WO2015105121A1 - バックコンタクト方式の太陽電池モジュールの製造方法 - Google Patents
バックコンタクト方式の太陽電池モジュールの製造方法 Download PDFInfo
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- WO2015105121A1 WO2015105121A1 PCT/JP2015/050234 JP2015050234W WO2015105121A1 WO 2015105121 A1 WO2015105121 A1 WO 2015105121A1 JP 2015050234 W JP2015050234 W JP 2015050234W WO 2015105121 A1 WO2015105121 A1 WO 2015105121A1
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- conductive
- electrode
- particles
- solar cell
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method for manufacturing a back contact type solar cell module.
- the solar cell module system includes a ribbon system and a back contact system.
- ribbon type solar cell modules have been mainly employed.
- back contact type solar cell module that can be expected to have high output and high conversion efficiency.
- the solar cell and the flexible printed circuit board are bonded together on the entire surface of the solar cell.
- Patent Document 1 a plurality of solar cells are arranged side by side in the arrangement of the modules with the back surface facing upward, and the P-type electrode and N-type electrode of adjacent solar cells are further electrically connected by an interconnector.
- stacked and integrated is disclosed.
- Patent Document 1 describes a method of connecting a wiring electrode of a flexible printed circuit board and an electrode of a solar battery cell with Cu, Ag, Au, Pt, Sn, an alloy containing these, or the like.
- one end side of the tab wire is disposed on the surface electrode of the solar battery cell via a conductive adhesive containing spherical conductive particles, and adjacent to the solar battery cell.
- There is disclosed a method for manufacturing a solar cell module including a step of connecting the tab wire to the front electrode and the back electrode by the conductive adhesive.
- a concavo-convex portion is formed on one surface in contact with the conductive adhesive.
- the average height (H) of the uneven part and the average particle diameter (D) of the conductive particles satisfy D ⁇ H.
- Patent Document 3 a base material, an aluminum wiring disposed on one surface of the base material via an adhesive layer, a solar battery cell having an electrode connected to the aluminum wiring,
- a method for manufacturing a solar cell module includes a sealing material for sealing a solar battery cell, and a translucent front plate on a surface opposite to the aluminum wiring of the sealing material.
- the manufacturing method described in Patent Document 3 includes a step of removing the oxide film of the aluminum wiring in advance by a flux, a step of applying aluminum paste solder to the aluminum wiring by printing or a dispenser, the aluminum wiring, and the sun. Connecting the electrodes of the battery cells with the aluminum paste solder.
- the aluminum paste solder includes aluminum powder and a synthetic resin.
- An object of the present invention is to provide a method of manufacturing a back contact type solar cell module capable of enhancing the conduction reliability between electrodes in the back contact type solar cell module.
- a method for manufacturing a back contact solar cell module wherein the flexible printed circuit board or the flexible printed circuit board having a wiring electrode on the surface, or the flexible printed circuit board or The flexible printed circuit board, using a first placement step of selectively placing a conductive material containing conductive particles and a binder resin on the wiring electrode of the resin film, and a solar cell having an electrode on the surface Alternatively, the flexible printed circuit board or the resin film and the solar battery cell are bonded so that the wiring electrode of the resin film and the electrode of the solar battery cell are electrically connected by the conductive particles.
- the flexible printed circuit board or the resin film the wiring electrode of the flexible printed circuit board or the resin film and the electrode of the solar battery cell are electrically connected by the conductive particles.
- a bonding step of bonding a solar battery cell and having, as the conductive particles, base material particles and a conductive part disposed on the surface of the base material particles, and an outer surface of the conductive part
- a back contact solar cell module manufacturing method using conductive particles having a plurality of protrusions is provided.
- the wiring electrode in the first arrangement step, is included in 100% by weight of the entire conductive material arranged on the flexible printed circuit board or the resin film.
- the amount of the conductive material disposed on the top is preferably 90% by weight or more, more preferably 99% by weight or more, or the conductive material disposed on the solar cells in the first placement step.
- the amount of the conductive material disposed on the electrode is preferably 90% by weight or more, more preferably 99% by weight or more, based on 100% by weight of the whole material.
- an average height of the plurality of protrusions in the conductive particles is 10 nm or more and 600 nm or less.
- the said wiring electrode of the said flexible printed circuit board or the said resin film is an aluminum wiring electrode, or the said electrode of the said photovoltaic cell is an aluminum electrode is there.
- positioning process which arrange
- the binder resin includes a thermosetting compound and a thermosetting agent.
- the manufacturing method of the solar cell module of the back contact system uses the flexible printed circuit board having the wiring electrode on the surface or the resin film having the wiring electrode on the surface, and the wiring electrode of the flexible printed circuit board or the resin film.
- the wiring of the flexible printed circuit board or the resin film using a first placement step of selectively placing a conductive material containing conductive particles and a binder resin, and a solar cell having an electrode on the surface.
- a bonding step of bonding the flexible printed circuit board or the resin film and the solar battery cell so that the electrode and the electrode of the solar battery cell are electrically connected by the conductive particles Or using a solar cell having an electrode on its surface, on the electrode of the solar cell
- a solar cell having an electrode on its surface, on the electrode of the solar cell Selectively using the first placement step of placing a conductive material containing conductive particles and a binder resin, and a flexible printed circuit board having a wiring electrode on the surface or a resin film having a wiring electrode on the surface
- the flexible printed circuit board or the resin film and the solar battery cell are bonded so that the wiring electrode of the substrate or the resin film and the electrode of the solar battery cell are electrically connected by the conductive particles.
- a bonding step and further having base particles and conductive portions arranged on the surfaces of the base particles as the conductive particles, and a plurality of protrusions on the outer surface of the conductive portions. Therefore, the reliability of conduction between the electrodes can be improved.
- FIG. 1 is a cross-sectional view showing a back contact type solar cell module obtained by the method of manufacturing a back contact type solar cell module according to the first embodiment of the present invention.
- FIGS. 2A to 2C are cross-sectional views for explaining the respective steps of the method for manufacturing the back contact type solar cell module according to the first embodiment of the present invention.
- FIGS. 3A to 3C are cross-sectional views for explaining each step of the method for manufacturing the back contact type solar cell module according to the second embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing conductive particles used in the method for manufacturing the solar cell module according to the first embodiment of the present invention.
- FIG. 5 is a cross-sectional view showing a first modification of the conductive particles.
- FIG. 6 is a cross-sectional view showing a second modification of the conductive particles.
- a flexible printed circuit board having a wiring electrode on its surface or a resin film having a wiring electrode on its surface, a solar cell having an electrode on its surface, and a conductive material Use.
- the conductive material includes conductive particles and a binder resin.
- the method of manufacturing a back contact solar cell module according to the present invention includes the following first process configuration or includes the following second process configuration.
- 1st process structure The manufacturing method of the solar cell module of the back contact system which concerns on this invention, Preferably, electroconductive particle and binder resin are selectively formed on the said wiring electrode of the said flexible printed circuit board or the said resin film. So that the conductive electrode containing the first placement step, the wiring electrode of the flexible printed circuit board or the resin film and the electrode of the solar battery cell are electrically connected by the conductive particles, A bonding step of bonding the flexible printed circuit board or the resin film and the solar battery cell;
- the method of manufacturing a back contact solar cell module according to the present invention preferably uses a solar cell having an electrode on the surface, and selectively on the electrode of the solar cell, Using the first placement step of placing a conductive material containing conductive particles and a binder resin, and a flexible printed board having a wiring electrode on the surface or a resin film having a wiring electrode on the surface, the flexible printed board or the resin A bonding step of bonding the flexible printed circuit board or the resin film and the solar battery cell so that the wiring electrode of the film and the electrode of the solar battery cell are electrically connected by the conductive particles; Is provided.
