JP5176557B2 - 電極パターンおよびワイヤボンディング方法 - Google Patents

電極パターンおよびワイヤボンディング方法 Download PDF

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Publication number
JP5176557B2
JP5176557B2 JP2008008066A JP2008008066A JP5176557B2 JP 5176557 B2 JP5176557 B2 JP 5176557B2 JP 2008008066 A JP2008008066 A JP 2008008066A JP 2008008066 A JP2008008066 A JP 2008008066A JP 5176557 B2 JP5176557 B2 JP 5176557B2
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JP
Japan
Prior art keywords
wire bonding
electrode pattern
pattern
wire
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008008066A
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English (en)
Japanese (ja)
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JP2008263165A (ja
JP2008263165A5 (enExample
Inventor
義浩 久
勉 山口
秀幸 田中
和則 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2008008066A priority Critical patent/JP5176557B2/ja
Priority to TW097107465A priority patent/TWI387171B/zh
Priority to US12/042,650 priority patent/US7550673B2/en
Priority to KR1020080020362A priority patent/KR100941106B1/ko
Priority to CN2008100830350A priority patent/CN101272034B/zh
Publication of JP2008263165A publication Critical patent/JP2008263165A/ja
Publication of JP2008263165A5 publication Critical patent/JP2008263165A5/ja
Application granted granted Critical
Publication of JP5176557B2 publication Critical patent/JP5176557B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H10W72/0711—
    • H10W72/07323—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/59—
    • H10W90/753—
    • H10W90/754—

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  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2008008066A 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法 Expired - Fee Related JP5176557B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008008066A JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法
TW097107465A TWI387171B (zh) 2007-03-19 2008-03-04 電極圖案及線焊接方法
US12/042,650 US7550673B2 (en) 2007-03-19 2008-03-05 Electrode pattern and wire bonding method
KR1020080020362A KR100941106B1 (ko) 2007-03-19 2008-03-05 전극 패턴 및 와이어본딩 방법
CN2008100830350A CN101272034B (zh) 2007-03-19 2008-03-18 电极图形以及引线接合方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007070684 2007-03-19
JP2007070684 2007-03-19
JP2008008066A JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法

Publications (3)

Publication Number Publication Date
JP2008263165A JP2008263165A (ja) 2008-10-30
JP2008263165A5 JP2008263165A5 (enExample) 2011-01-20
JP5176557B2 true JP5176557B2 (ja) 2013-04-03

Family

ID=39985396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008008066A Expired - Fee Related JP5176557B2 (ja) 2007-03-19 2008-01-17 電極パターンおよびワイヤボンディング方法

Country Status (4)

Country Link
JP (1) JP5176557B2 (enExample)
KR (1) KR100941106B1 (enExample)
CN (1) CN101272034B (enExample)
TW (1) TWI387171B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5441590B2 (ja) * 2009-09-29 2014-03-12 大王製紙株式会社 パンツタイプ使い捨ておむつ
JP6901902B2 (ja) * 2017-04-27 2021-07-14 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
KR102706879B1 (ko) * 2021-12-24 2024-09-13 주식회사 유라코퍼레이션 Pcb기판
CN121097496A (zh) * 2025-11-10 2025-12-09 长春理工大学 一种提高半导体激光器调制速率的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291126A (ja) 1986-06-11 1987-12-17 Fuji Xerox Co Ltd パタ−ン認識マ−ク
JPS63133638A (ja) * 1986-11-26 1988-06-06 Toshiba Corp ワイヤボンデイング方法
JP2621420B2 (ja) * 1988-09-28 1997-06-18 日本電気株式会社 半導体装置のボンディングパッド
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3611948B2 (ja) * 1997-05-16 2005-01-19 日本テキサス・インスツルメンツ株式会社 半導体装置及びその製造方法
JP2982794B1 (ja) 1998-06-17 1999-11-29 日本電気株式会社 半導体装置
JP2001024303A (ja) 1999-07-09 2001-01-26 Nippon Avionics Co Ltd 認識マーク
JP4352579B2 (ja) * 2000-05-16 2009-10-28 沖電気工業株式会社 半導体チップ及びその製造方法
US6789724B2 (en) * 2001-07-06 2004-09-14 Erico International Corporation Welding apparatus and method
WO2003100850A1 (en) * 2002-05-28 2003-12-04 Hitachi Chemical Co., Ltd. Substrate, wiring board, semiconductor package-use substrate, semiconductor package and production methods for them
US7042098B2 (en) 2003-07-07 2006-05-09 Freescale Semiconductor,Inc Bonding pad for a packaged integrated circuit
JP2005183669A (ja) * 2003-12-19 2005-07-07 Tdk Corp 実装基板およびそれを用いた電子部品

Also Published As

Publication number Publication date
JP2008263165A (ja) 2008-10-30
CN101272034A (zh) 2008-09-24
CN101272034B (zh) 2010-09-29
TWI387171B (zh) 2013-02-21
TW200843265A (en) 2008-11-01
KR100941106B1 (ko) 2010-02-10
KR20080085687A (ko) 2008-09-24

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