TWI391503B - Wire with gold alloy wire - Google Patents
Wire with gold alloy wire Download PDFInfo
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- TWI391503B TWI391503B TW094144861A TW94144861A TWI391503B TW I391503 B TWI391503 B TW I391503B TW 094144861 A TW094144861 A TW 094144861A TW 94144861 A TW94144861 A TW 94144861A TW I391503 B TWI391503 B TW I391503B
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Description
本發明是有關:為了連接電晶體、LSI、IC等的半導體元件的晶片電極與外部引線部所使用的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線。
一般而言,作為用來連接電晶體、LSI、IC等的半導體元件的晶片電極與外部引線部的銲線,係使用在高純度金中又含有Ca、Be、Eu、Nb、Mg、Y、La、Ge、Ag、Pt等的組成分之銲線用金合金線。例如:專利文獻1係揭示出:在含不可避免的雜質未滿0.001質量%的純度99.999質量%以上的高純度金中,又含Ca:0.0001~0.003質量%;Be:0.0001~0.001質量%;Eu:0.0001~0.004質量%;Nb:0.0001~0.003質量%;且這些元素合計的添加量為0.0013~0.01質量%的金合金線所構成的銲線。此外,專利文獻2係揭示出:金純度99.9質量%以上;含Ca:1~100質量ppm;並且因應必要又含Mg、Y、La、Eu、Ge、Ag、Pt之中的至少一種,其量為1~100質量ppm;並且因應必要又含Be:1~20質量ppm,且具有拉伸強度:33.0 kg/mm2
以上,延伸率:1~3%的楔結合(Wedge bonding)用金合金線。
[專利文獻1]此處的專利文獻1是指:日本特開平6-33168號公報。
[專利文獻2]此處的專利文獻2是指:日本特開平10-98063號公報。
近年來,隨著半導體元件的積體度的進展,半導體元件的Al銲墊的面積變得更小,因為是製作成耐熱性較低的基板,所以希望能夠較以往更低溫且更小的接合面積就可以獲得良好的接合效果。
此外,因為半導體元件的積體度的進展,半導體元件的晶片電極的間隔變窄,因此,銲線間隔也變窄,所以作為半導體銲線使用的金合金線的線徑也被要求得更細。
此外,另一方面,接合在半導體元件的晶片電極與外部引線部的銲線的線弧(loop)部的長度(以下稱:線弧長度)也變長,並且呈平行地被銲接之相鄰的線弧的間隔也變窄。
為了要對應這種現狀,如果將作為銲線使用的金合金線的線徑製作得更細的話,則在於將呈捲繞狀的金合金線從線軸取出時,金合金線很容易發生捲曲或蛇行(撓曲或彎曲),如果使用存在著這種捲曲或蛇行(撓曲或彎曲)的金合金線進行銲接的話,因為相鄰的銲線會互相接觸而導致短路,所以會產生半導體晶片的不良品而降低良率。尤其是金合金所作成的銲線的線徑未滿20 μ m的話,剛從線軸釋放出來的銲線很容易發生捲曲或蛇行(撓曲或彎曲)。剛從線軸釋放出來的銲線不發生捲曲或蛇行(撓曲或彎曲)而且因銲接而形成的線弧與相鄰的線弧不會互相接觸的這種性質是被稱為「銲線的直進性」,如果這種直進性不足的話,將會因為相鄰的線弧互相接觸造成短路的緣故,而產生半導體裝置的不良品而降低良率。
此外,將銲線銲接而形成線弧之後,必須以樹脂加以封裝,在這個時候如果銲線隨著樹脂流動的話,將會與相鄰的線弧互相接觸造成短路,因此會產生半導體裝置的不良品而降低良率。這種隨著樹脂流動的現象,以往所採用的線徑為25 μ m或30 μ m的銲線用金合金線的時候,並不會造成這種問題。然而,隨著半導體元件的積體度的進展,半導體元件的晶片電極的間隔變窄,為了對應這種變化,必須以較細的銲線來進行銲接,但是如果線徑未滿20 μ m的話,在進行樹脂封裝時,線弧很容易隨著樹脂流動。因此,必須要具備:即使是線徑很細的銲線也不易隨著樹脂流動的特性(以下,將這種特性稱為耐樹脂流動性)。
因此,本發明人等為了開發出具有優異的接合性、直進性以及銲線不易隨著樹脂流動的特性(以下將這種性質稱為:耐樹脂流動性)之銲線用金合金線,進行研究之後,獲得了下列的結果。
(1)具有含Ca:40~80 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線;(2)具有含Ca:40~80 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線;(3)具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線;(4)具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線;(5)在上述(1)~(4)所述的金合金線中又含Ag:0.5~10 ppm,其餘為Au和不可避免的雜質的成分組成之銲線用金合金線之中,該金合金線的0.2%耐力;楊格率;延伸率將會影響到接合性、直進性以及耐樹脂流動性,只要針對這些項目加以界定,即可更進一步提高接合性、直進性以及耐樹脂流動性,因此,若該銲線用金合金線的0.2%耐力為σ0 . 2
、楊格率為E、延伸率為EL
的話,藉由界定成符合:E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
;3%<EL
≦10%的條件的話,該銲線用金合金線即可更進一步提高接合性、直進性以及耐樹脂流動性。
本發明就是基於這種研究結果而開發完成的。
本案的第一發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線,係具有含Ca:40~80 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線,其特徵為:若該銲線用金合金線的0.2%耐力為σ0 . 2
、楊格率為E、延伸率為EL
的話,符合E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
;3%<EL
≦10%的條件。
本案的第二發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線,係具有含Ca:40~80 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線,其特徵為:若該銲線用金合金線的0.2%耐力為σ0 . 2
、楊格率為E、延伸率為EL
的話,符合E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
;3%<EL
≦10%的條件。
本案的第三發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線,係具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線,其特徵為:。
若該銲線用金合金線的0.2%耐力為σ0 . 2
、楊格率為E、延伸率為EL
的話,符合E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
;3%<EL
≦10%的條件。
本案的第四發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線,係具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成之銲線用金合金線,其特徵為:若該銲線用金合金線的0.2%耐力為σ0 . 2
、楊格率為E、延伸率為EL
的話,符合E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
;3%<EL
≦10%的條件。
本案的第五發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線係在上述第一、第二、第三或第四發明之銲線用金合金線中又含Ag:0.5~10 ppm,其餘為Au和不可避免的雜質的成分組成。
本發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線是將具有上述第一發明至第五發明的成分組成的金合金線素材,進行抽線加工成為預定的線徑以製造銲線用金合金線,並且在將金合金線素材進行退火處理的銲線用金合金線的製造過程中,可藉由將退火溫度設定成較之以往的退火溫度更低的溫度,也就是550℃以下的溫度來進行退火以製造出銲線用金合金線。上述金合金線素材在進行抽線加工時的通過一次拉線眼模的面積縮減率係設定成較傳統的面積縮減率更低,也就是設定為5%以下更好。
接下來,將說明本發明的具有優異的接合性、直進性以及耐樹脂流動性之銲線用金合金線,為何要將其成分組成、0.2%耐力σ0 . 2
、楊格率E、延伸率EL
界定在上述範圍的理由。
(1)成分組成(a)Ca:Ca成分係較Au的原子半徑更大,會導致Au的結晶格子變形而可提高銲線用金合金線的機械強度以及電弧燒球(free-air-ball)的加工硬化性,並且具有可提昇再結晶溫度,降低銲線用金合金線的線弧的高度之效果,但是,如果添加Ca未滿40 ppm的話,因為電弧燒球的加工硬化性較低所以接合性也較低,而且因為強度較低所以無法符合:楊格率E≧75GPa;(σ0 . 2
/E)≧2.2×10- 3
的條件,因此並不適合。另一方面,如果含Ca的量超過80 ppm的話,進行燒球接合(ball bonding)時所形成的電弧燒球的表面會產生大量的氧化物,而且會在電弧燒球的底部中央,會形成對接合毫無幫助的大縮孔,因而降低初次銲接(first bonding)的接合性,並不適合。所以本發明的銲線用金合金線所含的Ca量界定為40~80 ppm。
(b)Eu:Eu成分係較Au的原子半徑更大,會導致Au的結晶格子變形而可提高銲線用金合金線的機械強度以及電弧燒球的加工硬化性,並且具有可提昇再結晶溫度,降低銲線用金合金線的線弧的高度之效果,但是,如果添加Eu未滿5 ppm的話,無法提高強度以及接合性。另一方面,如果含Eu的量超過40 ppm的話,與Ca同樣地,進行球銲時所形成的電弧燒球的表面會產生大量的氧化物,而且會在電弧燒球的底部中央,會形成對接合毫無幫助的大縮孔,因而降低初次銲接的接合性,並不適合。所以本發明的銲線用金合金線所含的Eu量界定為5~40 ppm。
(c)Be:Be成分係較Au的原子半徑更小,也是會導致Au的結晶格子變形而可提高銲線用金合金線的機械強度,而且與Ca和Eu同時含有的話,因為具有可降低再結晶溫度的效果,所以可提高線弧的高度而具有可實現適當的線弧高度之效果,因此可因應需要來添加,但是,其添加量未滿1 ppm的話,無法獲得預定的效果。另一方面,如果含量超過10 ppm的話,電弧燒球的表面會產生大量的氧化物,而且會增大縮孔,因而在燒球正上部以及燒球部的結晶粒徑會增大,壓接燒球部的真圓度會降低,並不適合。所以本發明的銲線用金合金線所含的Be量界定為1~10ppm。
(d)Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu:鹼土族金屬的Ba和Sr,週期表5b族的Bi以及稀土族元素的Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu均為可提高銲線用金合金線的機械強度而且具有可提高電弧燒球的加工硬化之效果,所以可因應需要來添加,但是其添加量未滿5 ppm的話,無法獲得預定的效果。另一方面,如果含量超過19 ppm的話,電弧燒球的表面會產生大量的氧化物,而且會在電弧燒球的底部中央形成對接合毫無幫助的大縮孔,因而降低初次銲接的接合性,並不適合。所以本發明的銲線用金合金線所含的這些成分的量界定為5~19 ppm。
(e)Ag:Ag係可因應必要來含有。因為即使含有Ag:0.5~10 ppm對於特性也幾乎不會帶來影響。但如果添加量超過10 ppm的話,初次銲接的接合性會降低,並不適合。所以本發明的銲線用金合金線所含的Ag量界定為0.5~10 ppm。
(2)機械特性楊格率E(Young's Modulus)楊格率E若小於75 GPa的話,在銲線接合後的進行封裝時,銲線會隨著樹脂大幅地流動,其結果,相鄰的弧線會互相接觸,發生短路的頻率會增加,因而降低半導體晶片的良率,並不適合。因此,本發明的銲線用金合金線係將其楊格率E界定為75 GPa以上。
σ0 . 2
/E σ0 . 2
/E的值愈大,愈可提升銲線用金合金線的直進性,且因為σ0 . 2
/E的值為2.2×10- 3
以上的話,可急劇地提高直進性,所以界定為(σ0 . 2
/E)≧2.2×10- 3
。
延伸率EL
延伸率EL
若為3%以下的話,直進性很低,延伸率EL
若為10%以上的話,楊格率E會變成小於75 GPa,或者(σ0 . 2
/E)會變成小於2.2×10- 3
而使得直進性降低,因此並不適合。所以本發明的銲線用金合金線係將延伸率EL
界定為:3%<EL
≦10%的條件。
本發明中,銲線用金合金線的斷裂延伸率EL
(%)、0.2%耐力σ0 . 2
(Pa)以及楊格率E(Pa)的測定,是在室溫下,將銲線用金合金線在標點之間的距離:100 mm;拉伸速度:10 mm/分鐘的條件下,利用拉伸試驗機進行拉伸試驗直到銲線用金合金線拉斷為止。
以這個時點的變形以及拉伸應力,以下列的方式加以定義。
變形=銲線用金合金線的伸長量(mm)/100mm;拉伸應力=拉伸荷重(N)/銲線用金合金線的初期斷面積(m2
)將斷裂延伸率EL
(%)、0.2%耐力σ0 . 2
(Pa)以及楊格率E(Pa)以下列的方式加以定義。
斷裂延伸率EL
(%)=拉斷時的變形×100=[拉斷時的伸長量(mm)/100(mm)]×100 0.2%耐力σ0 . 2
(Pa):對於銲線用金合金線造成0.2%的永久變形時的拉伸應力(Pa)。
楊格率E(Pa):拉伸應力(Pa)與變形成正比的範圍內的拉伸應力與變形的比值;亦即,拉伸應力(Pa)/變形量。
如上所述,使用本發明的銲線用金合金線進行接合的話,相鄰的弧線互相接觸的現象變少,對於產業而言,可帶來提高半導體裝置的良率等的優異效果。
將線徑:50 μ m且具有表1~12所示的成分組成的金合金線素材,以通過一次拉線眼模的面積縮減率為4.8%的縮徑比來進行抽線加工,而製作成線徑:18 μ m的金合金線,將這種金合金線以表13~24所示的溫度實施退火處理而製作出本發明的銲線用金合金線(以下,稱為本發明的銲線)1~184;比較例的銲線用金合金線(以下,稱為比較例的銲線)1~42以及習知的銲線用金合金線(以下,稱為習知的銲線)1~5;然後以半徑:50 mm的中間線軸來捲取。此處,在實施退火以及捲取的過程中,為了改變銲線的經過路線所使用的滑輪,全部是半徑:9 mm的滑輪。在捲繞於中間線軸上的銲線塗敷潤滑劑,再以半徑:25 mm的線軸進行捲取2000公尺,捨棄銲線前頭的15公尺的長度,然後測定銲線的延伸率EL
;楊格率E、0.2%耐力σ0 . 2
,進而計算出σ0 . 2
/E,將其結果標示到表13~24。進行這些測定時所使用的樣品的長度均為10公分,樣品數為5條,將其平均值標示於表13~24。將具有表13~24所示的機械特性的本發明的銲線1~184;比較例的銲線1~42以及習知的銲線1~5安裝在Kulicke & Soffa公司製的銲線機,以加熱溫度:130℃;銲墊間距:45 μ m間隔;弧線長度:5mm;弧線高度:220 μ m;燒球直徑:34 μ m;燒球高度:8 μ m的條件,進行銲接接合,以製作出10000個弧線,並且針對於直進性、接合性以及燒球的真圓度進行評量。
直進性:測定相鄰的弧線彼此互相接觸的個數,將其結果標示於表13~24以對於直進性進行評量。
接合性:測定初次銲接部之未接合的數目(燒球脫落數目),將其結果標示於表13~24以對於接合性進行評量。
燒球的真圓度:針對於各樣品,觀察100個壓接燒球,全部都良好的話,標示為○;只要有一個不良的話,標示為×,將其結果標示於表13~24以對於燒球的真圓度進行評量。
此外,針對於具有表13~24所示的機械特性的本發明的銲線1~184;比較例的銲線1~42以及習知的銲線1~5進行下列的評量。
弧線高度:將具有表13~24所示的機械特性的本發明的銲線1~184;比較例的銲線1~42以及習知的銲線1~5安裝在Kulicke & Soffa公司製的銲線機,以不進行反向拉線的方式,在於燒球直徑:34 μ m;燒球高度:8 μ m;弧線長度:1 mm的條件下,進行銲接弧線,使用光學顯微鏡來測定弧線最高部與引線框的高度,將兩者的差值當作弧線高度,將其結果標示於表13~24以對於弧線高度進行評量。
耐樹脂流動性:對於搭載了以弧線長度:3.5 mm的條件進行接合後的半導體晶片的引線框,使用封裝裝置以環氧樹脂予以封裝之後,使用軟X光非破壞檢查裝置對於已經被樹脂封裝後的半導體晶片內部進行X光投影,測定20條銲線的流動最大部分的流動量,將其平均值除以弧線長度之後所得用數值(%),定義為樹脂流動性,測定這種樹脂流動性,將其結果標示於表13~24以對於耐樹脂流動性進行評量。
由表1~表24所示的結果可知,本發明的銲線1~184的直進性、接合性、銲球的真圓性以及耐樹脂流動性均為良好,特別是在於接合性、直進性以及耐樹脂流動性均為良好,相對於此,比較例的銲線1~42以及習用的銲線1~5,在這三種特性之中,至少有一項是不良。
此外,線弧的高度係因半導體裝置所需的值各不相同,所以並無所謂的優劣之分,但是從實施例可知,藉由添加Be>1 ppm的話,即可調整線弧的高度。
Claims (5)
- 一種銲線用金合金線,其具有優異的接合性、直進性以及耐樹脂流動性,係具有含Ca:40~80 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成,其特徵為:若該銲線用金合金線的0.2%耐力為σ0.2 、楊格率為E、延伸率為EL 的話,符合E≧75 GPa;(σ0.2 /E)≧2.2×10-3 ;3%<EL ≦10%的條件。
- 一種銲線用金合金線,其具有優異的接合性、直進性以及耐樹脂流動性,係具有含Ca:40~80 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成,其特徵為:若該銲線用金合金線的0.2%耐力為σ0.2 、楊格率為E、延伸率為EL 的話,符合E≧75GPa;(σ0.2 /E)≧2.2×10-3 ;3%<EL ≦10%的條件。
- 一種銲線用金合金線,其具有優異的接合性、直 進性以及耐樹脂流動性,係具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;其餘為Au和不可避免的雜質的成分組成,其特徵為:。若該銲線用金合金線的0.2%耐力為σ0.2 、楊格率為E、延伸率為EL 的話,符合E≧75GPa;(σ0.2 /E)≧2.2×10-3 ;3%<EL ≦10%的條件。
- 一種銲線用金合金線,其具有優異的接合性、直進性以及耐樹脂流動性,係具有含Ca:40~80 ppm;Be:1~10 ppm;Eu:5~40 ppm;且含Ba、Sr、Bi、Y、La、Ce、Pr、Nd、Sm、Tb、Ho、Er、Tm、Yb以及Lu之中的一種或兩種以上且合計為5~19 ppm;其餘為Au和不可避免的雜質的成分組成,其特徵為:若該銲線用金合金線的0.2%耐力為σ0.2 、楊格率為E、延伸率為EL 的話,符合E≧75GPa;(σ0.2 /E)≧2.2×10-3 ;3%<EL ≦10%的條件。
- 如申請專利範圍第1、2、3或4項所述之銲線用金合金線,其中該銲線用金合金線又含Ag:0.5~10 ppm,其餘為Au和不可避免的雜質的成分組成。
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JP3690902B2 (ja) * | 1996-07-31 | 2005-08-31 | 田中電子工業株式会社 | ウエッジボンディング用金合金線 |
JP3494175B2 (ja) * | 2001-02-19 | 2004-02-03 | 住友金属鉱山株式会社 | ボンディングワイヤ及びその製造方法 |
EP1830398A4 (en) * | 2004-11-26 | 2012-06-06 | Tanaka Electronics Ind | AU BONDING WIRE FOR A SEMICONDUCTOR ELEMENT |
-
2005
- 2005-11-04 JP JP2005321153A patent/JP4641248B2/ja not_active Expired - Fee Related
- 2005-12-16 TW TW094144861A patent/TWI391503B/zh not_active IP Right Cessation
Patent Citations (3)
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JPH1098063A (ja) * | 1996-07-31 | 1998-04-14 | Tanaka Denshi Kogyo Kk | ウエッジボンディング用金合金線 |
JPH10172998A (ja) * | 1996-12-11 | 1998-06-26 | Sumitomo Metal Mining Co Ltd | Auボンディングワイヤー |
JP2004255464A (ja) * | 2003-02-03 | 2004-09-16 | Nippon Steel Corp | 金属線材及びその製造方法 |
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JP4641248B2 (ja) | 2011-03-02 |
TW200626733A (en) | 2006-08-01 |
JP2006203164A (ja) | 2006-08-03 |
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