TWI395255B - 工作站間之移送室 - Google Patents
工作站間之移送室 Download PDFInfo
- Publication number
- TWI395255B TWI395255B TW95111131A TW95111131A TWI395255B TW I395255 B TWI395255 B TW I395255B TW 95111131 A TW95111131 A TW 95111131A TW 95111131 A TW95111131 A TW 95111131A TW I395255 B TWI395255 B TW I395255B
- Authority
- TW
- Taiwan
- Prior art keywords
- workstation
- chamber
- transport
- substrate
- manufacturing facility
- Prior art date
Links
- 238000012546 transfer Methods 0.000 title claims description 23
- 238000012545 processing Methods 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 69
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 18
- 230000007723 transport mechanism Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 description 15
- 230000007246 mechanism Effects 0.000 description 11
- 238000004886 process control Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automation & Control Theory (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/093,480 US9099506B2 (en) | 2005-03-30 | 2005-03-30 | Transfer chamber between workstations |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200644050A TW200644050A (en) | 2006-12-16 |
| TWI395255B true TWI395255B (zh) | 2013-05-01 |
Family
ID=37054076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95111131A TWI395255B (zh) | 2005-03-30 | 2006-03-30 | 工作站間之移送室 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9099506B2 (enExample) |
| JP (2) | JP5751690B2 (enExample) |
| KR (2) | KR20070119057A (enExample) |
| CN (1) | CN101189713B (enExample) |
| TW (1) | TWI395255B (enExample) |
| WO (1) | WO2006105195A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8531678B2 (en) * | 1999-07-09 | 2013-09-10 | Nova Measuring Instruments, Ltd. | Method and system for measuring patterned structures |
| US7891936B2 (en) | 2005-03-30 | 2011-02-22 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
| US8545165B2 (en) | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
| US20080019806A1 (en) * | 2006-07-24 | 2008-01-24 | Nyi Oo Myo | Small footprint modular processing system |
| DE102008062080A1 (de) * | 2008-12-12 | 2010-06-17 | Karlsruher Institut für Technologie | Vorrichtung zum Transport atmosphärenempfindlicher Proben und Verwendung derselben |
| TW201123340A (en) * | 2009-11-12 | 2011-07-01 | Hitachi High Tech Corp | Vacuum processing system and vacuum processing method of semiconductor processing substrate |
| JP2013033965A (ja) * | 2011-07-29 | 2013-02-14 | Semes Co Ltd | 基板処理装置、基板処理設備、及び基板処理方法 |
| JP5923288B2 (ja) * | 2011-12-01 | 2016-05-24 | 株式会社日立ハイテクノロジーズ | 真空処理装置及び真空処理装置の運転方法 |
| WO2019182913A1 (en) * | 2018-03-20 | 2019-09-26 | Tokyo Electron Limited | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same |
| JP7321182B2 (ja) * | 2018-03-23 | 2023-08-04 | アゼンタ・インコーポレーテッド | 自動化極低温貯蔵及び回収システム |
| US10886155B2 (en) * | 2019-01-16 | 2021-01-05 | Applied Materials, Inc. | Optical stack deposition and on-board metrology |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695564A (en) * | 1994-08-19 | 1997-12-09 | Tokyo Electron Limited | Semiconductor processing system |
| US20040105737A1 (en) * | 1998-11-17 | 2004-06-03 | Tokyo Electron Limited | Vacuum process system |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310410A (en) * | 1990-04-06 | 1994-05-10 | Sputtered Films, Inc. | Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus |
| JPH04298059A (ja) | 1991-03-27 | 1992-10-21 | Hitachi Ltd | 真空処理装置 |
| JPH06151552A (ja) * | 1992-11-10 | 1994-05-31 | Hitachi Ltd | 半導体製造装置およびそれを用いた半導体製造方法 |
