TWI382100B - 於一致速率下蒸發物質 - Google Patents

於一致速率下蒸發物質 Download PDF

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Publication number
TWI382100B
TWI382100B TW095127216A TW95127216A TWI382100B TW I382100 B TWI382100 B TW I382100B TW 095127216 A TW095127216 A TW 095127216A TW 95127216 A TW95127216 A TW 95127216A TW I382100 B TWI382100 B TW I382100B
Authority
TW
Taiwan
Prior art keywords
heating element
rate
column
substance
vaporization
Prior art date
Application number
TW095127216A
Other languages
English (en)
Chinese (zh)
Other versions
TW200710240A (en
Inventor
Michael Long
Bruce Edward Koppe
Original Assignee
Global Oled Technology Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Oled Technology Llc filed Critical Global Oled Technology Llc
Publication of TW200710240A publication Critical patent/TW200710240A/zh
Application granted granted Critical
Publication of TWI382100B publication Critical patent/TWI382100B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW095127216A 2005-07-27 2006-07-26 於一致速率下蒸發物質 TWI382100B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/190,653 US7989021B2 (en) 2005-07-27 2005-07-27 Vaporizing material at a uniform rate

Publications (2)

Publication Number Publication Date
TW200710240A TW200710240A (en) 2007-03-16
TWI382100B true TWI382100B (zh) 2013-01-11

Family

ID=37432381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127216A TWI382100B (zh) 2005-07-27 2006-07-26 於一致速率下蒸發物質

Country Status (7)

Country Link
US (2) US7989021B2 (enExample)
EP (1) EP1924721B1 (enExample)
JP (1) JP5139287B2 (enExample)
KR (1) KR101218228B1 (enExample)
CN (1) CN100575537C (enExample)
TW (1) TWI382100B (enExample)
WO (1) WO2007015948A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8062427B2 (en) * 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
WO2011103170A1 (en) * 2010-02-16 2011-08-25 Nextteq, Llc Containers for fluids with composite agile walls
JP2013104127A (ja) * 2011-11-16 2013-05-30 Mitsubishi Heavy Ind Ltd 真空蒸着装置
KR102073745B1 (ko) * 2013-04-02 2020-02-05 주식회사 선익시스템 증발원 및 이를 구비한 증착장치
CN106947941B (zh) * 2017-04-13 2019-12-06 合肥鑫晟光电科技有限公司 蒸镀系统
CN108060392B (zh) * 2017-12-14 2023-07-18 深圳先进技术研究院 一种可控线性蒸发装置及镀膜方法
KR20200076389A (ko) * 2018-12-19 2020-06-29 주식회사 포스코 Pvd 도금 공정에서의 도금층 제어 장치 및 방법
DE102020123764A1 (de) * 2020-09-11 2022-03-17 Apeva Se Verfahren zum Erzeugen eines zeitlich konstanten Dampfflusses sowie Verfahren zum Einstellen eines Arbeitspunktes einer Vorrichtung zum Erzeugen eines Dampfes

Citations (6)

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US20030008071A1 (en) * 2001-07-03 2003-01-09 Eastman Kodak Company Method of handling organic material in making an organic light-emitting device
TW550304B (en) * 2000-10-20 2003-09-01 Ulvac Corp Apparatus and method of forming protection coating for plasma display
TW552313B (en) * 2001-08-13 2003-09-11 Jusung Eng Co Ltd Method of forming a MOCVD-TiN thin film
TW200304956A (en) * 2002-04-01 2003-10-16 Ans Inc Vapor organic material deposition method and vapor organic material deposition apparatus using the same
US20040062856A1 (en) * 2002-09-23 2004-04-01 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
US20050072361A1 (en) * 2003-10-03 2005-04-07 Yimou Yang Multi-layered radiant thermal evaporator and method of use

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US2447789A (en) 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
JPS59177365A (ja) * 1983-03-24 1984-10-08 Matsushita Electric Ind Co Ltd 蒸発方法とその装置
US4861989A (en) * 1983-08-30 1989-08-29 Research Corporation Technologies, Inc. Ion vapor source for mass spectrometry of liquids
CN2122671U (zh) * 1992-05-26 1992-11-25 王守成 螺旋管式旋转薄膜蒸发器
EP0585848A1 (de) 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
US6296711B1 (en) 1998-04-14 2001-10-02 Cvd Systems, Inc. Film processing system
US6358323B1 (en) * 1998-07-21 2002-03-19 Applied Materials, Inc. Method and apparatus for improved control of process and purge material in a substrate processing system
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機el素子用蒸発源、この有機el素子用蒸発源を用いた有機el素子の製造装置および製造方法
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
WO2002020864A2 (en) * 2000-06-16 2002-03-14 Applied Materials, Inc. System and method for depositing high dielectric constant materials and compatible conductive materials
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
JP2003293121A (ja) * 2002-04-05 2003-10-15 Cluster Ion Beam Technology Kk 蒸着材料供給手段を備えた蒸着用坩堝
US7232588B2 (en) * 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
US7501151B2 (en) 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone
US20060099344A1 (en) 2004-11-09 2006-05-11 Eastman Kodak Company Controlling the vaporization of organic material
US7465475B2 (en) 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
US7794788B2 (en) * 2007-03-28 2010-09-14 Tokyo Electron Limited Method for pre-conditioning a precursor vaporization system for a vapor deposition process
US8133362B2 (en) * 2010-02-26 2012-03-13 Fujifilm Corporation Physical vapor deposition with multi-point clamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW550304B (en) * 2000-10-20 2003-09-01 Ulvac Corp Apparatus and method of forming protection coating for plasma display
US20030008071A1 (en) * 2001-07-03 2003-01-09 Eastman Kodak Company Method of handling organic material in making an organic light-emitting device
TW552313B (en) * 2001-08-13 2003-09-11 Jusung Eng Co Ltd Method of forming a MOCVD-TiN thin film
TW200304956A (en) * 2002-04-01 2003-10-16 Ans Inc Vapor organic material deposition method and vapor organic material deposition apparatus using the same
US20040062856A1 (en) * 2002-09-23 2004-04-01 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
US20050072361A1 (en) * 2003-10-03 2005-04-07 Yimou Yang Multi-layered radiant thermal evaporator and method of use

Also Published As

Publication number Publication date
CN101248206A (zh) 2008-08-20
WO2007015948A1 (en) 2007-02-08
US20110247562A1 (en) 2011-10-13
JP2009503256A (ja) 2009-01-29
US7989021B2 (en) 2011-08-02
TW200710240A (en) 2007-03-16
JP5139287B2 (ja) 2013-02-06
KR20080031028A (ko) 2008-04-07
US20070026146A1 (en) 2007-02-01
KR101218228B1 (ko) 2013-01-04
CN100575537C (zh) 2009-12-30
EP1924721B1 (en) 2014-07-02
EP1924721A1 (en) 2008-05-28

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