TWI386500B - 薄膜沉積裝置及其系統 - Google Patents

薄膜沉積裝置及其系統 Download PDF

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Publication number
TWI386500B
TWI386500B TW099114629A TW99114629A TWI386500B TW I386500 B TWI386500 B TW I386500B TW 099114629 A TW099114629 A TW 099114629A TW 99114629 A TW99114629 A TW 99114629A TW I386500 B TWI386500 B TW I386500B
Authority
TW
Taiwan
Prior art keywords
substrate
substrate holder
chamber
thin film
chambers
Prior art date
Application number
TW099114629A
Other languages
English (en)
Chinese (zh)
Other versions
TW201107507A (en
Inventor
Kyung Bin Bae
Hyung Seok Yoon
Chang Ho Kang
Original Assignee
Snu Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd
Publication of TW201107507A publication Critical patent/TW201107507A/zh
Application granted granted Critical
Publication of TWI386500B publication Critical patent/TWI386500B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
TW099114629A 2009-05-07 2010-05-07 薄膜沉積裝置及其系統 TWI386500B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090039826A KR101119853B1 (ko) 2009-05-07 2009-05-07 박막 증착 장치 및 이를 구비하는 박막 증착 시스템

Publications (2)

Publication Number Publication Date
TW201107507A TW201107507A (en) 2011-03-01
TWI386500B true TWI386500B (zh) 2013-02-21

Family

ID=43050634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099114629A TWI386500B (zh) 2009-05-07 2010-05-07 薄膜沉積裝置及其系統

Country Status (5)

Country Link
JP (1) JP5506917B2 (fr)
KR (1) KR101119853B1 (fr)
CN (1) CN102421933B (fr)
TW (1) TWI386500B (fr)
WO (1) WO2010128811A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101151234B1 (ko) * 2010-03-30 2012-06-14 주식회사 케이씨텍 직립방식 증착장치 및 기판 이송 방법
KR101700608B1 (ko) * 2011-04-15 2017-02-01 이찬용 기판처리장치
JP5846780B2 (ja) * 2011-06-30 2016-01-20 株式会社アルバック 真空処理装置及び真空処理方法、リチウムイオン二次電池の製造方法
KR101467195B1 (ko) * 2013-05-14 2014-12-01 주식회사 아바코 가스 분사기 및 이를 포함하는 박막 증착 장치
KR102426712B1 (ko) * 2015-02-16 2022-07-29 삼성디스플레이 주식회사 표시 장치 제조 장치 및 표시 장치 제조 방법
EP3394881A1 (fr) * 2017-03-17 2018-10-31 Applied Materials, Inc. Procédés de manipulation d'un dispositif de masquage dans un système sous vide, appareil de manipulation de masque et système sous vide
CN110998869B (zh) * 2017-08-09 2022-12-27 株式会社钟化 光电转换元件的制造方法
WO2019034255A1 (fr) * 2017-08-17 2019-02-21 Applied Materials, Inc. Procédé de manipulation de plusieurs masques, procédé de traitement de substrats et appareil de revêtement de substrats
KR101921648B1 (ko) * 2017-12-28 2018-11-26 주식회사 올레드온 수직형 면증발원을 이용한 고해상도 ａｍｏｌｅｄ 소자의 클러스터형 양산장비
KR20210081597A (ko) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 성막 시스템　및 전자 디바이스 제조방법
KR102407505B1 (ko) * 2020-04-29 2022-06-13 주식회사 선익시스템 증착 장치 및 인라인 증착 시스템
CN111663104A (zh) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 蒸镀系统及蒸镀方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI258516B (en) * 2003-08-28 2006-07-21 Anelva Corp Thin-film deposition system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299959U (fr) * 1989-01-24 1990-08-09
JPH051378A (ja) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd インライン成膜装置における基板ホルダの搬送装置
JPH0941142A (ja) * 1995-07-26 1997-02-10 Balzers & Leybold Deutsche Holding Ag 真空中で被覆したい基板を交互に位置決めする装置
JP2000277585A (ja) * 1999-03-23 2000-10-06 Hitachi Ltd 基板搬送装置および真空処理装置
WO2004028214A1 (fr) * 2002-09-20 2004-04-01 Semiconductor Energy Laboratory Co., Ltd. Systeme de fabrication et procede de production d'un dispositif electroluminescent
JP2004146369A (ja) * 2002-09-20 2004-05-20 Semiconductor Energy Lab Co Ltd 製造装置および発光装置の作製方法
KR20040088238A (ko) * 2003-04-09 2004-10-16 (주)네스디스플레이 진공증착 시스템과 방법
EP1775353B1 (fr) 2005-09-15 2008-10-08 Applied Materials GmbH & Co. KG Installation de revêtement et procédé d'opération d'une installation de revêtement
JP2007239071A (ja) 2006-03-10 2007-09-20 Fujifilm Corp 真空蒸着装置
JP2008019477A (ja) * 2006-07-13 2008-01-31 Canon Inc 真空蒸着装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI258516B (en) * 2003-08-28 2006-07-21 Anelva Corp Thin-film deposition system

Also Published As

Publication number Publication date
WO2010128811A3 (fr) 2011-03-17
TW201107507A (en) 2011-03-01
CN102421933B (zh) 2014-07-23
JP2012526199A (ja) 2012-10-25
JP5506917B2 (ja) 2014-05-28
KR20100120941A (ko) 2010-11-17
KR101119853B1 (ko) 2012-02-28
CN102421933A (zh) 2012-04-18
WO2010128811A2 (fr) 2010-11-11

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