 基板搬送装置
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
US6852194B2 (en) 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6779962B2 (en) 2002-03-22 2004-08-24 Brooks Automation, Inc. Device for handling flat panels in a vacuum
WO2004010476A2 (en) 2002-07-22 2004-01-29 Brooks Automation, Inc. Substrate processing apparatus
US6968257B2 (en) * 2003-11-21 2005-11-22 International Business Machines Corporation Continued execution of accessor commands on a restricted multiple accessor path of an automated data storage library
US8085676B2 (en) * 2006-06-29 2011-12-27 Nortel Networks Limited Method and system for looping back traffic in QIQ ethernet rings and 1:1 protected PBT trunks

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5695564A (en) * 1994-08-19 1997-12-09 Tokyo Electron Limited Semiconductor processing system
US20040105737A1 (en) * 1998-11-17 2004-06-03 Tokyo Electron Limited Vacuum process system

Also Published As

Publication number Publication date
CN101189713A (zh) 2008-05-28
US20060245847A1 (en) 2006-11-02
WO2006105195A2 (en) 2006-10-05
WO2006105195A3 (en) 2007-11-01
TW200644050A (en) 2006-12-16
KR20070119057A (ko) 2007-12-18
US9099506B2 (en) 2015-08-04
JP5751690B2 (ja) 2015-07-22
KR20150002888A (ko) 2015-01-07
CN101189713B (zh) 2012-03-28
JP2008535262A (ja) 2008-08-28
JP2014060412A (ja) 2014-04-03
KR101567917B1 (ko) 2015-11-10

Similar Documents

Publication Publication Date Title
JP7263639B2 (ja) 基板搬送部
JP2014060412A (ja) 半導体製造装置
TWI416651B (zh) 基板處理裝置
US6270306B1 (en) Wafer aligner in center of front end frame of vacuum system
KR100493989B1 (ko) 레지스트처리시스템및레지스트처리방법
US9368382B2 (en) Elevator-based tool loading and buffering system
US8313277B2 (en) Semiconductor manufacturing process modules
CN105556652B (zh) 使传输中衬底居中的处理设备
US20100158643A1 (en) Elevator-based tool loading and buffering system
JP2004031901A (ja) センサボックスを備えたウエハ処理装置
US10319621B2 (en) Semiconductor processing assembly and facility
US8292563B2 (en) Nonproductive wafer buffer module for substrate processing apparatus
US6364592B1 (en) Small footprint carrier front end loader
KR20170055819A (ko) 기판 처리 장치
CN1985350A (zh) 加工工具中晶片的处理系统
JP7110483B2 (ja) 基板処理装置、半導体装置の製造方法及びプログラム
CN118435340A (zh) 用于混合式基板接合系统的foup或卡匣存储
EP2245656B1 (en) Automatic handling buffer for bare stocker
JP3082784B2 (ja) 被洗浄体の洗浄方法及び洗浄装置
KR20230048610A (ko) 기판 처리 장치 및 기판 처리 방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees