TWI388838B - 探針裝置 - Google Patents

探針裝置 Download PDF

Info

Publication number
TWI388838B
TWI388838B TW097142527A TW97142527A TWI388838B TW I388838 B TWI388838 B TW I388838B TW 097142527 A TW097142527 A TW 097142527A TW 97142527 A TW97142527 A TW 97142527A TW I388838 B TWI388838 B TW I388838B
Authority
TW
Taiwan
Prior art keywords
reinforcing member
support plate
guide hole
circuit board
probe
Prior art date
Application number
TW097142527A
Other languages
English (en)
Chinese (zh)
Other versions
TW200935065A (en
Inventor
Toshihiro Yonezawa
Shinichiro Takase
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200935065A publication Critical patent/TW200935065A/zh
Application granted granted Critical
Publication of TWI388838B publication Critical patent/TWI388838B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW097142527A 2007-11-30 2008-11-04 探針裝置 TWI388838B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007310109A JP2009133722A (ja) 2007-11-30 2007-11-30 プローブ装置

Publications (2)

Publication Number Publication Date
TW200935065A TW200935065A (en) 2009-08-16
TWI388838B true TWI388838B (zh) 2013-03-11

Family

ID=40678342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097142527A TWI388838B (zh) 2007-11-30 2008-11-04 探針裝置

Country Status (7)

Country Link
US (1) US8319511B2 (enExample)
EP (1) EP2216656A4 (enExample)
JP (1) JP2009133722A (enExample)
KR (1) KR101164012B1 (enExample)
CN (1) CN101883986B (enExample)
TW (1) TWI388838B (enExample)
WO (1) WO2009069440A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5277827B2 (ja) * 2008-09-22 2013-08-28 東京エレクトロン株式会社 プローブ装置
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
JP2012182378A (ja) * 2011-03-02 2012-09-20 Tokyo Electron Ltd プローブカードの位置決め機構及び検査装置
JP2013137281A (ja) * 2011-12-28 2013-07-11 Seiko Epson Corp プローブ装置
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
KR101569303B1 (ko) * 2012-06-22 2015-11-13 아사히 가세이 일렉트로닉스 가부시끼가이샤 프로브 카드 고정 장치, 프로브 검사 장치 및 프로브 카드
US9000455B2 (en) * 2013-03-10 2015-04-07 Tsmc Solid State Lighting Ltd. Shadow mask assembly
CN105122338A (zh) * 2013-03-29 2015-12-02 夏普株式会社 有源矩阵基板和显示装置
JP2015125037A (ja) * 2013-12-26 2015-07-06 株式会社エンプラス 通電治具
CN104360510B (zh) * 2014-11-24 2018-02-16 合肥鑫晟光电科技有限公司 一种检测用探针块及其检测装置
JP6484137B2 (ja) * 2014-11-26 2019-03-13 株式会社日本マイクロニクス プローブ及び接触検査装置
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
KR102673906B1 (ko) * 2018-11-02 2024-06-10 세메스 주식회사 카드 홀더 및 이를 포함하는 프로브 스테이션
JP7566493B2 (ja) * 2020-05-27 2024-10-15 株式会社日本マイクロニクス 接続装置
JP2024017497A (ja) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス 電気的接続装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2684126B2 (ja) * 1991-06-05 1997-12-03 松下電器産業株式会社 プリント基板自動調整検査ステーション
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004027887B4 (de) * 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
JP2006010629A (ja) 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4472593B2 (ja) * 2005-07-12 2010-06-02 東京エレクトロン株式会社 プローブカード
DE102006054734A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings sowie entsprechendes Verfahren
JP4842640B2 (ja) 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
KR200433761Y1 (ko) 2006-09-27 2006-12-12 박영호 셀프-클린칭 타입 파스너
KR20080030124A (ko) * 2006-09-29 2008-04-04 (주) 미코티엔 프로브 카드
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices

Also Published As

Publication number Publication date
CN101883986B (zh) 2013-06-26
KR101164012B1 (ko) 2012-07-18
EP2216656A4 (en) 2013-03-20
US8319511B2 (en) 2012-11-27
US20100301888A1 (en) 2010-12-02
TW200935065A (en) 2009-08-16
CN101883986A (zh) 2010-11-10
EP2216656A1 (en) 2010-08-11
JP2009133722A (ja) 2009-06-18
WO2009069440A1 (ja) 2009-06-04
KR20100071103A (ko) 2010-06-28

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MM4A Annulment or lapse of patent due to non-payment of fees