JP2010525175A - 金属表面処理組成物 - Google Patents
金属表面処理組成物 Download PDFInfo
- Publication number
- JP2010525175A JP2010525175A JP2010506184A JP2010506184A JP2010525175A JP 2010525175 A JP2010525175 A JP 2010525175A JP 2010506184 A JP2010506184 A JP 2010506184A JP 2010506184 A JP2010506184 A JP 2010506184A JP 2010525175 A JP2010525175 A JP 2010525175A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- acid
- ion source
- polymer
- roughening
- Prior art date
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- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 129
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 61
- 239000002184 metal Substances 0.000 title claims abstract description 61
- 238000004381 surface treatment Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 44
- 229920000642 polymer Polymers 0.000 claims abstract description 44
- 238000007788 roughening Methods 0.000 claims abstract description 37
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 24
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 24
- 239000002253 acid Substances 0.000 claims abstract description 23
- 239000007800 oxidant agent Substances 0.000 claims abstract description 20
- BTGRAWJCKBQKAO-UHFFFAOYSA-N adiponitrile Chemical compound N#CCCCCC#N BTGRAWJCKBQKAO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229960003280 cupric chloride Drugs 0.000 claims abstract description 10
- 239000002861 polymer material Substances 0.000 claims abstract description 10
- -1 halide ion Chemical class 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 23
- 150000002500 ions Chemical class 0.000 claims description 17
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 14
- 235000002639 sodium chloride Nutrition 0.000 claims description 13
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- 150000007524 organic acids Chemical class 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 9
- 150000007522 mineralic acids Chemical class 0.000 claims description 9
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 8
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 8
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 6
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 claims description 6
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 claims description 6
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims description 6
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 claims description 5
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- 229920002873 Polyethylenimine Polymers 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 235000010755 mineral Nutrition 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 235000005985 organic acids Nutrition 0.000 claims description 4
- 239000001103 potassium chloride Substances 0.000 claims description 4
- 235000011164 potassium chloride Nutrition 0.000 claims description 4
- 239000011780 sodium chloride Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 claims description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 3
- 229910021590 Copper(II) bromide Inorganic materials 0.000 claims description 3
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 claims description 3
- 239000001110 calcium chloride Substances 0.000 claims description 3
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 3
- 235000011148 calcium chloride Nutrition 0.000 claims description 3
- 239000007795 chemical reaction product Substances 0.000 claims description 3
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 3
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 claims description 3
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 150000003536 tetrazoles Chemical class 0.000 claims description 3
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 claims description 3
- 150000003852 triazoles Chemical group 0.000 claims description 3
- 239000011592 zinc chloride Substances 0.000 claims description 3
- 235000005074 zinc chloride Nutrition 0.000 claims description 3
- 229910001508 alkali metal halide Inorganic materials 0.000 claims 2
- 239000000654 additive Substances 0.000 abstract description 6
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 abstract description 4
- 230000000996 additive effect Effects 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 239000010410 layer Substances 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 16
- 239000002131 composite material Substances 0.000 description 8
- 238000001878 scanning electron micrograph Methods 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 230000002708 enhancing effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 5
- 229910001447 ferric ion Inorganic materials 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Natural products OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229940093915 gynecological organic acid Drugs 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 1
- QEYMMOKECZBKAC-UHFFFAOYSA-N 3-chloropropanoic acid Chemical compound OC(=O)CCCl QEYMMOKECZBKAC-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910021576 Iron(III) bromide Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-M chlorate Inorganic materials [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- PVFSDGKDKFSOTB-UHFFFAOYSA-K iron(3+);triacetate Chemical compound [Fe+3].CC([O-])=O.CC([O-])=O.CC([O-])=O PVFSDGKDKFSOTB-UHFFFAOYSA-K 0.000 description 1
- HEJPGFRXUXOTGM-UHFFFAOYSA-K iron(3+);triiodide Chemical compound [Fe+3].[I-].[I-].[I-] HEJPGFRXUXOTGM-UHFFFAOYSA-K 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229940040102 levulinic acid Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000005310 oxohalides Chemical class 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- CMZUMMUJMWNLFH-UHFFFAOYSA-N sodium metavanadate Chemical compound [Na+].[O-][V](=O)=O CMZUMMUJMWNLFH-UHFFFAOYSA-N 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- UYLYBEXRJGPQSH-UHFFFAOYSA-N sodium;oxido(dioxo)niobium Chemical compound [Na+].[O-][Nb](=O)=O UYLYBEXRJGPQSH-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- FEONEKOZSGPOFN-UHFFFAOYSA-K tribromoiron Chemical compound Br[Fe](Br)Br FEONEKOZSGPOFN-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
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Abstract
【解決手段】本発明のポリマーは、例えば、塩化第二銅及び塩酸を含む組成物に加えてもよく、また、酸化剤/酸/アゾール混合物を含む組成物にも使用できる。アジポニトリル等の他の添加剤もまた、本発明の組成物に効果的に加えてもよい。
【選択図】図1
Description
a)金属表面を以下i)〜iv)を含む組成物と接触させる工程、
i)第二銅イオン源を含む酸化剤、
ii)有機酸及び無機酸の少なくともいずれか1つ、
iii)ハロゲン化物イオン源、及び
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、並びに
b)その後、前記金属表面に高分子材料を結合する工程。
a)金属表面を以下i)〜v)を含む組成物と接触させる工程、
i)酸化剤、
ii)少なくとも1つの酸、
iii)腐食防止剤、
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、及び
