TWI372790B - Metal surface treatment composition - Google Patents

Metal surface treatment composition

Info

Publication number
TWI372790B
TWI372790B TW097105665A TW97105665A TWI372790B TW I372790 B TWI372790 B TW I372790B TW 097105665 A TW097105665 A TW 097105665A TW 97105665 A TW97105665 A TW 97105665A TW I372790 B TWI372790 B TW I372790B
Authority
TW
Taiwan
Prior art keywords
surface treatment
metal surface
treatment composition
composition
metal
Prior art date
Application number
TW097105665A
Other languages
English (en)
Other versions
TW200902761A (en
Inventor
Kesheng Feng
Ming De Wang
Steven A Castaldi
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of TW200902761A publication Critical patent/TW200902761A/zh
Application granted granted Critical
Publication of TWI372790B publication Critical patent/TWI372790B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW097105665A 2007-04-27 2008-02-19 Metal surface treatment composition TWI372790B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/796,660 US7645393B2 (en) 2007-04-27 2007-04-27 Metal surface treatment composition

Publications (2)

Publication Number Publication Date
TW200902761A TW200902761A (en) 2009-01-16
TWI372790B true TWI372790B (en) 2012-09-21

Family

ID=39885730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105665A TWI372790B (en) 2007-04-27 2008-02-19 Metal surface treatment composition

Country Status (7)

Country Link
US (1) US7645393B2 (zh)
EP (1) EP2132035A4 (zh)
JP (1) JP5139514B2 (zh)
CN (1) CN101668627B (zh)
MX (1) MX2010000837A (zh)
TW (1) TWI372790B (zh)
WO (1) WO2008133760A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8512504B2 (en) * 2009-05-06 2013-08-20 Steven A. Castaldi Process for improving adhesion of polymeric materials to metal surfaces
JP5466518B2 (ja) * 2010-01-15 2014-04-09 三菱製紙株式会社 銅または銅合金用エッチング液
JP6225467B2 (ja) * 2012-06-06 2017-11-08 三菱瓦斯化学株式会社 プリント配線板用銅箔およびその製造方法ならびにその銅箔を用いたプリント配線板
JP5559288B2 (ja) * 2012-11-13 2014-07-23 メック株式会社 プリント配線板の製造方法及び表面処理装置
CN107004599B (zh) * 2014-12-17 2020-02-18 三井化学株式会社 基板中间体、贯通通孔电极基板及贯通通孔电极形成方法
CN105056993B (zh) * 2015-08-13 2017-10-24 东华大学 一种Au PENPs固载滤纸及其制备和应用
EP3159432B1 (en) * 2015-10-23 2020-08-05 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
WO2017141799A1 (ja) * 2016-02-19 2017-08-24 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6333455B1 (ja) * 2017-08-23 2018-05-30 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6338232B1 (ja) 2017-09-22 2018-06-06 メック株式会社 銅表面の粗化方法および配線基板の製造方法
EP3748037A4 (en) * 2018-02-01 2021-03-10 Mitsubishi Gas Chemical Company, Inc. Aqueous SURFACE TREATMENT SOLUTION, METHOD FOR MANUFACTURING SURFACE-TREATED ALLOY AND COMPOSITE MATERIAL, AND MANUFACTURING METHOD FOR THEREFORE
WO2020250784A1 (ja) * 2019-06-11 2020-12-17 三菱瓦斯化学株式会社 水性組成物、これを用いたステンレス鋼表面の粗化処理方法、ならびに粗化処理されたステンレス鋼およびその製造方法
CN111020584B (zh) * 2019-12-23 2022-05-31 昆山市板明电子科技有限公司 铜表面微蚀粗化液及其制备方法
JP6779557B1 (ja) 2020-07-20 2020-11-04 メック株式会社 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法
CN113462217A (zh) * 2021-06-08 2021-10-01 上海应用技术大学 一种提高铜表面抑菌抗氧化性能的处理方法
CN116288350B (zh) * 2023-02-23 2024-04-19 湖北兴福电子材料股份有限公司 一种长寿命的铜蚀刻液及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2302332A (en) * 1940-04-09 1942-11-17 Du Pont Coating process
US3262791A (en) * 1960-08-04 1966-07-26 Petrolite Corp Corrosion preventing method and composition
US3425855A (en) * 1966-03-17 1969-02-04 Dow Chemical Co Coated titanium dioxide pigment
JPH0247556B2 (ja) * 1982-12-17 1990-10-22 Pii Esu Ai Sutaa Inc Doetsuchingunohohooyobietsuchingukozotai
US4466859A (en) * 1983-05-25 1984-08-21 Psi Star, Inc. Process for etching copper
JPS6092246A (ja) * 1983-10-25 1985-05-23 Toyo Soda Mfg Co Ltd ポリアミンの製造法
JP3325336B2 (ja) * 1993-05-17 2002-09-17 第一工業製薬株式会社 水洗トイレ用芳香洗浄剤組成物
JP3458023B2 (ja) * 1995-08-01 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
US6506314B1 (en) * 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
JP2003234315A (ja) * 2001-12-04 2003-08-22 Sanyo Chem Ind Ltd Ｃｍｐプロセス用研磨液
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
TW200517478A (en) * 2003-05-09 2005-06-01 Sanyo Chemical Ind Ltd Polishing liquid for CMP process and polishing method
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution

Also Published As

Publication number Publication date
EP2132035A4 (en) 2016-03-23
WO2008133760A1 (en) 2008-11-06
EP2132035A1 (en) 2009-12-16
CN101668627A (zh) 2010-03-10
CN101668627B (zh) 2013-09-04
TW200902761A (en) 2009-01-16
JP2010525175A (ja) 2010-07-22
US20080264900A1 (en) 2008-10-30
JP5139514B2 (ja) 2013-02-06
MX2010000837A (es) 2010-03-01
US7645393B2 (en) 2010-01-12

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