- the method of manufacturing a back contact type solar cell module according to the present invention may include the first process configuration described above or the second process configuration described above.
- the conductive particles include base particles and conductive portions arranged on the surfaces of the base particles, and the conductive portions Conductive particles having a plurality of protrusions on the outer surface are used.
- a conductive material including conductive particles and a binder resin is selectively disposed on the flexible printed circuit board or the wiring electrode of the resin film, or
- a conductive material containing conductive particles and a binder resin is selectively disposed on the electrode of the solar battery cell, and as the conductive particles, base material particles and on the surface of the base material particles
- the conduction reliability between the electrodes is improved because the conductive particles having a plurality of protrusions on the outer surface of the conductive part are used. Can do. As a result, the initial energy conversion efficiency and the energy conversion efficiency after the reliability test can be increased.
- a conductive material containing conductive particles and a binder resin is selectively disposed on the wiring electrode of the flexible printed circuit board or the resin film, or selectively conductive on the electrode of the solar battery cell.
- a conductive material containing particles and a binder resin By disposing a conductive material containing particles and a binder resin, the conduction reliability between the electrodes can be effectively increased.
- the conductive particles are selectively disposed on the wiring electrode, the amount of the conductive particles disposed on the portion of the flexible printed circuit board or the resin film where the wiring electrode is not provided can be reduced.
- the conductive particles are selectively disposed on the electrode, the amount of the conductive particles disposed in a portion where the electrode of the solar battery cell is not provided can be reduced. As a result, since the amount of conductive particles used in the entire solar cell module can be reduced, the manufacturing cost of the solar cell module can be reduced.
- the conductive particles have base particles and conductive portions arranged on the surface of the base particles, the interval between the electrodes can be controlled with high accuracy. In addition, since the conductive particles are easily deformed in response to the change in the interval between the electrodes, the conduction reliability between the electrodes can be improved.
- the conductive particles have a plurality of protrusions on the outer surface of the conductive portion, even if an oxide film is formed on the surface of the conductive portion and the surface of the electrode, the oxide film is broken through by the protrusion. For this reason, the conduction
- unevenness may exist on the surface of the electrode of the solar battery cell. Further, irregularities may also exist on the surface of the flexible printed circuit board or the wiring electrode of the resin film. For this reason, the space
- the larger the particle diameter of the base particles or conductive particles the more the interval can be relaxed, and the connection area with the wiring can be increased, so that the conduction reliability can be further enhanced.
- the conductive particles have a plurality of protrusions on the outer surface of the conductive portion, conduction is achieved by the protrusions being crushed or breaking through the electrodes in a region where the distance between the electrodes is narrow. In a region where the interval is wide, conduction is achieved in the vicinity of the tip of the protrusion. For this reason, conduction
- the conductive particles have a protrusion on the conductive surface, the protrusion is embedded in the electrode. For this reason, even if an impact is applied to the solar cell module, poor connection is less likely to occur. For this reason, conduction
- the above effect can be obtained by using conductive particles having protrusions on the conductive surface in order to electrically connect the electrodes of the back contact type solar cell module. It was found. In particular, when the average height of the plurality of protrusions in the conductive particle is 10 nm or more and 600 nm or less, the above-described effect is more effectively exhibited. Further, in order to electrically connect the electrodes of the solar cell module of the back contact system, the present inventors have determined the importance and technical significance of the conductive particles having protrusions on the outer surface of the conductive portion. Found for the first time.
- FIG. 4 is a cross-sectional view showing conductive particles used in the solar cell module shown in FIG. 1 described later.
- the conductive particle 21 shown in FIG. 4 has a base particle 22 and a conductive portion 23 disposed on the surface of the base particle 22.
- the conductive part 23 is a conductive layer.
- the conductive portion 23 covers the surface of the base particle 22.
- the conductive portion 23 is in contact with the base particle 22.
- the conductive particle 21 is a coated particle in which the surface of the base particle 22 is coated with the conductive portion 23.
- the conductive particle 21 has a plurality of protrusions 21 a on the outer surface of the conductive portion 23.
- the conductive portion 23 has a plurality of protrusions 23a on the outer surface.
- the conductive particle 21 has a plurality of core substances 24 on the surface of the base particle 22.
- the conductive portion 23 covers the base particle 22 and the core substance 24.
- the conductive particle 21 has a plurality of protrusions 21 a on the outer surface of the conductive portion 23.
- the outer surface of the conductive portion 23 is raised by the core substance 24, and a plurality of protrusions 21a and 23a are formed.
- FIG. 5 is a cross-sectional view showing a first modification of the conductive particles.
- the conductive particles 21 ⁇ / b> A shown in FIG. 5 have base material particles 22 and conductive portions 23 ⁇ / b> A arranged on the surface of the base material particles 22.
- the conductive portion 23A is a conductive layer. Only the presence or absence of the core substance 24 is different between the conductive particles 21 and the conductive particles 21A.
- the conductive particles 21A do not have a core substance.
- the conductive particle 21A has a plurality of protrusions 21Aa on the outer surface of the conductive portion 23A.
- the conductive portion 23A has a plurality of protrusions 23Aa on the outer surface.
- the conductive portion 23A has a first portion and a second portion that is thicker than the first portion. Accordingly, the conductive portion 23A has a protrusion 23Aa on the outer surface (the outer surface of the conductive layer). A portion excluding the plurality of protrusions 21Aa and 23Aa is the first portion of the conductive portion 23A. The plurality of protrusions 21Aa and 23Aa are the second portions where the conductive portion 23A is thick.
- FIG. 6 is a cross-sectional view showing a second modification of the conductive particles.
- the conductive particles 21 ⁇ / b> B shown in FIG. 6 have base material particles 22 and conductive parts 23 ⁇ / b> B arranged on the surface of the base material particles 22.
- the conductive portion 23B is a conductive layer.
- the conductive portion 23B includes a first conductive portion 23Bx disposed on the surface of the base particle 22 and a second conductive portion 23By disposed on the surface of the first conductive portion 23Bx.
- the conductive particles 21B have a plurality of protrusions 21Ba on the outer surface of the conductive portion 23B.
- the conductive portion 23B has a plurality of protrusions 23Ba on the outer surface.
- the conductive particle 21B has a plurality of core substances 24 on the surface of the first conductive portion 23Bx.
- the second conductive portion 23By covers the first conductive portion 23Bx and the core substance 24.
- the substrate particles 22 and the core substance 24 are arranged with a space therebetween.
- a first conductive portion 23Bx exists between the base particle 22 and the core substance 24.
- the conductive particles 21B have a plurality of protrusions 21Ba on the outer surface of the conductive portion 23B.
- the surface of the conductive portion 23B and the second conductive portion 23By is raised by the core substance 24, and a plurality of protrusions 21Ba and 23Ba are formed.
