TWI381037B - An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure - Google Patents
An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure Download PDFInfo
- Publication number
- TWI381037B TWI381037B TW100126845A TW100126845A TWI381037B TW I381037 B TWI381037 B TW I381037B TW 100126845 A TW100126845 A TW 100126845A TW 100126845 A TW100126845 A TW 100126845A TW I381037 B TWI381037 B TW I381037B
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- Taiwan
- Prior art keywords
- particles
- conductive
- insulating
- insulating particles
- conductive particles
- Prior art date
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- NVTPMUHPCAUGCB-UHFFFAOYSA-N pentyl dihydrogen phosphate Chemical compound CCCCCOP(O)(O)=O NVTPMUHPCAUGCB-UHFFFAOYSA-N 0.000 description 1
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- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
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- ALKGSOOKRJKXMF-UHFFFAOYSA-N tetradecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCOP(O)O ALKGSOOKRJKXMF-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
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- IPBROXKVGHZHJV-UHFFFAOYSA-N tridecane-1-thiol Chemical compound CCCCCCCCCCCCCS IPBROXKVGHZHJV-UHFFFAOYSA-N 0.000 description 1
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- VAIOGRPEROWKJX-UHFFFAOYSA-N undecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCOP(O)(O)=O VAIOGRPEROWKJX-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010169502 | 2010-07-28 | ||
| JP2010169503 | 2010-07-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201213493A TW201213493A (en) | 2012-04-01 |
| TWI381037B true TWI381037B (zh) | 2013-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| TW100126845A TWI381037B (zh) | 2010-07-28 | 2011-07-28 | An electrically conductive particles having an insulating particle, an anisotropic conductive material, and a connecting structure |
Country Status (5)
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|---|---|
| JP (4) | JP5025825B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101242235B1 (enrdf_load_stackoverflow) |
| CN (1) | CN102884590B (enrdf_load_stackoverflow) |
| TW (1) | TWI381037B (enrdf_load_stackoverflow) |
| WO (1) | WO2012014925A1 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740807B (zh) * | 2014-10-29 | 2021-10-01 | 日商迪睿合股份有限公司 | 導電材料、連接構造體、及連接構造體之製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0250858A (ja) * | 1988-08-12 | 1990-02-20 | Tokyo Electric Co Ltd | 印刷装置 |
| JP5821552B2 (ja) * | 2011-11-10 | 2015-11-24 | 日立化成株式会社 | 撥水性導電粒子、異方導電材料及び導電接続構造体 |
| JP6333552B2 (ja) * | 2012-01-19 | 2018-05-30 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6188456B2 (ja) * | 2012-07-03 | 2017-08-30 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP6438186B2 (ja) * | 2012-09-06 | 2018-12-12 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP6212374B2 (ja) * | 2012-12-05 | 2017-10-11 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
| JP6357347B2 (ja) * | 2013-05-14 | 2018-07-11 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6357348B2 (ja) * | 2013-05-22 | 2018-07-11 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
| JP6426913B2 (ja) * | 2013-05-29 | 2018-11-21 | 積水化学工業株式会社 | 突起粒子、導電性粒子、導電材料及び接続構造体 |
| JP6392617B2 (ja) * | 2013-10-02 | 2018-09-19 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6453032B2 (ja) * | 2013-10-21 | 2019-01-16 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6450154B2 (ja) * | 2013-11-12 | 2019-01-09 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6397316B2 (ja) * | 2013-11-18 | 2018-09-26 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6739894B2 (ja) * | 2013-11-18 | 2020-08-12 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
| JP6119718B2 (ja) * | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
| JPWO2015105119A1 (ja) * | 2014-01-08 | 2017-03-23 | 積水化学工業株式会社 | バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール |
| CN105917418B (zh) * | 2014-01-08 | 2018-02-13 | 积水化学工业株式会社 | 背接触式太阳能电池模块用导电性粒子、导电材料及太阳能电池模块 |
| WO2015105121A1 (ja) * | 2014-01-08 | 2015-07-16 | 積水化学工業株式会社 | バックコンタクト方式の太陽電池モジュールの製造方法 |
| EP2942129B1 (de) * | 2014-05-05 | 2017-07-05 | Heraeus Deutschland GmbH & Co. KG | Metallpaste und deren Verwendung zum Verbinden von Bauelementen |
| JP6564302B2 (ja) * | 2014-10-28 | 2019-08-21 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
| KR102624796B1 (ko) * | 2015-09-24 | 2024-01-12 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전 재료, 및 접속 구조체 |
| KR102019298B1 (ko) * | 2016-07-04 | 2019-09-06 | 가부시키가이샤 스즈키 | 전사 방법 및 실장 방법 |
| US11407863B2 (en) | 2017-05-08 | 2022-08-09 | Nippon Chemical Industrial Co., Ltd. | Coated particles and production method therefor |
| JP7062555B2 (ja) * | 2018-08-27 | 2022-05-06 | 日本化学工業株式会社 | 被覆粒子 |
| JP7651875B2 (ja) | 2021-02-18 | 2025-03-27 | オムロン株式会社 | 入出力装置 |
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| JPH03112011A (ja) * | 1989-09-26 | 1991-05-13 | Catalysts & Chem Ind Co Ltd | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
| JPH04259766A (ja) * | 1991-02-14 | 1992-09-16 | Hitachi Chem Co Ltd | 回路の接続部材 |
| JP2010073578A (ja) * | 2008-09-19 | 2010-04-02 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
| JP2010103080A (ja) * | 2008-03-27 | 2010-05-06 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| KR20040052126A (ko) * | 2002-12-13 | 2004-06-19 | 엘지전선 주식회사 | 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체 |
| JP4724369B2 (ja) * | 2003-09-29 | 2011-07-13 | ソニーケミカル＆インフォメーションデバイス株式会社 | 導電粒子の製造方法 |
| JP5529431B2 (ja) * | 2008-03-27 | 2014-06-25 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
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2011
- 2011-07-27 KR KR1020127027323A patent/KR101242235B1/ko not_active Expired - Fee Related
- 2011-07-27 WO PCT/JP2011/067069 patent/WO2012014925A1/ja active Application Filing
- 2011-07-27 CN CN201180022694.3A patent/CN102884590B/zh not_active Expired - Fee Related
- 2011-07-27 JP JP2011535748A patent/JP5025825B2/ja active Active
- 2011-07-28 TW TW100126845A patent/TWI381037B/zh not_active IP Right Cessation
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2012
- 2012-01-16 JP JP2012006128A patent/JP4977276B2/ja active Active
- 2012-01-16 JP JP2012006127A patent/JP5850752B2/ja active Active
- 2012-07-04 JP JP2012150670A patent/JP5850806B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112011A (ja) * | 1989-09-26 | 1991-05-13 | Catalysts & Chem Ind Co Ltd | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
| JPH04259766A (ja) * | 1991-02-14 | 1992-09-16 | Hitachi Chem Co Ltd | 回路の接続部材 |
| JP2010103080A (ja) * | 2008-03-27 | 2010-05-06 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
| JP2010073578A (ja) * | 2008-09-19 | 2010-04-02 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740807B (zh) * | 2014-10-29 | 2021-10-01 | 日商迪睿合股份有限公司 | 導電材料、連接構造體、及連接構造體之製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5025825B2 (ja) | 2012-09-12 |
| JP2012094541A (ja) | 2012-05-17 |
| JP5850752B2 (ja) | 2016-02-03 |
| JP2012234821A (ja) | 2012-11-29 |
| KR101242235B1 (ko) | 2013-03-11 |
| JP2012124169A (ja) | 2012-06-28 |
| JP4977276B2 (ja) | 2012-07-18 |
| JP5850806B2 (ja) | 2016-02-03 |
| WO2012014925A1 (ja) | 2012-02-02 |
| TW201213493A (en) | 2012-04-01 |
| KR20120124075A (ko) | 2012-11-12 |
| CN102884590A (zh) | 2013-01-16 |
| CN102884590B (zh) | 2014-01-15 |
| JPWO2012014925A1 (ja) | 2013-09-12 |
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