TWI385793B - 具對稱場效電晶體配置之像素 - Google Patents

具對稱場效電晶體配置之像素 Download PDF

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TWI385793B
TWI385793B TW095119247A TW95119247A TWI385793B TW I385793 B TWI385793 B TW I385793B TW 095119247 A TW095119247 A TW 095119247A TW 95119247 A TW95119247 A TW 95119247A TW I385793 B TWI385793 B TW I385793B
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photodetector
transistors
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TW200703633A (en
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Robert M Guidash
Timothy J Kenney
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Omnivision Tech Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14641Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

具對稱場效電晶體配置之像素
本發明一般係關於具有共享一放大器的複數個光二極體的CMOS影像感測器的領域,更明確地說,係關於具有複數個場效電晶體(FET)的CMOS影像感測器,其中該等場效電晶體的位置和該影像感測器中的「單元細胞(unit cell)」中的每個光二極體具有實質上相等的距離。
參考圖1,圖中所示的係共享一放大器(源極隨耦器電晶體SF)的兩個光二極體的概略電路圖。該等光二極體會透過各自的傳輸閘TG1與TG2將它們的電荷傳輸至個別的浮動擴散極FD1與FD2。
參考圖2,圖中所示的係一典型先前技術影像感測器的概略電路圖,圖中的放大器(源極隨耦器電晶體SF)會共享四個光二極體PD1、PD2、PD3以及PD4。圖2的操作方式和圖1雷同,其方式如下:該等光二極體PD1、PD2、PD3以及PD4會透過各自的傳輸閘TG1、TG2、TG3以及TG4將它們的電荷傳輸至個別的浮動擴散區FD1、FD2、FD3以及FD4。
參考圖3與4,分別為圖1與2的俯視圖。該影像感測器包含該等複數個光二極體以及和它們相關聯非對稱配置在該影像感測器單元細胞內且與該等光二極體具有不同距離的場效電晶體(FET)。該等FET係用來為該影像感測器提供各種功能,如放大、重置以及列選擇。圖1與2的設計會最大化光學填充因數,不過由於每個光二極體週遭區域的光學與靜電不對稱性的關係,其仍可能有光學增益固定圖案雜訊。
雖然先前技術的影像感測器已令人感到滿意,不過,其卻具有光學增益固定圖案雜訊之類的缺點。所以,必須降低此光學增益固定圖案雜訊,同時最大化光學填充因數。
本發明可克服上述一或多項問題。簡言之,根據本發明一觀點,本發明提供一種影像感測器,其包含配置在一陣列中的複數個光偵測器;以及複數個FET,該等FET於功能上係由該等光偵測器共享,其中每個光偵測器至一鄰近FET的距離實質上相同。
配合下面的說明與圖式將會更明白本發明前述及其它的目的,其中,可能的話,會使用相同的元件符號來表示該等圖式共用的相同元件。
本發明的優點
本發明的優點係降低共享放大器像素中的增益固定雜訊。
於下文說明中,將會以軟體程式作為較佳具體實施例來說明本發明。熟習本技術的人士將會輕易瞭解此軟體亦可等效地建構於硬體之中。
參考圖5,圖中顯示的係本發明的影像感測器10的概略電路圖,其具有兩個光偵測器,該等光偵測器以光二極體(PD1與PD2)20與30為宜,每一光二極體均會響應於入射光來累積電荷。兩個傳輸閘(TG1與TG2)40與50會被分別電連接至每個光二極體20與30,且該等傳輸閘40與50會依序被提供一電壓脈衝,用以將電荷從該光二極體傳輸至其相關聯的浮動擴散區,該浮動擴散區會將電荷轉換成電壓信號。在將電荷從該等光二極體20與30傳輸至該等浮動擴散區70與80以前,重置電晶體(RG)60會先將每個浮動擴散區(n+)70與80的電壓設定為一參考電壓。
