CN100575537C - 以均匀速率蒸发材料的方法 - Google Patents

以均匀速率蒸发材料的方法 Download PDF

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Publication number
CN100575537C
CN100575537C CN200680027360A CN200680027360A CN100575537C CN 100575537 C CN100575537 C CN 100575537C CN 200680027360 A CN200680027360 A CN 200680027360A CN 200680027360 A CN200680027360 A CN 200680027360A CN 100575537 C CN100575537 C CN 100575537C
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CN
China
Prior art keywords
heating unit
vaporizable material
constant
post
heating element
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CN200680027360A
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English (en)
Chinese (zh)
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CN101248206A (zh
Inventor
M·龙
B·E·寇佩
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Global OLED Technology LLC
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Eastman Kodak Co
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Publication of CN101248206A publication Critical patent/CN101248206A/zh
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/246Replenishment of source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN200680027360A 2005-07-27 2006-07-20 以均匀速率蒸发材料的方法 Active CN100575537C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/190,653 2005-07-27
US11/190,653 US7989021B2 (en) 2005-07-27 2005-07-27 Vaporizing material at a uniform rate

Publications (2)

Publication Number Publication Date
CN101248206A CN101248206A (zh) 2008-08-20
CN100575537C true CN100575537C (zh) 2009-12-30

Family

ID=37432381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680027360A Active CN100575537C (zh) 2005-07-27 2006-07-20 以均匀速率蒸发材料的方法

Country Status (7)

Country Link
US (2) US7989021B2 (enExample)
EP (1) EP1924721B1 (enExample)
JP (1) JP5139287B2 (enExample)
KR (1) KR101218228B1 (enExample)
CN (1) CN100575537C (enExample)
TW (1) TWI382100B (enExample)
WO (1) WO2007015948A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8062427B2 (en) * 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
WO2011103170A1 (en) * 2010-02-16 2011-08-25 Nextteq, Llc Containers for fluids with composite agile walls
JP2013104127A (ja) * 2011-11-16 2013-05-30 Mitsubishi Heavy Ind Ltd 真空蒸着装置
KR102073745B1 (ko) * 2013-04-02 2020-02-05 주식회사 선익시스템 증발원 및 이를 구비한 증착장치
CN106947941B (zh) * 2017-04-13 2019-12-06 合肥鑫晟光电科技有限公司 蒸镀系统
CN108060392B (zh) * 2017-12-14 2023-07-18 深圳先进技术研究院 一种可控线性蒸发装置及镀膜方法
KR20200076389A (ko) * 2018-12-19 2020-06-29 주식회사 포스코 Pvd 도금 공정에서의 도금층 제어 장치 및 방법
DE102020123764A1 (de) * 2020-09-11 2022-03-17 Apeva Se Verfahren zum Erzeugen eines zeitlich konstanten Dampfflusses sowie Verfahren zum Einstellen eines Arbeitspunktes einer Vorrichtung zum Erzeugen eines Dampfes

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2122671U (zh) * 1992-05-26 1992-11-25 王守成 螺旋管式旋转薄膜蒸发器
CN1317056A (zh) * 1998-07-21 2001-10-10 应用材料有限公司 Cvd装置

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US2447789A (en) 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
JPS59177365A (ja) * 1983-03-24 1984-10-08 Matsushita Electric Ind Co Ltd 蒸発方法とその装置
US4861989A (en) * 1983-08-30 1989-08-29 Research Corporation Technologies, Inc. Ion vapor source for mass spectrometry of liquids
EP0585848A1 (de) 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
US6296711B1 (en) 1998-04-14 2001-10-02 Cvd Systems, Inc. Film processing system
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機el素子用蒸発源、この有機el素子用蒸発源を用いた有機el素子の製造装置および製造方法
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
WO2002020864A2 (en) * 2000-06-16 2002-03-14 Applied Materials, Inc. System and method for depositing high dielectric constant materials and compatible conductive materials
JP4570232B2 (ja) * 2000-10-20 2010-10-27 株式会社アルバック プラズマディスプレイ保護膜形成装置および保護膜形成方法
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6797314B2 (en) * 2001-07-03 2004-09-28 Eastman Kodak Company Method of handling organic material in making an organic light-emitting device
TW552313B (en) * 2001-08-13 2003-09-11 Jusung Eng Co Ltd Method of forming a MOCVD-TiN thin film
AU2003217530A1 (en) * 2002-04-01 2003-10-13 Ans Inc Apparatus and method for depositing organic matter of vapor phase
JP2003293121A (ja) * 2002-04-05 2003-10-15 Cluster Ion Beam Technology Kk 蒸着材料供給手段を備えた蒸着用坩堝
US7067170B2 (en) * 2002-09-23 2006-06-27 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
US7232588B2 (en) * 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
US7501151B2 (en) 2004-09-21 2009-03-10 Eastman Kodak Company Delivering particulate material to a vaporization zone
US20060099344A1 (en) 2004-11-09 2006-05-11 Eastman Kodak Company Controlling the vaporization of organic material
US7465475B2 (en) 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
US7794788B2 (en) * 2007-03-28 2010-09-14 Tokyo Electron Limited Method for pre-conditioning a precursor vaporization system for a vapor deposition process
US8133362B2 (en) * 2010-02-26 2012-03-13 Fujifilm Corporation Physical vapor deposition with multi-point clamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2122671U (zh) * 1992-05-26 1992-11-25 王守成 螺旋管式旋转薄膜蒸发器
CN1317056A (zh) * 1998-07-21 2001-10-10 应用材料有限公司 Cvd装置

Also Published As

Publication number Publication date
CN101248206A (zh) 2008-08-20
WO2007015948A1 (en) 2007-02-08
US20110247562A1 (en) 2011-10-13
JP2009503256A (ja) 2009-01-29
US7989021B2 (en) 2011-08-02
TW200710240A (en) 2007-03-16
JP5139287B2 (ja) 2013-02-06
KR20080031028A (ko) 2008-04-07
US20070026146A1 (en) 2007-02-01
KR101218228B1 (ko) 2013-01-04
EP1924721B1 (en) 2014-07-02
TWI382100B (zh) 2013-01-11
EP1924721A1 (en) 2008-05-28

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Owner name: GLOBAL OLED TECHNOLOGY CO., LTD.

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Effective date: 20100421

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Free format text: CORRECT: ADDRESS; FROM: NEW YORK, U.S.A. TO: DELAWARE, U.S.A.

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Patentee after: Global OLED Technology LLC

Address before: American New York

Patentee before: Eastman Kodak Co.