JP5025825B2 - 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 - Google Patents

絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 Download PDF

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JP5025825B2
JP5025825B2 JP2011535748A JP2011535748A JP5025825B2 JP 5025825 B2 JP5025825 B2 JP 5025825B2 JP 2011535748 A JP2011535748 A JP 2011535748A JP 2011535748 A JP2011535748 A JP 2011535748A JP 5025825 B2 JP5025825 B2 JP 5025825B2
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particles
conductive
insulating
insulating particles
particle
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JPWO2012014925A1 (ja
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茂雄 真原
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
JP2011535748A 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体 Active JP5025825B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011535748A JP5025825B2 (ja) 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010169502 2010-07-28
JP2010169503 2010-07-28
JP2010169502 2010-07-28
JP2010169503 2010-07-28
PCT/JP2011/067069 WO2012014925A1 (ja) 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2011535748A JP5025825B2 (ja) 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体

Related Child Applications (2)

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JP2012006128A Division JP4977276B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2012006127A Division JP5850752B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体

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JP5025825B2 true JP5025825B2 (ja) 2012-09-12
JPWO2012014925A1 JPWO2012014925A1 (ja) 2013-09-12

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JP2011535748A Active JP5025825B2 (ja) 2010-07-28 2011-07-27 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2012006128A Active JP4977276B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2012006127A Active JP5850752B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2012150670A Active JP5850806B2 (ja) 2010-07-28 2012-07-04 絶縁性粒子付き導電性粒子及び接続構造体

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JP2012006128A Active JP4977276B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2012006127A Active JP5850752B2 (ja) 2010-07-28 2012-01-16 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2012150670A Active JP5850806B2 (ja) 2010-07-28 2012-07-04 絶縁性粒子付き導電性粒子及び接続構造体

Country Status (5)

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JP (4) JP5025825B2 (enrdf_load_stackoverflow)
KR (1) KR101242235B1 (enrdf_load_stackoverflow)
CN (1) CN102884590B (enrdf_load_stackoverflow)
TW (1) TWI381037B (enrdf_load_stackoverflow)
WO (1) WO2012014925A1 (enrdf_load_stackoverflow)

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JPH0250858A (ja) * 1988-08-12 1990-02-20 Tokyo Electric Co Ltd 印刷装置
JP5821552B2 (ja) * 2011-11-10 2015-11-24 日立化成株式会社 撥水性導電粒子、異方導電材料及び導電接続構造体
KR101987509B1 (ko) * 2012-01-19 2019-06-10 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6188456B2 (ja) * 2012-07-03 2017-08-30 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6438186B2 (ja) * 2012-09-06 2018-12-12 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6212374B2 (ja) * 2012-12-05 2017-10-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP6357347B2 (ja) * 2013-05-14 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6357348B2 (ja) * 2013-05-22 2018-07-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6426913B2 (ja) * 2013-05-29 2018-11-21 積水化学工業株式会社 突起粒子、導電性粒子、導電材料及び接続構造体
JP6392617B2 (ja) * 2013-10-02 2018-09-19 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6450154B2 (ja) * 2013-11-12 2019-01-09 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6739894B2 (ja) * 2013-11-18 2020-08-12 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6397316B2 (ja) * 2013-11-18 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JPWO2015105120A1 (ja) * 2014-01-08 2017-03-23 積水化学工業株式会社 バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール
CN105593947B (zh) * 2014-01-08 2019-04-19 积水化学工业株式会社 背接触式的太阳能电池模块用导电性粒子、导电材料及太阳能电池模块
JPWO2015105121A1 (ja) * 2014-01-08 2017-03-23 積水化学工業株式会社 バックコンタクト方式の太陽電池モジュールの製造方法
EP2942129B1 (de) * 2014-05-05 2017-07-05 Heraeus Deutschland GmbH & Co. KG Metallpaste und deren Verwendung zum Verbinden von Bauelementen
JP6564302B2 (ja) * 2014-10-28 2019-08-21 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
WO2016068165A1 (ja) * 2014-10-29 2016-05-06 デクセリアルズ株式会社 導電材料
KR102624796B1 (ko) * 2015-09-24 2024-01-12 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료, 및 접속 구조체
JP6543421B2 (ja) * 2016-07-04 2019-07-10 株式会社鈴木 転写方法および実装方法
US11407863B2 (en) 2017-05-08 2022-08-09 Nippon Chemical Industrial Co., Ltd. Coated particles and production method therefor
JP7062555B2 (ja) * 2018-08-27 2022-05-06 日本化学工業株式会社 被覆粒子
JP7651875B2 (ja) 2021-02-18 2025-03-27 オムロン株式会社 入出力装置

Citations (4)

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JPH03112011A (ja) * 1989-09-26 1991-05-13 Catalysts & Chem Ind Co Ltd 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体

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TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR20040052126A (ko) * 2002-12-13 2004-06-19 엘지전선 주식회사 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체
JP4724369B2 (ja) * 2003-09-29 2011-07-13 ソニーケミカル＆インフォメーションデバイス株式会社 導電粒子の製造方法
JP5529431B2 (ja) * 2008-03-27 2014-06-25 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112011A (ja) * 1989-09-26 1991-05-13 Catalysts & Chem Ind Co Ltd 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JP2010103080A (ja) * 2008-03-27 2010-05-06 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2010073578A (ja) * 2008-09-19 2010-04-02 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体

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JPWO2012014925A1 (ja) 2013-09-12
KR101242235B1 (ko) 2013-03-11
JP5850752B2 (ja) 2016-02-03
TWI381037B (zh) 2013-01-01
KR20120124075A (ko) 2012-11-12
JP2012234821A (ja) 2012-11-29
TW201213493A (en) 2012-04-01
JP4977276B2 (ja) 2012-07-18
CN102884590A (zh) 2013-01-16
JP2012124169A (ja) 2012-06-28
WO2012014925A1 (ja) 2012-02-02
CN102884590B (zh) 2014-01-15
JP2012094541A (ja) 2012-05-17
JP5850806B2 (ja) 2016-02-03

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