一源極隨耦器電晶體(SF)90或放大器會被每個浮動擴散區70與80共享,用以放大該電壓信號以輸出至一行匯流排110上。一列選擇信號線(RSEL)100會選擇要輸出至該行匯流排110的列。為清楚起見,請注意,該等傳輸閘40與50會依序在不同的時間處被供給脈衝,俾使在傳輸來自另一光二極體30的電荷之前,來自光二極體20的電荷會被傳輸至其相關聯的浮動擴散區70以便透過放大器90輸出至行匯流排110,用以為每個光二極體創造有區別的信號。
參考圖6,圖中顯示的係圖5的替代具體實施例,圖中有四個光二極體(額外增加光二極體25與35)共享放大器90。本具體實施例的功能和圖5相同,該等四個傳輸閘40、45、50以及55(請注意,額外增加傳輸閘45與55)會於時間上依序被提供一脈衝,用以將電荷傳輸至其個別的浮動擴散區70、75、80以及85(請注意,額外增加浮動擴散區75與85)。浮動擴散區70、75、80以及85會將電荷轉換成電壓,而且其會被源極隨耦器電晶體90放大用以輸出至行匯流排110。
參考圖7,圖中顯示的係圖5的俯視圖,圖中將複數個光二極體(PD)配置在一2 x 2陣列中。此群組四個光二極體及相關的FET會構成該像素陣列單元細胞。為清楚起見,圖中僅顯示四個光二極體,不過本發明的典型影像感測器10包含各種尺寸的百萬像素影像感測器,每個像素均具有一光二極體。還要注意的係,本文中的場效電晶體(FET)所指的係重置電晶體60以及源極隨耦器電晶體90。該些FET係被設計且實際擺設於該單元細胞之內,以便使其和該等四個光偵測器中每一者之附近具有對稱性。此外,該等FET的擺放位置會使得被施加至每個電晶體的電壓較佳係等於或實質等於每個該等光偵測器附近的靜電電位。又,請注意該等FET於功能上係由該等光偵測器(PD)來共享。
本文所述之本發明提供一種降低共享放大器像素中的光學增益固定圖案雜訊的方法。因為將該等FET擺放於該等像素中會產生複數個p-n接面,且該些接面會被偏壓至正電位,所以該等FET接面便能夠作為微弱的光偵測器且收集光生電子。當於該等FET附近沒有一重p井時,前述情形更是如此。就該單元細胞中的每個光偵測器來說,擺放該等FET時讓該共享的光偵測器群或單元細胞中的每一FET均和一相鄰光偵測器的距離相等或對稱(或實質上相等或實質上對稱),那麼該單元細胞中所有光偵測器的有效量子效率將會相同或實質雷同。圖7為本發明的設計,圖中FET的擺放方式會讓該單元細胞中的每個光偵測器會以實體相等的方式於其旁邊設置一FET。
換言之,每個光偵測器之間均包含一實質均勻的間距,且該等電晶體係以實質均勻的間距被擺放在該等光偵測器週遭的區域中。
參考圖8,圖中所示的係圖6的俯視圖,圖中將複數個光二極體(PD)配置在一2 x 4陣列中。此群組八個光二極體及相關的FET會構成該像素陣列單元細胞。同樣地,為清楚起見,圖中僅顯示八個光二極體,不過本發明的典型影像感測器10包含各種尺寸的百萬像素影像感測器,每個像素均具有一光二極體。如上述,本文所指的FET為重置電晶體60與源極隨耦器電晶體90,且其操作方式如上述。圖8所示的係本發明的設計,其中該FET的擺放方式會讓該單元細胞中的每個光偵測器(PD)會以實體相等的方式於其旁邊設置一FET。
參考圖9,圖中所示的係一具有影像感測器10的數位相機120的側視圖,其為普通消費者所熟悉的典型商用具體實施例。
10...影像感測器
20...光二極體
25...光二極體
30...光二極體
35...光二極體
40...傳輸閘
45...傳輸閘
50...傳輸閘
55...傳輸閘
60...重置電晶體
70...浮動擴散區
75...浮動擴散區
80...浮動擴散區
85...浮動擴散區
90...源極隨耦器電晶體或放大器
100...列選擇信號線
110...行匯流排
120...數位相機
圖1為先前技術影像感測器的概略電路圖,圖中圖解共享一放大器的兩個光二極體以及FET的位置;圖2為先前技術影像感測器的概略電路圖,圖中圖解共享一放大器的四個光二極體以及FET的位置;圖3為圖1的俯視圖;圖4為圖2的俯視圖;圖5為本發明的影像感測器的概略電路圖,圖中圖解共享一放大器的兩個光二極體;圖6為本發明的影像感測器的概略電路圖,圖中圖解共享一放大器的四個光二極體;圖7為圖5的俯視圖,圖中圖解FET的位置;圖8為圖6的俯視圖,圖中圖解FET的位置;以及圖9為本發明的數位相機的側視圖,其具有圖6的佈局。
10...影像感測器
20...光二極體
30...光二極體
40...傳輸閘
50...傳輸閘
60...重置電晶體
70...浮動擴散區
80...浮動擴散區
90...源極隨耦器電晶體或放大器
100...列選擇信號線
110...行匯流排

Claims (8)

