JP5139287B2 - 材料を一定速度で気化させる方法 - Google Patents

材料を一定速度で気化させる方法 Download PDF

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Publication number
JP5139287B2
JP5139287B2 JP2008523981A JP2008523981A JP5139287B2 JP 5139287 B2 JP5139287 B2 JP 5139287B2 JP 2008523981 A JP2008523981 A JP 2008523981A JP 2008523981 A JP2008523981 A JP 2008523981A JP 5139287 B2 JP5139287 B2 JP 5139287B2
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heating element
constant
rate
temperature
vaporization
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JP2008523981A
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English (en)
Japanese (ja)
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JP2009503256A (ja
JP2009503256A5 (enExample
Inventor
ロング，マイケル
エドワード コッペ，ブルース
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グローバル オーエルイーディー テクノロジー リミティド ライアビリティ カンパニー
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2008523981A 2005-07-27 2006-07-20 材料を一定速度で気化させる方法 Active JP5139287B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/190,653 2005-07-27
US11/190,653 US7989021B2 (en) 2005-07-27 2005-07-27 Vaporizing material at a uniform rate
PCT/US2006/028238 WO2007015948A1 (en) 2005-07-27 2006-07-20 Method for vaporizing material at a uniform rate

Publications (3)

Publication Number Publication Date
JP2009503256A JP2009503256A (ja) 2009-01-29
JP2009503256A5 JP2009503256A5 (enExample) 2009-05-07
JP5139287B2 true JP5139287B2 (ja) 2013-02-06

Family

ID=37432381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523981A Active JP5139287B2 (ja) 2005-07-27 2006-07-20 材料を一定速度で気化させる方法

Country Status (7)

Country Link
US (2) US7989021B2 (enExample)
EP (1) EP1924721B1 (enExample)
JP (1) JP5139287B2 (enExample)
KR (1) KR101218228B1 (enExample)
CN (1) CN100575537C (enExample)
TW (1) TWI382100B (enExample)
WO (1) WO2007015948A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8062427B2 (en) * 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
WO2011103170A1 (en) * 2010-02-16 2011-08-25 Nextteq, Llc Containers for fluids with composite agile walls
JP2013104127A (ja) * 2011-11-16 2013-05-30 Mitsubishi Heavy Ind Ltd 真空蒸着装置
KR102073745B1 (ko) * 2013-04-02 2020-02-05 주식회사 선익시스템 증발원 및 이를 구비한 증착장치
CN106947941B (zh) * 2017-04-13 2019-12-06 合肥鑫晟光电科技有限公司 蒸镀系统
CN108060392B (zh) * 2017-12-14 2023-07-18 深圳先进技术研究院 一种可控线性蒸发装置及镀膜方法
KR20200076389A (ko) * 2018-12-19 2020-06-29 주식회사 포스코 Pvd 도금 공정에서의 도금층 제어 장치 및 방법
DE102020123764A1 (de) * 2020-09-11 2022-03-17 Apeva Se Verfahren zum Erzeugen eines zeitlich konstanten Dampfflusses sowie Verfahren zum Einstellen eines Arbeitspunktes einer Vorrichtung zum Erzeugen eines Dampfes

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US2447789A (en) 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
JPS59177365A (ja) * 1983-03-24 1984-10-08 Matsushita Electric Ind Co Ltd 蒸発方法とその装置
US4861989A (en) * 1983-08-30 1989-08-29 Research Corporation Technologies, Inc. Ion vapor source for mass spectrometry of liquids
CN2122671U (zh) * 1992-05-26 1992-11-25 王守成 螺旋管式旋转薄膜蒸发器
EP0585848A1 (de) 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
US6296711B1 (en) 1998-04-14 2001-10-02 Cvd Systems, Inc. Film processing system
US6358323B1 (en) * 1998-07-21 2002-03-19 Applied Materials, Inc. Method and apparatus for improved control of process and purge material in a substrate processing system
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
WO2002020864A2 (en) * 2000-06-16 2002-03-14 Applied Materials, Inc. System and method for depositing high dielectric constant materials and compatible conductive materials
JP4570232B2 (ja) * 2000-10-20 2010-10-27 株式会社アルバック プラズマディスプレイ保護膜形成装置および保護膜形成方法
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6797314B2 (en) * 2001-07-03 2004-09-28 Eastman Kodak Company Method of handling organic material in making an organic light-emitting device
TW552313B (en) * 2001-08-13 2003-09-11 Jusung Eng Co Ltd Method of forming a MOCVD-TiN thin film
AU2003217530A1 (en) * 2002-04-01 2003-10-13 Ans Inc Apparatus and method for depositing organic matter of vapor phase
JP2003293121A (ja) * 2002-04-05 2003-10-15 Cluster Ion Beam Technology Kk 蒸着材料供給手段を備えた蒸着用坩堝
US7067170B2 (en) * 2002-09-23 2006-06-27 Eastman Kodak Company Depositing layers in OLED devices using viscous flow
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
US7232588B2 (en) * 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
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US8133362B2 (en) * 2010-02-26 2012-03-13 Fujifilm Corporation Physical vapor deposition with multi-point clamp

Also Published As

Publication number Publication date
CN101248206A (zh) 2008-08-20
WO2007015948A1 (en) 2007-02-08
US20110247562A1 (en) 2011-10-13
JP2009503256A (ja) 2009-01-29
US7989021B2 (en) 2011-08-02
TW200710240A (en) 2007-03-16
KR20080031028A (ko) 2008-04-07
US20070026146A1 (en) 2007-02-01
KR101218228B1 (ko) 2013-01-04
CN100575537C (zh) 2009-12-30
EP1924721B1 (en) 2014-07-02
TWI382100B (zh) 2013-01-11
EP1924721A1 (en) 2008-05-28

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