- the conductive portion 23B may have a multilayer structure. Further, in order to form the protrusions 21Ba and 23Ba, the core material 24 is disposed on the first conductive portion 23Bx of the inner layer, and the core material 24 and the first conductive portion 23Bx are separated by the second conductive portion 23By of the outer layer. It may be coated.
- each of the conductive particles 21, 21A, and 21B has a plurality of protrusions 21a, 21Aa, and 21Ba on the outer surfaces of the conductive portions 23, 23A, and 23B.
- a back contact type solar cell module is manufactured using the conductive particles 21, 21A, 21B and the like as described above.
- the conductive particles have base particles and conductive portions arranged on the surface of the base particles, and have a plurality of protrusions on the outer surface of the conductive portions, the conductive particles Conductive particles other than the particles 21, 21A, and 21B may be used.
- FIG. 1 is a cross-sectional view of a back contact type solar cell module obtained by a method of manufacturing a back contact type solar cell module according to an embodiment of the present invention.
- connection part 4 has the 1st connection part formed with the electrically-conductive material containing the electroconductive particle 21, and the 2nd connection part formed with the connection material which does not contain an electroconductive particle.
- conductive particles 21A, 21B and the like may be used.
- the back sheet 5 is disposed on the surface of the flexible printed board 2 opposite to the connection portion 4 side.
- a sealing material 6 is disposed on the surface opposite to the connection portion 4 side of the solar battery cell 3.
- a translucent substrate or the like may be disposed on the surface opposite to the solar cell 3 side of the sealing material 6.
- the flexible printed circuit board 2 has a plurality of wiring electrodes 2a on the surface (upper surface).
- the solar battery cell 3 has a plurality of electrodes 3a on the front surface (lower surface, back surface).
- the wiring electrode 2 a and the electrode 3 a are electrically connected by one or a plurality of conductive particles 21. Therefore, the flexible printed circuit board 2 and the solar battery cell 3 are electrically connected by the conductive particles 21.
- the first connection portion is disposed between the wiring electrode 2a and the electrode 3a.
- the second connection portion is disposed between a portion of the flexible printed board 2 where the wiring electrode 2a is not provided and a portion where the electrode 3a of the solar battery cell 3 is not provided.
- the second connection portion may be disposed between the wiring electrode 2a and the electrode 3a.
- a resin film having the wiring electrode on the surface may be used instead of the flexible printed circuit board 2 having the wiring electrode 2a on the surface.
- the solar cell module shown in FIG. 1 can be obtained, for example, through the steps shown in FIGS. 2 (a) to 2 (c) below.
- a conductive material 4A containing conductive particles 21 and a binder resin is prepared.
- the binder resin includes a thermosetting compound and a thermosetting agent, and a conductive material 4A having thermosetting properties is used.
- the conductive material 4A is also a connection material.
- the conductive material 4A is selectively placed on the wiring electrode 2a of the flexible printed board 2 (first placement step). Instead of the wiring electrode 2a of the flexible printed board 2, the conductive material 4A may be selectively disposed on the electrode 3a of the solar battery cell 3.
- the conductive material is not uniformly applied over the flexible printed board. As much as possible, it is preferable to dispose the conductive material on the wiring electrode, and it is preferable to dispose the conductive material only on the wiring electrode. However, a conductive material may also be disposed in a portion of the flexible printed board where the wiring electrode is not provided. The smaller the conductive material arranged in the portion of the flexible printed circuit board where the wiring electrodes are not provided, the better.
- the amount of the conductive material disposed on the wiring electrode or on the electrode is preferably 90% by weight or more, more preferably 99% by weight or more, and further preferably 100% by weight (total amount).
- the placement of the conductive material is preferably performed by printing or application by a dispenser. Therefore, the conductive material is preferably a conductive paste. However, the conductive material may be a conductive film. If a conductive film is used, the excessive flow of the conductive film after arrangement
- a solar battery cell 3 having the electrode 3a on the surface is prepared.
- the connection material 4B which does not contain electroconductive particle is prepared.
- the connecting material 4B includes a thermosetting compound and a thermosetting agent.
- the connection material 4B which does not contain electroconductive particle is arrange
- the conductive material 4A is selectively disposed on the electrode 3a of the solar battery cell 3
- a flexible printed board having the wiring electrode 2a on the surface is prepared.
- a connection material 4B that does not contain conductive particles is disposed on the surface of the flexible printed circuit board 2 on which the wiring electrodes 2a are provided (second disposing step). Note that a connection material that does not include conductive particles may not be disposed.
- the flexible printed circuit board 2 obtained in the first arrangement step and provided with the conductive material 4A is bonded to the solar battery cell 3 obtained in the second arrangement step and provided with the connection material 4B.
- the process of matching is performed. That is, as shown in FIG. 2 (c), the flexible printed circuit board 2 and the solar cell are connected so that the wiring electrode 2 a of the flexible printed circuit board 2 and the electrode 3 a of the solar battery cell 3 are electrically connected by the conductive particles 21.
- the battery cell 3 is bonded together (bonding process).
- a conductive material 4A including conductive particles 21 is disposed between the wiring electrode 2a and the electrode 3a.
- a connecting material 4B that does not contain conductive particles is disposed between a portion of the flexible printed circuit board 2 where the wiring electrode is not provided and a portion of the solar battery cell 3 where the electrode is not provided.
- the pressurizing pressure is preferably 9.8 ⁇ 10 4 Pa or more, and preferably 1.0 ⁇ 10 6 Pa or less.
- connection portion 4 is formed by the conductive material 4A and the connection material 4B.
- the solar cell module 1 shown in FIG. 1 is obtained by arrange
- the conductive material 4A and the connection material 4B it is preferable to heat the conductive material 4A and the connection material 4B.
- the conductive material 4 ⁇ / b> A and the connection material 4 ⁇ / b> B can be cured to form the cured connection portion 4.
- the heating temperature is preferably 50 ° C. or higher, more preferably 100 ° C. or higher, preferably 200 ° C. or lower, more preferably 150 ° C. or lower.
- the temperature of the heating is not less than the above lower limit and not more than the above upper limit, curing can be sufficiently advanced and connection reliability can be effectively increased.
- the solar cell module shown in FIG. 1 can be obtained, for example, through the steps shown in FIGS. 3 (a) to 3 (c) below.
- a flexible printed circuit board 2 having wiring electrodes 2a on its surface.
- a conductive material 4A containing conductive particles 21 and a binder resin is prepared. As shown in FIG. 3A, the conductive material 4A is selectively placed on the wiring electrode 2a of the flexible printed circuit board 2 (first placement step). Instead of the wiring electrode 2a of the flexible printed board 2, the conductive material 4A may be selectively disposed on the electrode 3a of the solar battery cell 3.
- connection material 4B that does not contain conductive particles is prepared.
- the connecting material 4B is disposed on the portion of the flexible printed board 2 where the wiring electrode 2a is not provided (second disposing step).
- the first arrangement step may be performed first, or the second arrangement step may be performed first.
- the first arrangement step and the second arrangement step may be performed simultaneously.
- a solar battery cell 3 having an electrode 3a on the surface is prepared.
- the conductive material 4A is selectively disposed on the electrode 3a of the solar battery cell 3
- the flexible printed board 2 having the wiring electrode 2a on the surface is prepared.
- the step of bonding the flexible printed circuit board 2 on which the conductive material 4A and the connection material 4B are arranged and the solar cells 3 obtained in the first and second arrangement steps is performed.