| KR970011065B1 (ko) * | 1992-12-21 | 1997-07-05 | 다이닛뽕 스크린 세이조오 가부시키가이샤 | 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법 |
| JP3453223B2 (ja) | 1994-08-19 | 2003-10-06 | 東京エレクトロン株式会社 | 処理装置 |
| JPH08151552A (ja) | 1994-11-29 | 1996-06-11 | Japan Synthetic Rubber Co Ltd | ハードコートフィルム |
| JP2981844B2 (ja) | 1996-05-16 | 1999-11-22 | 住友重機械工業株式会社 | 薄膜製造装置 |
| US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
| US6235634B1 (en) * | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
| US6038490A (en) * | 1998-01-29 | 2000-03-14 | International Business Machines Corporation | Automated data storage library dual picker interference avoidance |
| KR100265287B1 (ko) * | 1998-04-21 | 2000-10-02 | 윤종용 | 반도체소자 제조용 식각설비의 멀티챔버 시스템 |
| JP2000150618A (ja) | 1998-11-17 | 2000-05-30 | Tokyo Electron Ltd | 真空処理システム |
| JP4256551B2 (ja) | 1998-12-25 | 2009-04-22 | 東京エレクトロン株式会社 | 真空処理システム |
| US6662076B1 (en) * | 1999-02-10 | 2003-12-09 | Advanced Micro Devices, Inc. | Management of move requests from a factory system to an automated material handling system |
| JP2000312463A (ja) | 1999-04-27 | 2000-11-07 | Shinko Electric Co Ltd | リニアモータのレール接続構造 |
| TW504941B (en) * | 1999-07-23 | 2002-10-01 | Semiconductor Energy Lab | Method of fabricating an EL display device, and apparatus for forming a thin film |
| JP2001315960A (ja) | 2000-05-09 | 2001-11-13 | Meidensha Corp | 基板搬送装置 |
| JP4021125B2 (ja) * | 2000-06-02 | 2007-12-12 | 東京エレクトロン株式会社 | ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置 |
| US6852194B2 (en) * | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
| US6779962B2 (en) * | 2002-03-22 | 2004-08-24 | Brooks Automation, Inc. | Device for handling flat panels in a vacuum |
| JP4712379B2 (ja) | 2002-07-22 | 2011-06-29 | ブルックス オートメーション インコーポレイテッド | 基板処理装置 |
| US6968257B2 (en) * | 2003-11-21 | 2005-11-22 | International Business Machines Corporation | Continued execution of accessor commands on a restricted multiple accessor path of an automated data storage library |
| US8085676B2 (en) * | 2006-06-29 | 2011-12-27 | Nortel Networks Limited | Method and system for looping back traffic in QIQ ethernet rings and 1:1 protected PBT trunks |
-
2005
- 2005-03-30 US US11/093,480 patent/US9099506B2/en active Active
-
2006
- 2006-03-29 CN CN200680019260.7A patent/CN101189713B/zh active Active
- 2006-03-29 JP JP2008504312A patent/JP5751690B2/ja active Active
- 2006-03-29 KR KR1020077024974A patent/KR20070119057A/ko not_active Ceased
- 2006-03-29 KR KR1020147033479A patent/KR101567917B1/ko active Active
- 2006-03-29 WO PCT/US2006/011461 patent/WO2006105195A2/en not_active Ceased
- 2006-03-30 TW TW95111131A patent/TWI395255B/zh active
-
2013
- 2013-10-25 JP JP2013222380A patent/JP2014060412A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695564A (en) * | 1994-08-19 | 1997-12-09 | Tokyo Electron Limited | Semiconductor processing system |
| US20040105737A1 (en) * | 1998-11-17 | 2004-06-03 | Tokyo Electron Limited | Vacuum process system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070119057A (ko) | 2007-12-18 |
| JP2008535262A (ja) | 2008-08-28 |
| CN101189713A (zh) | 2008-05-28 |
| US9099506B2 (en) | 2015-08-04 |
| TW200644050A (en) | 2006-12-16 |
| US20060245847A1 (en) | 2006-11-02 |
| JP5751690B2 (ja) | 2015-07-22 |
| KR20150002888A (ko) | 2015-01-07 |
| CN101189713B (zh) | 2012-03-28 |
| KR101567917B1 (ko) | 2015-11-10 |
| WO2006105195A3 (en) | 2007-11-01 |
| JP2014060412A (ja) | 2014-04-03 |
| WO2006105195A2 (en) | 2006-10-05 |
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