TWI386500B - 薄膜沉積裝置及其系統 - Google Patents
薄膜沉積裝置及其系統 Download PDFInfo
- Publication number
- TWI386500B TWI386500B TW099114629A TW99114629A TWI386500B TW I386500 B TWI386500 B TW I386500B TW 099114629 A TW099114629 A TW 099114629A TW 99114629 A TW99114629 A TW 99114629A TW I386500 B TWI386500 B TW I386500B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate holder
- chamber
- thin film
- chambers
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090039826A KR101119853B1 (ko) | 2009-05-07 | 2009-05-07 | 박막 증착 장치 및 이를 구비하는 박막 증착 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201107507A TW201107507A (en) | 2011-03-01 |
TWI386500B true TWI386500B (zh) | 2013-02-21 |
Family
ID=43050634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099114629A TWI386500B (zh) | 2009-05-07 | 2010-05-07 | 薄膜沉積裝置及其系統 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5506917B2 (fr) |
KR (1) | KR101119853B1 (fr) |
CN (1) | CN102421933B (fr) |
TW (1) | TWI386500B (fr) |
WO (1) | WO2010128811A2 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101151234B1 (ko) * | 2010-03-30 | 2012-06-14 | 주식회사 케이씨텍 | 직립방식 증착장치 및 기판 이송 방법 |
KR101700608B1 (ko) * | 2011-04-15 | 2017-02-01 | 이찬용 | 기판처리장치 |
JP5846780B2 (ja) * | 2011-06-30 | 2016-01-20 | 株式会社アルバック | 真空処理装置及び真空処理方法、リチウムイオン二次電池の製造方法 |
KR101467195B1 (ko) * | 2013-05-14 | 2014-12-01 | 주식회사 아바코 | 가스 분사기 및 이를 포함하는 박막 증착 장치 |
KR102426712B1 (ko) * | 2015-02-16 | 2022-07-29 | 삼성디스플레이 주식회사 | 표시 장치 제조 장치 및 표시 장치 제조 방법 |
EP3394881A1 (fr) * | 2017-03-17 | 2018-10-31 | Applied Materials, Inc. | Procédés de manipulation d'un dispositif de masquage dans un système sous vide, appareil de manipulation de masque et système sous vide |
CN110998869B (zh) * | 2017-08-09 | 2022-12-27 | 株式会社钟化 | 光电转换元件的制造方法 |
WO2019034255A1 (fr) * | 2017-08-17 | 2019-02-21 | Applied Materials, Inc. | Procédé de manipulation de plusieurs masques, procédé de traitement de substrats et appareil de revêtement de substrats |
KR101921648B1 (ko) * | 2017-12-28 | 2018-11-26 | 주식회사 올레드온 | 수직형 면증발원을 이용한 고해상도 amoled 소자의 클러스터형 양산장비 |
KR20210081597A (ko) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | 성막 시스템 및 전자 디바이스 제조방법 |
KR102407505B1 (ko) * | 2020-04-29 | 2022-06-13 | 주식회사 선익시스템 | 증착 장치 및 인라인 증착 시스템 |
CN111663104A (zh) * | 2020-06-24 | 2020-09-15 | 武汉华星光电半导体显示技术有限公司 | 蒸镀系统及蒸镀方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI258516B (en) * | 2003-08-28 | 2006-07-21 | Anelva Corp | Thin-film deposition system |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0299959U (fr) * | 1989-01-24 | 1990-08-09 | ||
JPH051378A (ja) * | 1991-03-25 | 1993-01-08 | Shin Meiwa Ind Co Ltd | インライン成膜装置における基板ホルダの搬送装置 |
JPH0941142A (ja) * | 1995-07-26 | 1997-02-10 | Balzers & Leybold Deutsche Holding Ag | 真空中で被覆したい基板を交互に位置決めする装置 |
JP2000277585A (ja) * | 1999-03-23 | 2000-10-06 | Hitachi Ltd | 基板搬送装置および真空処理装置 |
WO2004028214A1 (fr) * | 2002-09-20 | 2004-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Systeme de fabrication et procede de production d'un dispositif electroluminescent |
JP2004146369A (ja) * | 2002-09-20 | 2004-05-20 | Semiconductor Energy Lab Co Ltd | 製造装置および発光装置の作製方法 |
KR20040088238A (ko) * | 2003-04-09 | 2004-10-16 | (주)네스디스플레이 | 진공증착 시스템과 방법 |
EP1775353B1 (fr) | 2005-09-15 | 2008-10-08 | Applied Materials GmbH & Co. KG | Installation de revêtement et procédé d'opération d'une installation de revêtement |
JP2007239071A (ja) | 2006-03-10 | 2007-09-20 | Fujifilm Corp | 真空蒸着装置 |
JP2008019477A (ja) * | 2006-07-13 | 2008-01-31 | Canon Inc | 真空蒸着装置 |
-
2009
- 2009-05-07 KR KR1020090039826A patent/KR101119853B1/ko active IP Right Grant
-
2010
- 2010-05-06 WO PCT/KR2010/002887 patent/WO2010128811A2/fr active Application Filing
- 2010-05-06 JP JP2012509732A patent/JP5506917B2/ja active Active
- 2010-05-06 CN CN201080020337.9A patent/CN102421933B/zh not_active Expired - Fee Related
- 2010-05-07 TW TW099114629A patent/TWI386500B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI258516B (en) * | 2003-08-28 | 2006-07-21 | Anelva Corp | Thin-film deposition system |
Also Published As
Publication number | Publication date |
---|---|
WO2010128811A3 (fr) | 2011-03-17 |
TW201107507A (en) | 2011-03-01 |
CN102421933B (zh) | 2014-07-23 |
JP2012526199A (ja) | 2012-10-25 |
JP5506917B2 (ja) | 2014-05-28 |
KR20100120941A (ko) | 2010-11-17 |
KR101119853B1 (ko) | 2012-02-28 |
CN102421933A (zh) | 2012-04-18 |
WO2010128811A2 (fr) | 2010-11-11 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |