JP5751690B2 - 半導体製造装置 - Google Patents

半導体製造装置 Download PDF

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Publication number
JP5751690B2
JP5751690B2 JP2008504312A JP2008504312A JP5751690B2 JP 5751690 B2 JP5751690 B2 JP 5751690B2 JP 2008504312 A JP2008504312 A JP 2008504312A JP 2008504312 A JP2008504312 A JP 2008504312A JP 5751690 B2 JP5751690 B2 JP 5751690B2
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JP
Japan
Prior art keywords
workstation
chamber
substrate
transfer
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008504312A
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English (en)
Japanese (ja)
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JP2008535262A5 (https=
JP2008535262A (ja
Inventor
クリントン エム． ハリス
クリントン エム． ハリス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Azenta Inc
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Filing date
Publication date
Application filed by Azenta Inc filed Critical Azenta Inc
Publication of JP2008535262A publication Critical patent/JP2008535262A/ja
Publication of JP2008535262A5 publication Critical patent/JP2008535262A5/ja
Application granted granted Critical
Publication of JP5751690B2 publication Critical patent/JP5751690B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
JP2008504312A 2005-03-30 2006-03-29 半導体製造装置 Expired - Fee Related JP5751690B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/093,480 US9099506B2 (en) 2005-03-30 2005-03-30 Transfer chamber between workstations
US11/093,480 2005-03-30
PCT/US2006/011461 WO2006105195A2 (en) 2005-03-30 2006-03-29 Transfer chamber between workstations

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013222380A Division JP2014060412A (ja) 2005-03-30 2013-10-25 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2008535262A JP2008535262A (ja) 2008-08-28
JP2008535262A5 JP2008535262A5 (https=) 2013-01-31
JP5751690B2 true JP5751690B2 (ja) 2015-07-22

Family

ID=37054076

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008504312A Expired - Fee Related JP5751690B2 (ja) 2005-03-30 2006-03-29 半導体製造装置
JP2013222380A Pending JP2014060412A (ja) 2005-03-30 2013-10-25 半導体製造装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013222380A Pending JP2014060412A (ja) 2005-03-30 2013-10-25 半導体製造装置

Country Status (6)

Country Link
US (1) US9099506B2 (https=)
JP (2) JP5751690B2 (https=)
KR (2) KR101567917B1 (https=)
CN (1) CN101189713B (https=)
TW (1) TWI395255B (https=)
WO (1) WO2006105195A2 (https=)

Families Citing this family (12)

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US8531678B2 (en) * 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
DE102008062080A1 (de) * 2008-12-12 2010-06-17 Karlsruher Institut für Technologie Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
US8974601B2 (en) 2011-07-29 2015-03-10 Semes Co., Ltd. Apparatuses, systems and methods for treating substrate
JP5923288B2 (ja) * 2011-12-01 2016-05-24 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理装置の運転方法
SG11202009105YA (en) * 2018-03-20 2020-10-29 Tokyo Electron Ltd Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
SG11202009243SA (en) * 2018-03-23 2020-10-29 Brooks Automation Inc Automated cryogenic storage and retrieval system
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
JP2024131483A (ja) * 2023-03-16 2024-09-30 キオクシア株式会社 半導体製造装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
JPH04298059A (ja) 1991-03-27 1992-10-21 Hitachi Ltd 真空処理装置
JPH06151552A (ja) * 1992-11-10 1994-05-31 Hitachi Ltd 半導体製造装置およびそれを用いた半導体製造方法
KR970011065B1 (ko) 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
TW295677B (https=) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3453223B2 (ja) 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
JPH08151552A (ja) 1994-11-29 1996-06-11 Japan Synthetic Rubber Co Ltd ハードコートフィルム
JP2981844B2 (ja) 1996-05-16 1999-11-22 住友重機械工業株式会社 薄膜製造装置
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
US6038490A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Automated data storage library dual picker interference avoidance
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP2000150618A (ja) 1998-11-17 2000-05-30 Tokyo Electron Ltd 真空処理システム
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
JP4256551B2 (ja) 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
US6662076B1 (en) * 1999-02-10 2003-12-09 Advanced Micro Devices, Inc. Management of move requests from a factory system to an automated material handling system
JP2000312463A (ja) 1999-04-27 2000-11-07 Shinko Electric Co Ltd リニアモータのレール接続構造
TW504941B (en) * 1999-07-23 2002-10-01 Semiconductor Energy Lab Method of fabricating an EL display device, and apparatus for forming a thin film
JP2001315960A (ja) 2000-05-09 2001-11-13 Meidensha Corp 基板搬送装置
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
US6852194B2 (en) 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6779962B2 (en) 2002-03-22 2004-08-24 Brooks Automation, Inc. Device for handling flat panels in a vacuum
WO2004010476A2 (en) 2002-07-22 2004-01-29 Brooks Automation, Inc. Substrate processing apparatus
US6968257B2 (en) * 2003-11-21 2005-11-22 International Business Machines Corporation Continued execution of accessor commands on a restricted multiple accessor path of an automated data storage library
US8085676B2 (en) * 2006-06-29 2011-12-27 Nortel Networks Limited Method and system for looping back traffic in QIQ ethernet rings and 1:1 protected PBT trunks

Also Published As

Publication number Publication date
CN101189713A (zh) 2008-05-28
US20060245847A1 (en) 2006-11-02
WO2006105195A2 (en) 2006-10-05
WO2006105195A3 (en) 2007-11-01
TW200644050A (en) 2006-12-16
KR20070119057A (ko) 2007-12-18
US9099506B2 (en) 2015-08-04
KR20150002888A (ko) 2015-01-07
TWI395255B (zh) 2013-05-01
CN101189713B (zh) 2012-03-28
JP2008535262A (ja) 2008-08-28
JP2014060412A (ja) 2014-04-03
KR101567917B1 (ko) 2015-11-10

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