TWI374336B - Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby - Google Patents
Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby Download PDFInfo
- Publication number
- TWI374336B TWI374336B TW097119985A TW97119985A TWI374336B TW I374336 B TWI374336 B TW I374336B TW 097119985 A TW097119985 A TW 097119985A TW 97119985 A TW97119985 A TW 97119985A TW I374336 B TWI374336 B TW I374336B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- electrode
- display panel
- plasma display
- weight
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 40
- 239000011230 binding agent Substances 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 14
- 239000002002 slurry Substances 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003504 photosensitizing agent Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 230000002165 photosensitisation Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- -1 handle Chemical compound 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000001856 Ethyl cellulose Substances 0.000 claims 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims 1
- 229940088601 alpha-terpineol Drugs 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 239000001913 cellulose Substances 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000002270 dispersing agent Substances 0.000 claims 1
- 229920001249 ethyl cellulose Polymers 0.000 claims 1
- 235000019325 ethyl cellulose Nutrition 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical group 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000012719 thermal polymerization Methods 0.000 claims 1
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070053742A KR100880725B1 (ko) | 2007-06-01 | 2007-06-01 | Ｐｄｐ 전극용 감광성 페이스트 조성물, ｐｄｐ 전극, 및이를 포함하는 플라즈마 디스플레이 패널 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200912528A TW200912528A (en) | 2009-03-16 |
| TWI374336B true TWI374336B (en) | 2012-10-11 |
Family
ID=40075251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097119985A TWI374336B (en) | 2007-06-01 | 2008-05-30 | Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8383013B2 (enExample) |
| JP (1) | JP2010529487A (enExample) |
| KR (1) | KR100880725B1 (enExample) |
| CN (1) | CN101681098B (enExample) |
| TW (1) | TWI374336B (enExample) |
| WO (1) | WO2008147063A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8329066B2 (en) * | 2008-07-07 | 2012-12-11 | Samsung Sdi Co., Ltd. | Paste containing aluminum for preparing PDP electrode, method of preparing the PDP electrode using the paste and PDP electrode prepared using the method |
| US8436537B2 (en) * | 2008-07-07 | 2013-05-07 | Samsung Sdi Co., Ltd. | Substrate structure for plasma display panel, method of manufacturing the substrate structure, and plasma display panel including the substrate structure |
| CN102834472B (zh) * | 2010-02-05 | 2015-04-22 | 凯博瑞奥斯技术公司 | 光敏墨组合物和透明导体以及它们的使用方法 |
| KR101332435B1 (ko) * | 2010-11-25 | 2013-11-22 | 제일모직주식회사 | 전극 페이스트 조성물 |
| CN102568651A (zh) * | 2012-01-19 | 2012-07-11 | 上海大洲电子材料有限公司 | 一种无卤素低含银量笔记本电脑键盘用银导线浆料及应用 |
| EP2905787A1 (en) * | 2014-02-07 | 2015-08-12 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive paste comprising an aliphatic mono-alcohol |
| CN105259306B (zh) * | 2015-10-13 | 2017-07-11 | 武汉工程大学 | 一种纳米过渡金属氧化物敏感浆料及其制备方法和应用 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
| JP2001249446A (ja) * | 2000-03-06 | 2001-09-14 | Sumitomo Bakelite Co Ltd | 感光性銀ペースト及びそれを用いた画像表示装置 |
| KR20020088208A (ko) * | 2001-05-18 | 2002-11-27 | 주식회사 엘지이아이 | 표시장치용 감광성 페이스트 조성물 |
| JP4369103B2 (ja) * | 2002-09-30 | 2009-11-18 | 太陽インキ製造株式会社 | 感光性導電ペースト及びそれを用いて電極形成したプラズマディスプレイパネル |
| KR100996235B1 (ko) * | 2004-06-01 | 2010-11-25 | 주식회사 동진쎄미켐 | ＰＤＰ 어드레스 전극용 Ｐｂ 미함유 Ａｇ 페이스트 조성물 |
| KR20050122498A (ko) * | 2004-06-24 | 2005-12-29 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 ｐｄｐ전극, 및 이를 포함하는 ｐｄｐ |
| KR20060029546A (ko) * | 2004-10-02 | 2006-04-06 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 ｐｄｐ전극, 및 이를 포함하는 ｐｄｐ |
| JP4870959B2 (ja) * | 2005-09-26 | 2012-02-08 | 太陽ホールディングス株式会社 | 感光性ペーストの製造方法及びプラズマディスプレイパネル |
| KR101363126B1 (ko) * | 2006-08-21 | 2014-02-13 | 제이에스알 가부시끼가이샤 | 감광성 수지 조성물, 감광성 필름 및 패턴 형성 방법 |
| KR100829667B1 (ko) * | 2006-09-07 | 2008-05-16 | 엘지전자 주식회사 | 전극용 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 상판구조 및 그 제조방법 |
| KR100899197B1 (ko) * | 2007-04-18 | 2009-05-26 | 제일모직주식회사 | 착색 유리프릿을 포함하는 전극 형성용 페이스트 조성물 및이를 이용하여 제조된 전극을 포함하는 플라즈마디스플레이 패널 |
-
2007
- 2007-06-01 KR KR1020070053742A patent/KR100880725B1/ko not_active Expired - Fee Related
-
2008
- 2008-05-16 JP JP2010510199A patent/JP2010529487A/ja active Pending
- 2008-05-16 CN CN200880018132XA patent/CN101681098B/zh not_active Expired - Fee Related
- 2008-05-16 US US12/451,790 patent/US8383013B2/en not_active Expired - Fee Related
- 2008-05-16 WO PCT/KR2008/002770 patent/WO2008147063A1/en not_active Ceased
- 2008-05-30 TW TW097119985A patent/TWI374336B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010529487A (ja) | 2010-08-26 |
| US20100164357A1 (en) | 2010-07-01 |
| TW200912528A (en) | 2009-03-16 |
| US8383013B2 (en) | 2013-02-26 |
| KR100880725B1 (ko) | 2009-02-02 |
| CN101681098B (zh) | 2013-07-03 |
| KR20080105747A (ko) | 2008-12-04 |
| CN101681098A (zh) | 2010-03-24 |
| WO2008147063A1 (en) | 2008-12-04 |
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