WO2009069440A1 - プローブ装置 - Google Patents

プローブ装置 Download PDF

Info

Publication number
WO2009069440A1
WO2009069440A1 PCT/JP2008/070111 JP2008070111W WO2009069440A1 WO 2009069440 A1 WO2009069440 A1 WO 2009069440A1 JP 2008070111 W JP2008070111 W JP 2008070111W WO 2009069440 A1 WO2009069440 A1 WO 2009069440A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide hole
reinforcing member
fixed
outer circumference
collar
Prior art date
Application number
PCT/JP2008/070111
Other languages
English (en)
French (fr)
Inventor
Toshihiro Yonezawa
Shinichiro Takase
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to KR1020107010747A priority Critical patent/KR101164012B1/ko
Priority to EP08854285A priority patent/EP2216656A4/en
Priority to CN200880118543.6A priority patent/CN101883986B/zh
Priority to US12/745,306 priority patent/US8319511B2/en
Publication of WO2009069440A1 publication Critical patent/WO2009069440A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

　接触子を支持する支持板と回路基板を備えたプローブカードの上面側には、補強部材が設けられている。補強部材の外周部には、長穴のガイド孔が複数形成されている。ガイド孔内には、保持部材に固定された固定部材と、固定部材の外周に設けられたカラーが設けられている。ガイド孔の長手方向の長さは、カラーの径よりも長く、ガイド孔は、その長手方向の中心線が補強部材の中心を通るように形成されている。ガイド孔によって、補強部材自体の水平方向の膨張が許容される。
PCT/JP2008/070111 2007-11-30 2008-11-05 プローブ装置 WO2009069440A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107010747A KR101164012B1 (ko) 2007-11-30 2008-11-05 프로브 장치
EP08854285A EP2216656A4 (en) 2007-11-30 2008-11-05 PROBE
CN200880118543.6A CN101883986B (zh) 2007-11-30 2008-11-05 探针装置
US12/745,306 US8319511B2 (en) 2007-11-30 2008-11-05 Probe device having a structure for being prevented from deforming

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007310109A JP2009133722A (ja) 2007-11-30 2007-11-30 プローブ装置
JP2007-310109 2007-11-30

Publications (1)

Publication Number Publication Date
WO2009069440A1 true WO2009069440A1 (ja) 2009-06-04

Family

ID=40678342

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070111 WO2009069440A1 (ja) 2007-11-30 2008-11-05 プローブ装置

Country Status (7)

Country Link
US (1) US8319511B2 (ja)
EP (1) EP2216656A4 (ja)
JP (1) JP2009133722A (ja)
KR (1) KR101164012B1 (ja)
CN (1) CN101883986B (ja)
TW (1) TWI388838B (ja)
WO (1) WO2009069440A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5277827B2 (ja) * 2008-09-22 2013-08-28 東京エレクトロン株式会社 プローブ装置
TWI435083B (zh) * 2010-07-27 2014-04-21 Mpi Corp Combination probe head for vertical probe card and its assembly alignment method
JP2012182378A (ja) * 2011-03-02 2012-09-20 Tokyo Electron Ltd プローブカードの位置決め機構及び検査装置
JP2013137281A (ja) * 2011-12-28 2013-07-11 Seiko Epson Corp プローブ装置
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
JP5816749B2 (ja) * 2012-06-22 2015-11-18 旭化成エレクトロニクス株式会社 プローブカード固定装置、プローブ検査装置
US9000455B2 (en) * 2013-03-10 2015-04-07 Tsmc Solid State Lighting Ltd. Shadow mask assembly
WO2014156434A1 (ja) * 2013-03-29 2014-10-02 シャープ株式会社 アクティブマトリクス基板、及び表示装置
JP2015125037A (ja) * 2013-12-26 2015-07-06 株式会社エンプラス 通電治具
JP6369286B2 (ja) * 2014-10-23 2018-08-08 富士通株式会社 プロセス間通信プログラム、解放要求方法、および並列演算装置
CN104360510B (zh) * 2014-11-24 2018-02-16 合肥鑫晟光电科技有限公司 一种检测用探针块及其检测装置
JP6484137B2 (ja) * 2014-11-26 2019-03-13 株式会社日本マイクロニクス プローブ及び接触検査装置
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP2021188947A (ja) * 2020-05-27 2021-12-13 株式会社日本マイクロニクス 光学的接続子保持構造及び接続装置
JP2024017497A (ja) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス 電気的接続装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359500A (ja) * 1991-06-05 1992-12-11 Matsushita Electric Ind Co Ltd プリント基板自動調整検査ステーション
WO2007007544A1 (ja) * 2005-07-12 2007-01-18 Tokyo Electron Limited プローブカード
JP2007158345A (ja) * 2005-12-05 2007-06-21 Feinmetall Gmbh 被験電気部品の検査のための電気検査装置ならびに検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004027887B4 (de) * 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
JP2006010629A (ja) 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4842640B2 (ja) 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
KR200433761Y1 (ko) 2006-09-27 2006-12-12 박영호 셀프-클린칭 타입 파스너
KR20080030124A (ko) * 2006-09-29 2008-04-04 (주) 미코티엔 프로브 카드
US7471078B2 (en) * 2006-12-29 2008-12-30 Formfactor, Inc. Stiffener assembly for use with testing devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359500A (ja) * 1991-06-05 1992-12-11 Matsushita Electric Ind Co Ltd プリント基板自動調整検査ステーション
WO2007007544A1 (ja) * 2005-07-12 2007-01-18 Tokyo Electron Limited プローブカード
JP2007158345A (ja) * 2005-12-05 2007-06-21 Feinmetall Gmbh 被験電気部品の検査のための電気検査装置ならびに検査方法

Also Published As

Publication number Publication date
KR20100071103A (ko) 2010-06-28
US8319511B2 (en) 2012-11-27
KR101164012B1 (ko) 2012-07-18
EP2216656A4 (en) 2013-03-20
EP2216656A1 (en) 2010-08-11
TW200935065A (en) 2009-08-16
JP2009133722A (ja) 2009-06-18
CN101883986A (zh) 2010-11-10
US20100301888A1 (en) 2010-12-02
CN101883986B (zh) 2013-06-26
TWI388838B (zh) 2013-03-11

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