KR101567917B1 - 워크스테이션들 간의 전달 챔버 - Google Patents

워크스테이션들 간의 전달 챔버 Download PDF

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Publication number
KR101567917B1
KR101567917B1 KR1020147033479A KR20147033479A KR101567917B1 KR 101567917 B1 KR101567917 B1 KR 101567917B1 KR 1020147033479 A KR1020147033479 A KR 1020147033479A KR 20147033479 A KR20147033479 A KR 20147033479A KR 101567917 B1 KR101567917 B1 KR 101567917B1
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KR
South Korea
Prior art keywords
transfer
chamber
workstation
substrate
workstation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020147033479A
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English (en)
Korean (ko)
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KR20150002888A (ko
Inventor
클린턴 엠. 해리스
Original Assignee
브룩스 오토메이션 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20150002888A publication Critical patent/KR20150002888A/ko
Application granted granted Critical
Publication of KR101567917B1 publication Critical patent/KR101567917B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020147033479A 2005-03-30 2006-03-29 워크스테이션들 간의 전달 챔버 Expired - Lifetime KR101567917B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/093,480 US9099506B2 (en) 2005-03-30 2005-03-30 Transfer chamber between workstations
US11/093,480 2005-03-30
PCT/US2006/011461 WO2006105195A2 (en) 2005-03-30 2006-03-29 Transfer chamber between workstations

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020077024974A Division KR20070119057A (ko) 2005-03-30 2006-03-29 워크스테이션들 간의 전달 챔버

Publications (2)

Publication Number Publication Date
KR20150002888A KR20150002888A (ko) 2015-01-07
KR101567917B1 true KR101567917B1 (ko) 2015-11-10

Family

ID=37054076

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147033479A Expired - Lifetime KR101567917B1 (ko) 2005-03-30 2006-03-29 워크스테이션들 간의 전달 챔버
KR1020077024974A Ceased KR20070119057A (ko) 2005-03-30 2006-03-29 워크스테이션들 간의 전달 챔버

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020077024974A Ceased KR20070119057A (ko) 2005-03-30 2006-03-29 워크스테이션들 간의 전달 챔버

Country Status (6)

Country Link
US (1) US9099506B2 (https=)
JP (2) JP5751690B2 (https=)
KR (2) KR101567917B1 (https=)
CN (1) CN101189713B (https=)
TW (1) TWI395255B (https=)
WO (1) WO2006105195A2 (https=)

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US8531678B2 (en) * 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
DE102008062080A1 (de) * 2008-12-12 2010-06-17 Karlsruher Institut für Technologie Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
US8974601B2 (en) 2011-07-29 2015-03-10 Semes Co., Ltd. Apparatuses, systems and methods for treating substrate
JP5923288B2 (ja) * 2011-12-01 2016-05-24 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理装置の運転方法
SG11202009105YA (en) * 2018-03-20 2020-10-29 Tokyo Electron Ltd Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
SG11202009243SA (en) * 2018-03-23 2020-10-29 Brooks Automation Inc Automated cryogenic storage and retrieval system
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
JP2024131483A (ja) * 2023-03-16 2024-09-30 キオクシア株式会社 半導体製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001315960A (ja) * 2000-05-09 2001-11-13 Meidensha Corp 基板搬送装置

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US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
JPH04298059A (ja) 1991-03-27 1992-10-21 Hitachi Ltd 真空処理装置
JPH06151552A (ja) * 1992-11-10 1994-05-31 Hitachi Ltd 半導体製造装置およびそれを用いた半導体製造方法
KR970011065B1 (ko) 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
TW295677B (https=) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3453223B2 (ja) 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JPH08151552A (ja) 1994-11-29 1996-06-11 Japan Synthetic Rubber Co Ltd ハードコートフィルム
JP2981844B2 (ja) 1996-05-16 1999-11-22 住友重機械工業株式会社 薄膜製造装置
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6038490A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Automated data storage library dual picker interference avoidance
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP2000150618A (ja) 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
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JP4256551B2 (ja) 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
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JP2001315960A (ja) * 2000-05-09 2001-11-13 Meidensha Corp 基板搬送装置

Also Published As

Publication number Publication date
CN101189713A (zh) 2008-05-28
US20060245847A1 (en) 2006-11-02
WO2006105195A2 (en) 2006-10-05
WO2006105195A3 (en) 2007-11-01
TW200644050A (en) 2006-12-16
KR20070119057A (ko) 2007-12-18
US9099506B2 (en) 2015-08-04
JP5751690B2 (ja) 2015-07-22
KR20150002888A (ko) 2015-01-07
TWI395255B (zh) 2013-05-01
CN101189713B (zh) 2012-03-28
JP2008535262A (ja) 2008-08-28
JP2014060412A (ja) 2014-04-03

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