TWI387171B - 電極圖案及線焊接方法 - Google Patents

電極圖案及線焊接方法 Download PDF

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Publication number
TWI387171B
TWI387171B TW097107465A TW97107465A TWI387171B TW I387171 B TWI387171 B TW I387171B TW 097107465 A TW097107465 A TW 097107465A TW 97107465 A TW97107465 A TW 97107465A TW I387171 B TWI387171 B TW I387171B
Authority
TW
Taiwan
Prior art keywords
wire bonding
pattern
electrode pattern
electrode
cognitive
Prior art date
Application number
TW097107465A
Other languages
English (en)
Chinese (zh)
Other versions
TW200843265A (en
Inventor
久義浩
山口勉
田中秀幸
松尾和則
Original Assignee
三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機股份有限公司 filed Critical 三菱電機股份有限公司
Publication of TW200843265A publication Critical patent/TW200843265A/zh
Application granted granted Critical
Publication of TWI387171B publication Critical patent/TWI387171B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07323—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW097107465A 2007-03-19 2008-03-04 電極圖案及線焊接方法 TWI387171B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007070684 2007-03-19
JP2008008066A JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法

Publications (2)

Publication Number Publication Date
TW200843265A TW200843265A (en) 2008-11-01
TWI387171B true TWI387171B (zh) 2013-02-21

Family

ID=39985396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107465A TWI387171B (zh) 2007-03-19 2008-03-04 電極圖案及線焊接方法

Country Status (4)

Country Link
JP (1) JP5176557B2 (enExample)
KR (1) KR100941106B1 (enExample)
CN (1) CN101272034B (enExample)
TW (1) TWI387171B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5441590B2 (ja) * 2009-09-29 2014-03-12 大王製紙株式会社 パンツタイプ使い捨ておむつ
JP6901902B2 (ja) * 2017-04-27 2021-07-14 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
KR102706879B1 (ko) * 2021-12-24 2024-09-13 주식회사 유라코퍼레이션 Pcb기판
CN121097496A (zh) * 2025-11-10 2025-12-09 长春理工大学 一种提高半导体激光器调制速率的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6144102A (en) * 1997-05-16 2000-11-07 Texas Instruments Incorporated Semiconductor device package
JP2001326241A (ja) * 2000-05-16 2001-11-22 Oki Electric Ind Co Ltd ボンディングパッド及び半導体チップ
TW581715B (en) * 2001-07-06 2004-04-01 Erico Int Corp Welding apparatus and method
TWI228785B (en) * 2002-05-28 2005-03-01 Hitachi Chemical Co Ltd Substrate, wiring board, substrate for semiconductor package, semiconductor device, semiconductor package and its manufacturing method
US20050151251A1 (en) * 2003-12-19 2005-07-14 Tdk Corporation Mounting substrate and electronic component using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291126A (ja) 1986-06-11 1987-12-17 Fuji Xerox Co Ltd パタ−ン認識マ−ク
JPS63133638A (ja) * 1986-11-26 1988-06-06 Toshiba Corp ワイヤボンデイング方法
JP2621420B2 (ja) * 1988-09-28 1997-06-18 日本電気株式会社 半導体装置のボンディングパッド
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP2982794B1 (ja) 1998-06-17 1999-11-29 日本電気株式会社 半導体装置
JP2001024303A (ja) 1999-07-09 2001-01-26 Nippon Avionics Co Ltd 認識マーク
US7042098B2 (en) 2003-07-07 2006-05-09 Freescale Semiconductor,Inc Bonding pad for a packaged integrated circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6144102A (en) * 1997-05-16 2000-11-07 Texas Instruments Incorporated Semiconductor device package
JP2001326241A (ja) * 2000-05-16 2001-11-22 Oki Electric Ind Co Ltd ボンディングパッド及び半導体チップ
TW581715B (en) * 2001-07-06 2004-04-01 Erico Int Corp Welding apparatus and method
TWI228785B (en) * 2002-05-28 2005-03-01 Hitachi Chemical Co Ltd Substrate, wiring board, substrate for semiconductor package, semiconductor device, semiconductor package and its manufacturing method
US20050151251A1 (en) * 2003-12-19 2005-07-14 Tdk Corporation Mounting substrate and electronic component using the same

Also Published As

Publication number Publication date
CN101272034B (zh) 2010-09-29
TW200843265A (en) 2008-11-01
KR20080085687A (ko) 2008-09-24
JP2008263165A (ja) 2008-10-30
JP5176557B2 (ja) 2013-04-03
KR100941106B1 (ko) 2010-02-10
CN101272034A (zh) 2008-09-24

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MM4A Annulment or lapse of patent due to non-payment of fees