TWI375664B - - Google Patents

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Publication number
TWI375664B
TWI375664B TW097149118A TW97149118A TWI375664B TW I375664 B TWI375664 B TW I375664B TW 097149118 A TW097149118 A TW 097149118A TW 97149118 A TW97149118 A TW 97149118A TW I375664 B TWI375664 B TW I375664B
Authority
TW
Taiwan
Prior art keywords
crack
substrate
reducing agent
intersection
friction coefficient
Prior art date
Application number
TW097149118A
Other languages
English (en)
Chinese (zh)
Other versions
TW200936521A (en
Inventor
Yuhang Su
Seiji Shimizu
Koji Yamamoto
Kenji Fukuhara
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200936521A publication Critical patent/TW200936521A/zh
Application granted granted Critical
Publication of TWI375664B publication Critical patent/TWI375664B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
TW097149118A 2007-12-27 2008-12-17 Method for forming cracks on substrate made of brittle material TW200936521A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007336840 2007-12-27

Publications (2)

Publication Number Publication Date
TW200936521A TW200936521A (en) 2009-09-01
TWI375664B true TWI375664B (ko) 2012-11-01

Family

ID=40824119

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097149118A TW200936521A (en) 2007-12-27 2008-12-17 Method for forming cracks on substrate made of brittle material

Country Status (5)

Country Link
JP (1) JP5055383B2 (ko)
KR (1) KR101139306B1 (ko)
CN (1) CN101910076B (ko)
TW (1) TW200936521A (ko)
WO (1) WO2009084398A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101195601B1 (ko) * 2010-07-07 2012-10-29 주식회사 이오테크닉스 레이저를 이용한 절단방법 및 절단장치
KR101195600B1 (ko) * 2010-07-07 2012-10-29 주식회사 이오테크닉스 레이저를 이용한 절단 방법
CN103282317B (zh) * 2011-12-22 2015-12-16 三星钻石工业股份有限公司 脆性材料基板的割断方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
JP6303861B2 (ja) * 2014-06-25 2018-04-04 三星ダイヤモンド工業株式会社 単結晶基板の分断方法
CN107922259B (zh) 2015-09-04 2021-05-07 Ａｇｃ株式会社 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置
JP2019023146A (ja) * 2015-12-08 2019-02-14 Ａｇｃ株式会社 ガラス板およびガラス板の製造方法
PL3508458T3 (pl) 2016-09-01 2022-06-13 AGC Inc. Sposób wytwarzania wyrobu szklanego
EP3587366B1 (en) 2017-02-21 2023-09-13 AGC Inc. Glass plate and manufacturing method of glass plate
JP6531878B2 (ja) * 2017-02-21 2019-06-19 Ａｇｃ株式会社 ガラス板およびガラス板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002087836A (ja) * 2000-09-13 2002-03-27 Sanyo Electric Co Ltd 脆性非金属材料加工方法
KR100676249B1 (ko) 2001-05-23 2007-01-30 삼성전자주식회사 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치
EP1534463B1 (en) 2002-08-21 2006-03-29 Koninklijke Philips Electronics N.V. Method of breaking a brittle substrate
KR20070005604A (ko) * 2004-04-27 2007-01-10 미쓰보시 다이야몬도 고교 가부시키가이샤 취성기판의 수직크랙 형성방법 및 수직크랙 형성장치
EP1806202B1 (en) * 2004-10-25 2011-08-17 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for forming crack

Also Published As

Publication number Publication date
JPWO2009084398A1 (ja) 2011-05-19
JP5055383B2 (ja) 2012-10-24
KR20100090788A (ko) 2010-08-17
KR101139306B1 (ko) 2012-04-26
TW200936521A (en) 2009-09-01
CN101910076A (zh) 2010-12-08
WO2009084398A1 (ja) 2009-07-09
CN101910076B (zh) 2013-01-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees