TWI383467B - Stage device - Google Patents

Stage device Download PDF

Info

Publication number
TWI383467B
TWI383467B TW097109874A TW97109874A TWI383467B TW I383467 B TWI383467 B TW I383467B TW 097109874 A TW097109874 A TW 097109874A TW 97109874 A TW97109874 A TW 97109874A TW I383467 B TWI383467 B TW I383467B
Authority
TW
Taiwan
Prior art keywords
base
frame
cans
upper frame
axis direction
Prior art date
Application number
TW097109874A
Other languages
English (en)
Chinese (zh)
Other versions
TW200926345A (en
Inventor
Tatsuya Yoshida
Yasuhito Nakamori
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200926345A publication Critical patent/TW200926345A/zh
Application granted granted Critical
Publication of TWI383467B publication Critical patent/TWI383467B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
TW097109874A 2007-12-12 2008-03-20 Stage device TWI383467B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007321307A JP4195497B2 (ja) 2007-12-12 2007-12-12 ステージ装置

Publications (2)

Publication Number Publication Date
TW200926345A TW200926345A (en) 2009-06-16
TWI383467B true TWI383467B (zh) 2013-01-21

Family

ID=39242917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097109874A TWI383467B (zh) 2007-12-12 2008-03-20 Stage device

Country Status (4)

Country Link
JP (1) JP4195497B2 (ko)
KR (1) KR100993473B1 (ko)
CN (1) CN101459103B (ko)
TW (1) TWI383467B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225687A (ja) * 2009-03-19 2010-10-07 Shibaura Mechatronics Corp 基板の処理装置
EP2416917B1 (en) * 2009-04-07 2014-10-29 Trumpf, Inc. A workpiece processing machine with a processing head, a suction duct and structural connecting frame section for transporting the processing machine
KR101387680B1 (ko) 2009-04-07 2014-04-23 트럼프 인크. 커팅 장치 및 공작물의 커팅 방법
JP5380225B2 (ja) * 2009-09-24 2014-01-08 株式会社日立ハイテクノロジーズ ガラス基板の検査装置
WO2011059003A1 (ja) * 2009-11-10 2011-05-19 株式会社アルバック 検査装置
KR101055214B1 (ko) * 2010-08-02 2011-08-09 김복인 현장조립형 중,대형 가공기
EP2689889B1 (en) * 2011-03-24 2015-07-22 Murata Machinery, Ltd. Machine tool system
CN103594280B (zh) * 2013-10-31 2015-08-26 西安交通大学 一种新型复合触头真空灭弧室及其应用的真空断路器
DE102017007962A1 (de) * 2017-08-24 2019-02-28 Deckel Maho Seebach Gmbh Werkzeugmaschine
CN113710405B (zh) * 2019-04-25 2022-10-14 三菱电机株式会社 激光加工机
CN110000578A (zh) * 2019-04-29 2019-07-12 广船国际有限公司 一种镗孔设备的支撑结构及法兰的加工方法
JP7223289B2 (ja) * 2020-09-24 2023-02-16 日新イオン機器株式会社 搬送装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002465A (en) * 1996-10-15 1999-12-14 Canon Kabushiki Kaisha Stage device, exposure apparatus using the same, and device production method
US6266133B1 (en) * 1998-05-06 2001-07-24 Canon Kabushiki Kaisha Stage device, an exposure apparatus and a device manufacturing method using the same
JP2002365026A (ja) * 2001-06-07 2002-12-18 Sigma Technos Kk 基板検査装置
JP2006224039A (ja) * 2005-02-21 2006-08-31 Dainippon Printing Co Ltd パターン形成装置、パターニング方法、基板処理装置、基板処理方法
JP2006269509A (ja) * 2005-03-22 2006-10-05 Nsk Ltd 位置決め装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4197238B2 (ja) * 2002-05-24 2008-12-17 大日本スクリーン製造株式会社 基板処理装置
JP2006049384A (ja) * 2004-07-30 2006-02-16 Laserfront Technologies Inc ガントリー型ｘｙステージ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002465A (en) * 1996-10-15 1999-12-14 Canon Kabushiki Kaisha Stage device, exposure apparatus using the same, and device production method
US6266133B1 (en) * 1998-05-06 2001-07-24 Canon Kabushiki Kaisha Stage device, an exposure apparatus and a device manufacturing method using the same
JP2002365026A (ja) * 2001-06-07 2002-12-18 Sigma Technos Kk 基板検査装置
JP2006224039A (ja) * 2005-02-21 2006-08-31 Dainippon Printing Co Ltd パターン形成装置、パターニング方法、基板処理装置、基板処理方法
JP2006269509A (ja) * 2005-03-22 2006-10-05 Nsk Ltd 位置決め装置

Also Published As

Publication number Publication date
KR100993473B1 (ko) 2010-11-10
TW200926345A (en) 2009-06-16
CN101459103A (zh) 2009-06-17
JP2008060614A (ja) 2008-03-13
KR20090063076A (ko) 2009-06-17
CN101459103B (zh) 2011-11-30
JP4195497B2 (ja) 2008-12-10

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MM4A Annulment or lapse of patent due to non-payment of fees