TWI384542B - 處理裝置及表面處理治具 - Google Patents

處理裝置及表面處理治具 Download PDF

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Publication number
TWI384542B
TWI384542B TW96142480A TW96142480A TWI384542B TW I384542 B TWI384542 B TW I384542B TW 96142480 A TW96142480 A TW 96142480A TW 96142480 A TW96142480 A TW 96142480A TW I384542 B TWI384542 B TW I384542B
Authority
TW
Taiwan
Prior art keywords
processed
treatment
treated
liquid
jig
Prior art date
Application number
TW96142480A
Other languages
English (en)
Chinese (zh)
Other versions
TW200830398A (en
Inventor
Atsushi Miyanari
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200830398A publication Critical patent/TW200830398A/zh
Application granted granted Critical
Publication of TWI384542B publication Critical patent/TWI384542B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
TW96142480A 2006-11-30 2007-11-09 處理裝置及表面處理治具 TWI384542B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006324438A JP5038695B2 (ja) 2006-11-30 2006-11-30 処理装置および表面処理治具

Publications (2)

Publication Number Publication Date
TW200830398A TW200830398A (en) 2008-07-16
TWI384542B true TWI384542B (zh) 2013-02-01

Family

ID=39467606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96142480A TWI384542B (zh) 2006-11-30 2007-11-09 處理裝置及表面處理治具

Country Status (3)

Country Link
JP (1) JP5038695B2 (ja)
TW (1) TWI384542B (ja)
WO (1) WO2008065809A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
JP5687862B2 (ja) * 2010-08-06 2015-03-25 東京応化工業株式会社 洗浄装置、洗浄方法及び組成物
JP5945094B2 (ja) * 2010-12-03 2016-07-05 東京応化工業株式会社 基板の洗浄方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254968B (en) * 2003-12-02 2006-05-11 Dainippon Screen Mfg Substrate treating apparatus and substrate treating method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH047831A (ja) * 1990-04-25 1992-01-13 Seiko Epson Corp 基体乾燥方法及び基体乾燥装置
JPH1092784A (ja) * 1996-09-10 1998-04-10 Toshiba Microelectron Corp ウェーハ処理装置およびウェーハ処理方法
JP3511441B2 (ja) * 1996-11-29 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法
JP3338380B2 (ja) * 1998-07-27 2002-10-28 東邦化成株式会社 ウェーハ処理装置及びウェーハ処理方法
JP3772056B2 (ja) * 1998-10-12 2006-05-10 株式会社東芝 半導体基板の洗浄方法
JP4215900B2 (ja) * 1999-08-13 2009-01-28 アルプス電気株式会社 ウェット処理用ノズル装置およびウェット処理装置
JP3958539B2 (ja) * 2001-08-02 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI254968B (en) * 2003-12-02 2006-05-11 Dainippon Screen Mfg Substrate treating apparatus and substrate treating method

Also Published As

Publication number Publication date
WO2008065809A1 (fr) 2008-06-05
JP2008140909A (ja) 2008-06-19
TW200830398A (en) 2008-07-16
JP5038695B2 (ja) 2012-10-03

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