- the flexible printed circuit board 2 and the solar battery cell are connected so that the wiring electrode 2 a of the flexible printed circuit board 2 and the electrode 3 a of the solar battery cell 3 are electrically connected by the conductive particles 21. 3 are bonded together (bonding process).
- connection portion 4 is formed by the conductive material 4A and the connection material 4B.
- the solar cell module 1 shown in FIG. 1 is obtained by arrange
- an electrode (wiring electrode) provided on the flexible printed circuit board or the resin film and an electrode provided on the solar battery cell a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a silver electrode, Metal electrodes such as a molybdenum electrode and a tungsten electrode can be mentioned.
- a copper electrode (copper wiring electrode) or an aluminum electrode (aluminum wiring electrode) is preferable, and an aluminum electrode (aluminum wiring electrode) is especially preferable.
- the wiring electrode provided on the flexible printed board or the resin film is an aluminum wiring electrode, or the electrode provided on the solar battery cell is an aluminum electrode.
- only one of the wiring electrode provided on the flexible printed circuit board or the resin film and the electrode provided on the solar battery cell may be formed of aluminum, both of which are aluminum. May be formed.
- the wiring electrode provided on the flexible printed circuit board or the resin film may be an aluminum wiring electrode
- the electrode provided on the solar battery cell may be an aluminum electrode.
- an aluminum electrode aluminum wiring electrode
- the effect of the present invention is further exhibited, and in particular, the effect due to the protrusion of the conductive particles is further exhibited.
- the substrate particles include resin particles, inorganic particles excluding metal particles, organic-inorganic hybrid particles, and metal particles.
- the substrate particles are preferably substrate particles excluding metal particles, and more preferably resin particles, inorganic particles excluding metal particles, or organic-inorganic hybrid particles.
- the base material particles are preferably resin particles formed of a resin.
- the conductive particles are generally compressed after the conductive particles are arranged between the electrodes.
- the substrate particles are resin particles, the conductive particles are easily deformed by compression, and the contact area between the conductive particles and the electrode is increased. For this reason, the conduction
- the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; Alkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polysulfone, polyphenylene Oxide, polyacetal, polyimide, polyamideimide, polyether ether Tons, polyethersulfone, and polymers such as obtained by polymerizing various polymerizable monomers one or more having an acrylate.
- polyolefin resins such as polyethylene, polyprop
- the monomer having the ethylenically unsaturated group may be a non-crosslinkable monomer or a crosslinkable monomer. And a polymer.
- non-crosslinkable monomer examples include styrene monomers such as styrene and ⁇ -methylstyrene; carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; (Meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl ( Alkyl (meth) acrylates such as meth) acrylate and isobornyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, glycerol (meth) acrylate, polyoxyethylene (meth) acrylate, glycidyl (meth) acrylate, dis Oxy
- Unsaturated hydrocarbons such as: trifluoromethyl (meth) acrylate, pentafluoroethyl (meth) acrylate, halogen-containing monomers such as vinyl chloride, vinyl fluoride, and chlorostyrene.
- crosslinkable monomer examples include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and dipenta Erythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) Polyfunctional (meth) acrylates such as acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate; triallyl (iso) cyanure And silane
- the resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of this method include a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of polymerizing by swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles.
- the substrate particles are inorganic particles or organic-inorganic hybrid particles excluding metal particles
- examples of the inorganic material that is a material of the substrate particles include silica and carbon black.
- the inorganic substance is preferably not a metal.
- the particles formed from the silica are not particularly limited. For example, after forming a crosslinked polymer particle by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups, firing may be performed as necessary.
- grains obtained by performing are mentioned.
- the organic / inorganic hybrid particles include organic / inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.
- the base particles are metal particles
- examples of the metal that is a material of the metal particles include silver, copper, nickel, silicon, gold, and titanium.
- the substrate particles are preferably not metal particles.
- the average particle diameter of the substrate particles is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, further preferably 10 ⁇ m or more, preferably 500 ⁇ m or less, more preferably 100 ⁇ m or less, and further preferably 50 ⁇ m or less.
- the average particle diameter of the substrate particles may be 20 ⁇ m or less.
- the average particle diameter of the base particles is preferably 10 ⁇ m or more and 50 ⁇ m or less.
- the “average particle diameter” of the base material particles indicates a number average particle diameter.
- the average particle diameter of the resin particles is obtained by observing 50 arbitrary resin particles with an electron microscope or an optical microscope and calculating an average value.
- the thickness of the conductive part is preferably 5 nm or more, more preferably 10 nm or more, still more preferably 20 nm or more, particularly preferably 50 nm or more, preferably 1000 nm or less, more preferably 800 nm or less, still more preferably 500 nm or less, particularly preferably 400 nm or less, most preferably 300 nm or less.
- the thickness of the conductive portion indicates the thickness of the entire plurality of conductive portions.
- the conductivity of the conductive particles is further improved.
- the thickness of the conductive part is not more than the above upper limit, the difference in the coefficient of thermal expansion between the base particle and the conductive part becomes small, and the conductive part becomes difficult to peel from the base particle.
- Examples of the method for forming the conductive part on the surface of the substrate particle include a method for forming the conductive part by electroless plating and a method for forming the conductive part by electroplating.
- the conductive part preferably contains a metal.
- the metal that is the material of the conductive part is not particularly limited. Examples of the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, tungsten, molybdenum and cadmium, and alloys thereof. Is mentioned. Further, tin-doped indium oxide (ITO) may be used as the metal. As for the said metal, only 1 type may be used and 2 or more types may be used together.
- ITO tin-doped indium oxide
- the conductive particles have a plurality of protrusions on the outer surface of the conductive part. Since the core substance is embedded in the conductive portion, protrusions can be easily formed on the outer surface of the conductive portion. An oxide film is often formed on the surface of the electrode connected by the conductive particles. When conductive particles having protrusions are used, the oxide film is effectively excluded by the protrusions by placing the conductive particles between the electrodes and pressing them. For this reason, an electrode and electroconductive particle contact more reliably and the connection resistance between electrodes becomes still lower. Furthermore, the protrusion effectively eliminates the binder resin between the conductive particles and the electrode. For this reason, the conduction
- a method for forming protrusions on the surface of the conductive particles a method of forming a conductive portion by electroless plating after attaching a core substance to the surface of the base particles, and electroless plating on the surface of the base particles After the conductive part is formed by the method, the core material is attached, and the conductive part is further formed by electroless plating, and the conductive part is formed by adding the core substance in the middle stage of forming the conductive part by electroless plating. And the like.
- a method of forming a core material by reaction in a plating bath during electroless plating formation without adding a core material, and forming a conductive layer together with the core material by electroless plating Etc As another method of forming the protrusion, a method of forming a core material by reaction in a plating bath during electroless plating formation without adding a core material, and forming a conductive layer together with the core material by electroless plating Etc.
- the core substance As a method for attaching the core substance to the surface of the substrate particles, a conventionally known method can be adopted. Since the core substance is embedded in the conductive portion, it is easy for the conductive portion to have a plurality of protrusions on the outer surface. However, the core substance is not necessarily used in order to form protrusions on the surfaces of the conductive particles and the conductive part. The core substance is preferably disposed inside or inside the conductive part.
- the material of the core substance includes a conductive substance and a non-conductive substance.
- the conductive material include conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers.
- the conductive polymer include polyacetylene.
- the nonconductive material include silica, alumina, and zirconia. Among them, metal is preferable because conductivity can be increased and connection resistance can be effectively reduced.
- the core substance is preferably metal particles.
- Examples of the metal include gold, silver, copper, platinum, zinc, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium and cadmium, and tin-lead.
- Examples thereof include alloys composed of two or more metals such as alloys, tin-copper alloys, tin-silver alloys, tin-lead-silver alloys, and tungsten carbide. Of these, nickel, copper, silver or gold is preferable.
- the metal that is the material of the core substance may be the same as or different from the metal that is the material of the conductive part.
- the material of the core substance preferably includes nickel.
- Examples of the metal oxide include alumina, silica and zirconia.
- the shape of the core substance is not particularly limited.
- the shape of the core substance is preferably a lump.
- Examples of the core substance include a particulate lump, an agglomerate in which a plurality of fine particles are aggregated, and an irregular lump.
- the average diameter (average particle diameter) of the core substance is preferably 0.001 ⁇ m or more, more preferably 0.05 ⁇ m or more, preferably 0.9 ⁇ m or less, preferably 0.6 ⁇ m or less, more preferably 0.4 ⁇ m or less, More preferably, it is 0.2 ⁇ m or less.
- the average diameter of the core substance is not less than the above lower limit and not more than the above upper limit, the connection resistance between the electrodes is effectively reduced.
- the “average diameter (average particle diameter)” of the core substance indicates a number average diameter (number average particle diameter).
- the average diameter of the core material is obtained by observing 50 arbitrary core materials with an electron microscope or an optical microscope and calculating an average value.
- the number of the protrusions per one conductive particle is preferably 10 or more, more preferably 50 or more, and still more preferably 100 or more.
- the number of the protrusions may be 3 or more, or 5 or more.
- the upper limit of the number of protrusions is not particularly limited.
- the number of the protrusions is preferably 1000 or less, more preferably 800 or less.
- the upper limit of the number of protrusions can be appropriately selected in consideration of the particle diameter of the conductive particles.
- the average height of the plurality of protrusions is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 200 nm or more, preferably 600 nm or less, more preferably 500 nm or less. .
- the average height of the plurality of protrusions may be 300 nm or less.
- the ratio of the average height of the plurality of protrusions to the thickness of the conductive portion is preferably 0.1 or more, more preferably 0.5 or more, preferably 3.0 or less, More preferably, it is 2.0 or less.
- the height of the protrusion is the imaginary line of the conductive part (the broken line shown in FIG. 4) on the assumption that there is no protrusion on the line connecting the center of the conductive particles and the tip of the protrusion (broken line L1 shown in FIG. 4).
- L2 Indicates the distance from the top (on the outer surface of the spherical conductive particles assuming no projection) to the tip of the projection. That is, in FIG. 4, the distance from the intersection of the broken line L1 and the broken line L2 to the tip of the protrusion is shown.
- the conductive material includes the above-described conductive particles and a binder resin.
- the binder resin is not particularly limited.
- As the binder resin a known insulating resin can be used.
- the binder resin, the conductive material, and the connection material include a thermoplastic component or a thermosetting component.
- the binder resin, the conductive material, and the connection material may contain a thermoplastic component or may contain a thermosetting component.
- the binder resin, the conductive material, and the connection material preferably include a thermosetting component.
- the binder resin, the conductive material, and the connection material preferably include a curable compound (thermosetting compound) that can be cured by heating and a thermosetting agent. The curable compound curable by heating and the thermosetting agent are used in an appropriate blending ratio so that the binder resin is cured.
- thermosetting compound examples include epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds.
- epoxy compounds episulfide compounds, (meth) acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds.
- the said thermosetting compound only 1 type may be used and 2 or more types may be used together.
- thermosetting agent examples include an imidazole curing agent, an amine curing agent, a phenol curing agent, a polythiol curing agent, an acid anhydride, and a thermal cation curing initiator.
- an imidazole curing agent an amine curing agent, a phenol curing agent, a polythiol curing agent, an acid anhydride, and a thermal cation curing initiator.
- the said thermosetting agent only 1 type may be used and 2 or more types may be used together.
- the content of the binder resin is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, preferably 99.% or more. It is 99 weight% or less, More preferably, it is 99.9 weight% or less.
- the content of the binder resin is not less than the above lower limit and not more than the above upper limit, the conductive particles are efficiently arranged between the electrodes, and the connection reliability is further enhanced.
- the content of the conductive particles is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 80% by weight or less, more preferably 60% by weight or less, More preferably, it is 40% by weight or less, particularly preferably 20% by weight or less, and most preferably 10% by weight or less.
- the content of the conductive particles is not less than the above lower limit and not more than the above upper limit, the conduction reliability between the electrodes is further enhanced.
- Example 1 Production of conductive particles Divinylbenzene polymer particles (average particle diameter of 3 ⁇ m) were prepared. The polymer particles were etched and washed with water. Next, polymer particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
- the polymer particles to which palladium was adhered were stirred and dispersed in 300 mL of ion exchange water for 3 minutes to obtain a dispersion. Next, 1 g of nickel particle slurry (average particle diameter of nickel particles as a core material of 150 nm) was added to the dispersion over 3 minutes to obtain polymer particles to which the core material was adhered.
- a nickel layer was formed on the surface of the polymer particles by electroless plating. Conductive particles having a plurality of protrusions on the outer surface of the nickel layer were produced.
- the nickel layer had a thickness of 0.1 ⁇ m. The average height of the plurality of protrusions was 150 nm.
- conductive material 20 parts by weight of an epoxy compound (“EP-3300P” manufactured by ADEKA) as a thermosetting compound and an epoxy compound (“EPICLON HP- manufactured by DIC”) as a thermosetting compound 4032D ”) 15 parts by weight, an amine adduct of imidazole as a thermosetting agent (" PN-F "manufactured by Ajinomoto Fine Techno Co., Ltd.), and 1 part by weight of 2-ethyl-4-methylimidazole as a curing accelerator Part and 20 parts by weight of alumina (average particle diameter 0.5 ⁇ m) as a filler were added so that the content in 100% by weight of conductive paste from which conductive particles can be obtained was 10% by weight. Then, the electrically conductive material was obtained by stirring for 5 minutes at 2000 rpm using a planetary stirrer.
- connection material 20 parts by weight of an epoxy compound (“EP-3300P” manufactured by ADEKA) as a thermosetting compound and an epoxy compound (“EPICLON HP-4032D manufactured by DIC”) as a thermosetting compound ] 15 parts by weight, 10 parts by weight of an amine adduct of imidazole as a thermosetting agent (“PN-F” manufactured by Ajinomoto Fine Techno Co.) and 1 part by weight of 2-ethyl-4-methylimidazole as a curing accelerator And 20 parts by weight of alumina (average particle size 0.5 ⁇ m) as a filler were blended to obtain a connection material.