  1. 一種影像感測器,其包括:(a)配置在一陣列中的複數個光偵測器;(b)複數個電晶體,由兩個或以上的該等光偵測器於功能共享該等電晶體,且選擇性地依照該兩個或以上的光偵測器上的電荷作動以產生一信號,其中每個光偵測器均包含一實質均勻的間距,且該等電晶體係以一實質均勻的間距置放在該等光偵測器週遭的一區域中,以使得在一光偵測器上的任一點至在一電晶體上的任一點之間的一距離實質上與在另一光偵測器上的任何相似點至在一對應電晶體上的任何相似點相同。
  2. 如請求項1之影像感測器,其中每個光偵測器至複數個功能共享電晶體的距離實質上相同。
  3. 如請求項1之影像感測器,其中施加至每個電晶體的一電位實質上相同。
  4. 如請求項2之影像感測器,其中施加至每個電晶體的一電位實質上相同。
  5. 一種數位相機,其包括:一影像感測器,其包括:(a)配置在一陣列中的複數個光偵測器;(b)複數個電晶體,由兩個或以上的該等光偵測器於功能共享該等電晶體,且選擇性地依照該兩個或以上的光偵測器上的電荷作動以產生一信號,其中每個光偵測器均包含一實質均勻的間距,且該等電晶體係以 一實質均勻的間距置放在該等光偵測器週遭的一區域中,以使得在一光偵測器上的任一點至在一電晶體上的任一點之間的一距離實質上與在另一光偵測器上的任何相似點至在一對應電晶體上的任何相似點相同。
  6. 如請求項5之數位相機,其中每個光偵測器至複數個功能共享電晶體的距離實質上相同。
  7. 如請求項5之數位相機,其中施加至每個電晶體的一電位實質上相同。
  8. 如請求項6之數位相機,其中施加至每個電晶體的一電位實質上相同。
TW095119247A 2005-06-01 2006-05-30 具對稱場效電晶體配置之像素 TWI385793B (zh)

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US11/432,573 US7342213B2 (en) 2005-06-01 2006-05-11 CMOS APS shared amplifier pixel with symmetrical field effect transistor placement

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7960768B2 (en) * 2008-01-17 2011-06-14 Aptina Imaging Corporation 3D backside illuminated image sensor with multiplexed pixel structure
TWI433307B (zh) * 2008-10-22 2014-04-01 Sony Corp 固態影像感測器、其驅動方法、成像裝置及電子器件
JP5029624B2 (ja) * 2009-01-15 2012-09-19 ソニー株式会社 固体撮像装置及び電子機器
FR2955701A1 (fr) * 2010-01-28 2011-07-29 St Microelectronics Sa Structure compacte de capteur d'image
JP5377549B2 (ja) * 2011-03-03 2013-12-25 株式会社東芝 固体撮像装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657665B1 (en) * 1998-12-31 2003-12-02 Eastman Kodak Company Active Pixel Sensor with wired floating diffusions and shared amplifier

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5933188A (en) 1994-10-19 1999-08-03 Canon Kabushiki Kaisha Photoelectric conversion apparatus and method with reset
US6160281A (en) 1997-02-28 2000-12-12 Eastman Kodak Company Active pixel sensor with inter-pixel function sharing
US6466266B1 (en) * 1998-07-28 2002-10-15 Eastman Kodak Company Active pixel sensor with shared row timing signals
JP3697073B2 (ja) 1998-08-05 2005-09-21 キヤノン株式会社 撮像装置及びそれを用いた撮像システム
US6956605B1 (en) 1998-08-05 2005-10-18 Canon Kabushiki Kaisha Image pickup apparatus
US6734906B1 (en) 1998-09-02 2004-05-11 Canon Kabushiki Kaisha Image pickup apparatus with photoelectric conversion portions arranged two dimensionally
JP3559714B2 (ja) * 1998-09-02 2004-09-02 キヤノン株式会社 撮像装置およびそれを用いた撮像システム
JP3585219B2 (ja) * 2000-08-25 2004-11-04 キヤノン株式会社 固体撮像装置および撮像システム
JP3792628B2 (ja) * 2002-09-02 2006-07-05 富士通株式会社 固体撮像装置及び画像読み出し方法
JP4298276B2 (ja) * 2002-12-03 2009-07-15 キヤノン株式会社 光電変換装置
JP3746769B2 (ja) * 2003-02-24 2006-02-15 新光電子株式会社 物品の寸法測定装置
JP4553612B2 (ja) * 2004-03-18 2010-09-29 ルネサスエレクトロニクス株式会社 撮像素子およびそれを備えた撮像装置
JP4230406B2 (ja) * 2004-04-27 2009-02-25 富士通マイクロエレクトロニクス株式会社 固体撮像装置
US7830437B2 (en) * 2005-05-11 2010-11-09 Aptina Imaging Corp. High fill factor multi-way shared pixel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657665B1 (en) * 1998-12-31 2003-12-02 Eastman Kodak Company Active Pixel Sensor with wired floating diffusions and shared amplifier

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TW200703633A (en) 2007-01-16
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US7342213B2 (en) 2008-03-11
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