- an epoxy compound (“EP-3300P” manufactured by ADEKA)
- PN-F an amine adduct of imidazole
- 2-ethyl-4-methylimidazole as a curing accelerator
- 20 parts by weight of alumina (average particle size 0.5 ⁇ m) as a filler were blended to obtain
- a conductive material was selectively applied on the wiring electrode of the flexible printed board using a dispenser to partially form a conductive material layer having a thickness of 50 ⁇ m. All of the conductive material on the flexible printed circuit board was disposed on the wiring electrode. That is, the amount of the conductive material disposed on the wiring electrode was 100% by weight out of 100% by weight of the entire conductive material disposed on the flexible printed board.
- a connecting material was applied to the entire surface of the solar cell provided with the electrode by printing to form a connecting material layer having a thickness of 100 ⁇ m.
- the flexible printed circuit board and the solar battery cell were bonded so that the aluminum wiring electrode of the flexible printed circuit board and the copper electrode of the solar battery cell were electrically connected by conductive particles.
- the flexible printed circuit board and the solar battery cell were placed in a vacuum laminate for 5 minutes in an atmosphere of 150 ° C. so as to be sandwiched between the glass substrate and the EVA film.
- the conductive material layer and the connection material layer were cured by heating during laminating to form a connection portion.
- a solar cell module was obtained in which the aluminum wiring electrode of the flexible printed board and the copper electrode of the solar cell were electrically connected by conductive particles.
- Example 2 A solar cell module was manufactured in the same manner as in Example 1 except that the amount of the conductive material disposed on the wiring electrode was changed to 99% by weight in 100% by weight of the total conductive material disposed on the flexible printed board. Obtained.
- Example 3 A solar cell module was fabricated in the same manner as in Example 1 except that the amount of the conductive material disposed on the wiring electrode was changed to 90% by weight out of 100% by weight of the total conductive material disposed on the flexible printed board. Obtained.
- Example 4 A solar cell module was manufactured in the same manner as in Example 1 except that the amount of the conductive material arranged on the wiring electrode was changed to 85% by weight out of 100% by weight of the whole conductive material arranged on the flexible printed board. Obtained.
- Example 5 Conductive particles were obtained in the same manner as in Example 1 except that the average particle diameter of the core substance was changed and the average height of the plurality of protrusions of the conductive particles was changed to 20 nm.
- the nickel layer had a thickness of 0.1 ⁇ m.
- the average height of the plurality of protrusions was 50 nm.
- a solar cell module was obtained in the same manner as in Example 1 using the obtained conductive particles.
- Example 6 Conductive particles were obtained in the same manner as in Example 1 except that the average particle diameter of the core substance was changed and the average height of the plurality of protrusions of the conductive particles was changed to 300 nm.
- the nickel layer had a thickness of 0.1 ⁇ m.
- the average height of the plurality of protrusions was 350 nm.
- a solar cell module was obtained in the same manner as in Example 1 using the obtained conductive particles.
- Example 7 A solar cell module was obtained in the same manner as in Example 1 except that the electrode of the solar cell was changed from a copper electrode to an aluminum electrode.
- Example 8 Preparation of conductive particles Copolymer particles (average particle size of 20 ⁇ m) formed of styrene and isobornyl acrylate were prepared. The polymer particles were etched and washed with water. Next, polymer particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
- the polymer particles to which palladium was adhered were stirred and dispersed in 300 mL of ion exchange water for 3 minutes to obtain a dispersion.
- 3 g of nickel particle slurry average particle diameter of nickel particles as the core material of 400 nm was added to the dispersion over 3 minutes to obtain polymer particles to which the core material was adhered.
- a nickel layer was formed on the surface of the polymer particles by electroless plating. Conductive particles having a plurality of protrusions on the outer surface of the nickel layer were produced.
- the nickel layer had a thickness of 0.1 ⁇ m. The average height of the plurality of protrusions was 450 nm.
- a conductive material was selectively applied on the wiring electrode of the flexible printed board using a screen printer to partially form a conductive material layer having a thickness of 50 ⁇ m. All of the conductive material on the flexible printed circuit board was disposed on the wiring electrode. That is, the amount of the conductive material disposed on the wiring electrode was 100% by weight out of 100% by weight of the entire conductive material disposed on the flexible printed board.
- connection material was applied to the surface of the solar battery cell on which the electrode was provided.
- the flexible printed circuit board and the solar battery cell were bonded so that the aluminum wiring electrode of the flexible printed circuit board and the aluminum electrode of the solar battery cell were electrically connected by conductive particles.
- the flexible printed circuit board and the solar battery cell were placed in a vacuum laminate for 5 minutes in an atmosphere of 150 ° C. so as to be sandwiched between the glass substrate and the EVA film.
- the conductive material layer was cured by heating at the time of laminating to form a connection portion.
- a solar battery module in which the aluminum wiring electrode of the flexible printed board and the aluminum electrode of the solar battery cell were electrically connected by conductive particles was obtained.
- Example 9 A solar cell module was obtained in the same manner as in Example 8 except that copolymer particles (average particle size: 10 ⁇ m) formed of styrene and isobornyl acrylate were used.
- Example 10 The average particle diameter of the nickel particles of the nickel particle slurry was changed to 150 nm, and conductive particles having a plurality of protrusions on the outer surface of the obtained nickel layer were obtained.
- the thickness of the nickel layer of the conductive particles was 0.1 ⁇ m, and the average height of the plurality of protrusions was 200 nm. Except having used the obtained electroconductive particle, it carried out similarly to Example 8, and obtained the solar cell module.
- Example 11 By using the polymer particles used in Example 1, without using nickel particle slurry, a nickel core material is generated by reaction in the plating bath, and electroless nickel plating is co-deposited together with the generated core material. Conductive particles having a plurality of protrusions on the outer surface of the nickel layer were obtained. The thickness of the nickel layer of the conductive particles was 0.1 ⁇ m, and the average height of the plurality of protrusions was 250 nm. Except having used the obtained electroconductive particle, it carried out similarly to Example 8, and obtained the solar cell module.
- Example 12 A solar cell module was obtained in the same manner as in Example 8 except that a resin film having an aluminum wiring electrode on the surface was used when the solar cell module was produced.
- Example 13 In the same manner as in Example 8, polymer particles having a core substance attached thereto were obtained. Conductive particles having a plurality of protrusions on the outer surface of the copper layer were formed by forming a copper layer on the surface of the polymer particles by electroless plating. The copper layer had a thickness of 0.1 ⁇ m, and the average height of the plurality of protrusions was 450 nm. A solar cell module was obtained in the same manner as in Example 8 except that the obtained conductive particles were used.
- Example 14 Example except that a conductive material layer was selectively formed on a wiring electrode of a solar battery cell by using a screen printer and a conductive material layer having a thickness of 50 ⁇ m was partially formed at the time of solar cell module production. In the same manner as in Example 8, a solar cell module was obtained.
- Example 1 A solar cell module was obtained in the same manner as in Example 1 except that the conductive material was applied to the entire surface of the flexible printed circuit board and that the solar battery cells to which the connection material was not applied were used.
- Example 2 The polymer particles obtained in Example 1 were prepared. Using the polymer particles, a nickel layer was formed on the surface of the polymer particles by electroless plating to produce conductive particles. In Comparative Example 2, no protrusion was formed on the surface of the conductive part of the conductive particles. A solar cell module was obtained in the same manner as in Example 1 using the obtained conductive particles.
- Example 3 A solar cell module was obtained in the same manner as in Example 1 except that the conductive material (conductive paste) was changed to the solder paste.
- Example 4 A solar cell module was obtained in the same manner as in Example 1 except that the conductive material (conductive paste) was changed to Ag paste.
- Example 5 The polymer particles obtained in Example 8 were prepared. Using the polymer particles, a nickel layer was formed on the surface of the polymer particles by electroless plating to produce conductive particles. In Comparative Example 5, no protrusion was formed on the surface of the conductive part of the conductive particles. Using the obtained conductive particles, a solar cell module was obtained in the same manner as in Example 8.
- Example 6 The polymer particles obtained in Example 8 were prepared. A copper layer was formed on the surface of the polymer particles by electroless plating to produce conductive particles. In Comparative Example 6, no protrusion was formed on the surface of the conductive portion of the conductive particle. Using the obtained conductive particles, a solar cell module was obtained in the same manner as in Example 8.
- Example 1 a copper electrode was used for the solar cell, and in Example 7, an aluminum electrode was used for the solar cell.
- the evaluation results based on the above criteria for the initial energy conversion efficiency and the energy conversion efficiency after the reliability test were the same, but in the aluminum electrode, the conductivity provided with the configuration of the present invention.
- the number of protrusions per single particle in Examples 1 to 13 and Comparative Example 1 was about 300 to about 900.
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Abstract
Description
本発明に係るバックコンタクト方式の太陽電池モジュールの製造方法では、配線電極を表面に有するフレキシブルプリント基板又は配線電極を表面に有する樹脂フィルムと、電極を表面に有する太陽電池セルと、導電材料とを用いる。上記導電材料は、導電性粒子とバインダー樹脂とを含む。
上記基材粒子としては、樹脂粒子、金属粒子を除く無機粒子、有機無機ハイブリッド粒子及び金属粒子等が挙げられる。上記基材粒子は、金属粒子を除く基材粒子であることが好ましく、樹脂粒子、金属粒子を除く無機粒子又は有機無機ハイブリッド粒子であることがより好ましい。
上記導電材料は、上述した導電性粒子とバインダー樹脂とを含む。上記バインダー樹脂は特に限定されない。上記バインダー樹脂として、公知の絶縁性の樹脂を用いること可能である。
(1)導電性粒子の作製
ジビニルベンゼン重合体粒子(平均粒子径3μm)を用意した。上記重合体粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に重合体粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に重合体粒子を添加し、パラジウムが付着された重合体粒子を得た。
熱硬化性化合物であるエポキシ化合物(ADEKA社製「EP-3300P」)20重量部と、熱硬化性化合物であるエポキシ化合物(DIC社製「EPICLON HP-4032D」)15重量部と、熱硬化剤であるイミダゾールのアミンアダクト体(味の素ファインテクノ社製「PN-F」)10重量部と、硬化促進剤である2-エチル-4-メチルイミダゾール1重量部と、フィラーであるアルミナ(平均粒子径0.5μm)20重量部とを配合し、さらに導電性粒子を得られる導電ペースト100重量%中での含有量が10重量%となるように添加した後、遊星式攪拌機を用いて2000rpmで5分間攪拌することにより、導電材料を得た。
熱硬化性化合物であるエポキシ化合物(ADEKA社製「EP-3300P」)20重量部と、熱硬化性化合物であるエポキシ化合物(DIC社製「EPICLON HP-4032D」)15重量部と、熱硬化剤であるイミダゾールのアミンアダクト体(味の素ファインテクノ社製「PN-F」)10重量部と、硬化促進剤である2-エチル-4-メチルイミダゾール1重量部と、フィラーであるアルミナ(平均粒子径0.5μm)20重量部とを配合し、接続材料を得た。
アルミニウム配線電極を表面に有するフレキシブルプリント基板(L/S=50μm/50μm)を用意した。また、銅電極を表面に有する太陽電池セル(L/S=50μm/50μm)を用意した。
フレキシブルプリント基板上に配置される導電材料の全体100重量%中、配線電極上に配置される導電材料の量を99重量%に変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
フレキシブルプリント基板上に配置される導電材料の全体100重量%中、配線電極上に配置される導電材料の量を90重量%に変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
フレキシブルプリント基板上に配置される導電材料の全体100重量%中、配線電極上に配置される導電材料の量を85重量%に変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
芯物質の平均粒子径をかえて、導電性粒子の複数の突起の平均高さを20nmに変更したこと以外は実施例1と同様にして、導電性粒子を得た。なお、ニッケル層の厚さは0.1μmであった。複数の突起の平均高さは50nmであった。得られた導電性粒子を用いて実施例1と同様にして、太陽電池モジュールを得た。
芯物質の平均粒子径をかえて、導電性粒子の複数の突起の平均高さを300nmに変更したこと以外は実施例1と同様にして、導電性粒子を得た。なお、ニッケル層の厚さは0.1μmであった。複数の突起の平均高さは350nmであった。得られた導電性粒子を用いて実施例1と同様にして、太陽電池モジュールを得た。
太陽電池セルの電極を銅電極からアルミニウム電極に変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
(1)導電性粒子の作製
スチレンとイソボルニルアクリレートとにより形成された共重合体粒子(平均粒子径20μm)を用意した。上記重合体粒子をエッチングし、水洗した。次に、パラジウム触媒を8重量%含むパラジウム触媒化液100mL中に重合体粒子を添加し、攪拌した。その後、ろ過し、洗浄した。pH6の0.5重量%ジメチルアミンボラン液に重合体粒子を添加し、パラジウムが付着された重合体粒子を得た。
熱硬化性化合物であるエポキシ化合物(DIC社製「EPICLON 850」)20重量部と、熱硬化性化合物であるエポキシ化合物(DIC社製「EPICLON N-770」)20重量部と、潜在性熱硬化剤であるマイクロカプセル型硬化剤(旭化成イーマテリアルズ社製「ノバキュアHX-3742」)20重量部と、シランカップリング剤(信越化学工業社製「KBM-403」)1重量部と、フィラーであるアルミナ(平均粒子径0.5μm)20重量部とを配合し、さらに導電性粒子を得られる導電ペースト100重量%中での含有量が1重量%となるように添加した後、遊星式攪拌機を用いて1000rpmで5分間攪拌することにより、導電材料を得た。
アルミニウム配線電極を表面に有するフレキシブルプリント基板(L/S=300μm/300μm)を用意した。また、アルミニウム電極を表面に有する太陽電池セル(L/S=300μm/300μm)を用意した。
スチレンとイソボルニルアクリレートとにより形成された共重合体粒子(平均粒子径10μm)を用いたこと以外は実施例8と同様にして太陽電池モジュールを得た。
ニッケル粒子スラリーのニッケル粒子の平均粒子径を150nmに変更し、得られたニッケル層の外表面に複数の突起を有する導電性粒子を得た。導電性粒子のニッケル層の厚さは0.1μm、複数の突起の平均高さは200nmであった。得られた導電性粒子を使用したこと以外は実施例8と同様にして太陽電池モジュールを得た。
実施例1で用いた重合体粒子を用いて、ニッケル粒子スラリーを使用せずに、めっき浴内に反応によりニッケル芯物質を生成し、生成した芯物質と共に無電解ニッケルめっきを共析出させることでニッケル層の外表面に複数の突起を有する導電性粒子を得た。導電性粒子のニッケル層の厚さは0.1μm、複数の突起の平均高さは250nmであった。得られた導電性粒子を使用したこと以外は実施例8と同様にして太陽電池モジュールを得た。
太陽電池モジュール作製時にアルミニウム配線電極を表面に有する樹脂フィルムを用いたこと以外は実施例8と同様にして太陽電池モジュールを得た。
実施例8と同様にして芯物質が付着された重合体粒子を得た。この重合体粒子の表面に無電解めっき法により、銅層を形成することで銅層の外表面に複数の突起を有する導電性粒子を作製した。なお、銅層の厚さは0.1μm、複数の突起の平均高さは450nmであった。得られた導電性粒子を用いたこと以外は実施例8と同様にして太陽電池モジュールを得た。
太陽電池モジュール作製時に、太陽電池セルの配線電極上に選択的に、スクリーン印刷機を用いて、導電材料を塗布して、厚み50μmの導電材料層を部分的に形成したこと以外は、実施例8と同様にして太陽電池モジュールを得た。
フレキシブルプリント基板の全面に導電材料を塗布したこと、並びに接続材料を塗布していない太陽電池セルを用いたこと以外は実施例1と同様にして、太陽電池モジュールを得た。
実施例1で得られた重合体粒子を用意した。この重合体粒子を用いて、無電解めっき法により、重合体粒子の表面に、ニッケル層を形成し、導電性粒子を作製した。比較例2では、導電性粒子の導電部の表面に突起を形成しなかった。得られた導電性粒子を用いて実施例1と同様にして、太陽電池モジュールを得た。
導電材料(導電ペースト)をはんだペーストに変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
導電材料(導電ペースト)をAgペーストに変更したこと以外は実施例1と同様にして、太陽電池モジュールを得た。
実施例8で得られた重合体粒子を用意した。この重合体粒子を用いて、無電解めっき法により、重合体粒子の表面に、ニッケル層を形成し、導電性粒子を作製した。比較例5では、導電性粒子の導電部の表面に突起を形成しなかった。得られた導電性粒子を用いて実施例8と同様にして、太陽電池モジュールを得た。
実施例8で得られた重合体粒子を用意した。この重合体粒子の表面に無電解めっき法により、銅層を形成し、導電性粒子を作製した。比較例6では、導電性粒子の導電部の表面に突起を形成しなかった。得られた導電性粒子を用いて実施例8と同様にして、太陽電池モジュールを得た。
(1)初期のエネルギー変換効率
得られた太陽電池モジュールにおけるエネルギー変換効率を測定した。また、初期のエネルギー変換効率を下記の基準で判定した。
○○○○:エネルギー変換効率が22%を超える
○○○:エネルギー変換効率が20%を超え22%以下
○○:エネルギー変換効率が18%を超え20%以下
○:エネルギー変換効率が16%を超え18%以下
△:エネルギー変換効率が14%を超え16%以下
×:エネルギー変換効率が14%以下
得られた太陽電池モジュールについて、サイクル試験機にて、-40℃~90℃、保持時間30分、温度変化率87℃/時間のサイクル試験を200サイクル行った後、エネルギー変換効率を測定した。信頼性試験後のエネルギー変換効率を下記の基準で判定した。
○○○○:エネルギー変換効率が22%を超える
○○○:エネルギー変換効率が20%を超え22%以下
○○:エネルギー変換効率が18%を超え20%以下
○:エネルギー変換効率が16%を超え18%以下
△:エネルギー変換効率が14%を超え16%以下
×:エネルギー変換効率が14%以下
2…フレキシブルプリント基板
2a…配線電極
3…太陽電池セル
3a…電極
4…接続部
4A…導電材料
4B…接続材料
5…バックシート
6…封止材
21,21A,21B…導電性粒子
21a,21Aa,21Ba…突起
22…基材粒子
23,23A,23B…導電部
23a,23Aa,23Ba…突起
23Bx…第1の導電部
23By…第2の導電部
24…芯物質
Claims (7)
- バックコンタクト方式の太陽電池モジュールの製造方法であって、
配線電極を表面に有するフレキシブルプリント基板又は配線電極を表面に有する樹脂フィルムを用いて、前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極上に選択的に、導電性粒子とバインダー樹脂とを含む導電材料を配置する第1の配置工程と、
電極を表面に有する太陽電池セルを用いて、前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極と前記太陽電池セルの前記電極とが前記導電性粒子により電気的に接続されるように、前記フレキシブルプリント基板又は前記樹脂フィルムと前記太陽電池セルとを貼り合わせる貼合工程とを備えるか、又は、
電極を表面に有する太陽電池セルを用いて、前記太陽電池セルの前記電極上に選択的に、導電性粒子とバインダー樹脂とを含む導電材料を配置する第1の配置工程と、配線電極を表面に有するフレキシブルプリント基板又は配線電極を表面に有する樹脂フィルムを用いて、前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極と前記太陽電池セルの前記電極とが前記導電性粒子により電気的に接続されるように、前記フレキシブルプリント基板又は前記樹脂フィルムと前記太陽電池セルとを貼り合わせる貼合工程とを備え、
前記導電性粒子として、基材粒子と、前記基材粒子の表面上に配置された導電部とを有し、かつ前記導電部の外表面に複数の突起を有する導電性粒子を用いる、バックコンタクト方式の太陽電池モジュールの製造方法。 - 前記第1の配置工程において、前記フレキシブルプリント基板又は前記樹脂フィルム上に配置される導電材料の全体100重量%中、前記配線電極上に配置される導電材料の量を90重量%以上にするか、又は、前記第1の配置工程において、前記太陽電池セル上に配置される導電材料の全体100重量%中、前記電極上に配置される導電材料の量を90重量%以上にする、請求項1に記載のバックコンタクト方式の太陽電池モジュールの製造方法。
- 前記第1の配置工程において、前記フレキシブルプリント基板又は前記樹脂フィルム上に配置される導電材料の全体100重量%中、前記配線電極上に配置される導電材料の量を99重量%以上にするか、又は、前記第1の配置工程において、前記太陽電池セル上に配置される導電材料の全体100重量%中、前記電極上に配置される導電材料の量を99重量%以上にする、請求項2に記載のバックコンタクト方式の太陽電池モジュールの製造方法。
- 前記導電性粒子における複数の前記突起の平均高さが、10nm以上、600nm以下である、請求項1~3のいずれか1項に記載のバックコンタクト方式の太陽電池モジュールの製造方法。
- 前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極がアルミニウム配線電極であるか、又は、前記太陽電池セルの前記電極がアルミニウム電極である、請求項1~4のいずれか1項に記載のバックコンタクト方式の太陽電池モジュールの製造方法。
- 前記太陽電池セルの前記電極が設けられている側の表面に、導電性粒子を含まない接続材料を配置する第2の配置工程を備えるか、又は、
前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極が設けられている側の表面に、導電性粒子を含まない接続材料を配置する第2の配置工程を備え、
前記貼合工程において、前記接続材料により、前記フレキシブルプリント基板又は前記樹脂フィルムの前記配線電極が設けられていない部分と、前記太陽電池セルの前記電極が設けられていない部分とを貼り合わせる、請求項1~5のいずれか1項に記載のバックコンタクト方式の太陽電池モジュールの製造方法。 - 前記バインダー樹脂が、熱硬化性化合物と熱硬化剤とを含む、請求項1~6のいずれか1項に記載のバックコンタクト方式の太陽電池モジュールの製造方法。
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