v)任意で、ハロゲン化物イオン源、並びに
b)その後、前記金属表面に高分子材料を結合する工程。
a)金属表面を以下i)〜iv)を含む組成物と接触させる工程、
i)第二銅イオン源を含む酸化剤、
ii)有機酸及び無機酸の少なくともいずれか1つ、
iii)ハロゲン化物イオン源、及び
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、並びに
b)その後、前記金属表面に高分子材料を結合する工程。
塩化第二銅 150mL/L
塩酸(36%) 10mL/L
また、試料10及び11には、アジポニトリル0.5mL/Lを更に含有させた。
a)金属表面を以下i)〜v)を含む組成物と接触させる工程
i)酸化剤、
ii)少なくとも1つの酸、
iii)腐食防止剤、
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、及び
v)任意で、ハロゲン化物イオン源、並びに
b)その後、前記金属表面に高分子材料を結合する工程。
Claims (47)
- 金属表面に対する高分子材料の接着性を向上させる方法であって、前記方法は、以下の工程
a)前記金属表面を以下i)〜iv)を含む組成物と接触させる工程、
i)第二銅イオン源を含む酸化剤、
ii)有機酸及び無機酸の少なくともいずれか1つ、
iii)ハロゲン化物イオン源、及び
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、並びに
b)その後、前記金属表面に高分子材料を結合する工程
を含むことを特徴とする方法。 - 第二銅イオン源が、塩化第二銅、臭化第二銅、水酸化第二銅、有機酸の第二銅塩、及びこれらの1つ以上の組み合わせからなる群から選択される請求項1に記載の方法。
- 第二銅イオン源が塩化第二銅である請求項2に記載の方法。
- ハロゲン化物イオン源が、塩酸、臭化水素酸、塩化ナトリウム、塩化カルシウム、塩化カリウム、塩化アンモニウム、臭化カリウム、塩化銅、塩化亜鉛、塩化鉄、臭化鉄、臭化錫、臭化銅、及びこれらの1つ以上の組み合わせからなる群から選択される請求項1に記載の方法。
- ハロゲン化物イオン源が塩酸を含む請求項4に記載の方法。
- 組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.01g/L〜1.0g/Lである請求項1に記載の方法。
- 組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.15g/L〜約0.70g/Lである請求項6に記載の方法。
- 組成物が、アジポニトリルを更に含む請求項1に記載の方法。
- アジポニトリルの濃度が、約0.1mL/L〜1.0mL/Lである請求項8に記載の方法。
- 金属表面を浸漬及び噴霧のいずれかで組成物と接触させる請求項1に記載の方法。
- 金属表面に対する高分子材料の接着性を向上させる粗化組成物であって、前記組成物が
a)第二銅イオン源を含む酸化剤、
b)有機酸及び無機酸の少なくともいずれか1つ、
c)ハロゲン化物イオン源、及び
d)ポリ(エチレンアミノプロピオニトリル)ポリマー
を含むことを特徴とする粗化組成物。 - 第二銅イオン源が、塩化第二銅、臭化第二銅、水酸化第二銅、有機酸の第二銅塩、及びこれらの1つ以上の組み合わせからなる群から選択される請求項11に記載の粗化組成物。
- 第二銅イオン源が塩化第二銅である請求項12に記載の粗化組成物。
- ハロゲン化物イオン源が、塩酸、臭化水素酸、塩化ナトリウム、塩化カルシウム、塩化カリウム、塩化アンモニウム、臭化カリウム、塩化銅、塩化亜鉛、塩化鉄、臭化鉄、臭化錫、臭化銅、及びこれらの1つ以上の組み合わせからなる群から選択される請求項11に記載の粗化組成物。
- ハロゲン化物イオン源が塩酸を含む請求項14に記載の粗化組成物。
- 粗化組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.01g/L〜1.0g/Lである請求項11に記載の粗化組成物。
- 粗化組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.15g/L〜約0.70g/Lである請求項16に記載の粗化組成物。
- 粗化組成物が、アジポニトリルを更に含む請求項11に記載の粗化組成物。
- アジポニトリルの濃度が、約0.1mL/L〜1.0mL/Lである請求項18に記載の粗化組成物。
- 金属表面に対する高分子材料の接着性を向上させる方法であって、前記方法は、以下の工程
a)金属表面を以下i)〜v)を含む組成物と接触させる工程、
i)酸化剤、
ii)少なくとも1つの酸、
iii)腐食防止剤、
iv)ポリ(エチレンアミノプロピオニトリル)ポリマー、及び
v)任意で、ハロゲン化物イオン源、並びに
b)その後、前記金属表面に高分子材料を結合する工程
を含むことを特徴とする方法。 - 酸化剤が、過酸化水素及び過硫酸塩からなる群から選択される請求項20に記載の方法。
- 酸化剤が過酸化水素である請求項21に記載の方法。
- 腐食防止剤が、トリアゾール、ベンゾトリアゾール、イミダゾール、ベンズイミダゾール、テトラゾール及びこれらの1つ以上の混合物からなる群から選択される請求項20に記載の方法。
- 組成物が接着促進イオン源を更に含み、イオンが、モリブデン酸、タングステン酸、タンタル酸、ニオブ酸、バナジウム酸及びこれらの1つ以上の混合物からなる群から選択される請求項20に記載の方法。
- 接着促進イオン源がモリブデン酸イオンを含む請求項24に記載の方法。
- 少なくとも1つの酸が鉱酸である請求項20に記載の方法。
- ハロゲン化物イオン源が、アルカリ金属ハロゲン化物塩及びオキソハロゲン化物塩からなる群から選択される請求項20に記載の方法。
- ハロゲン化物イオン源が塩化物イオン源である請求項20に記載の方法。
- 組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.01g/L〜1.0g/Lである請求項20に記載の方法。
- 組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.15g/L〜0.70g/Lである請求項29に記載の粗化組成物。
- 組成物がアジポニトリルを更に含む請求項20に記載の方法。
- アジポニトリルの濃度が、約0.1mL/L〜1.0mL/Lである請求項31に記載の方法。
- 金属表面を浸漬及び噴霧のいずれかで組成物と接触させる請求項20に記載の方法。
- 高分子材料が、レジスト及びプリプレグのいずれかである請求項20に記載の方法。
- 金属表面に対する高分子材料の接着性を向上させる粗化組成物であって、
a)酸化剤、
b)少なくとも1つの酸、
c)腐食防止剤、
d)ポリエチレンイミン及びアクリロニトリルの反応生成物を含むポリマー、及び
e)任意で、ハロゲン化物イオン源
を含むことを特徴とする粗化組成物。 - 酸化剤が、過酸化水素及び過硫酸塩からなる群から選択される請求項35に記載の粗化組成物。
- 酸化剤が過酸化水素である請求項36に記載の粗化組成物。
- 腐食防止剤が、トリアゾール、ベンゾトリアゾール、イミダゾール、ベンズイミダゾール、テトラゾール及びこれら1つ以上の混合物からなる群から選択される請求項35に記載の粗化組成物。
- 粗化組成物が接着促進イオン源を更に含み、イオンが、モリブデン酸、タングステン酸、タンタル酸、ニオブ酸、バナジウム酸及びこれらの1つ以上の混合物からなる群から選択される請求項35に記載の粗化組成物。
- 接着促進イオン源がモリブデン酸イオンを含む請求項39に記載の粗化組成物。
- 少なくとも1つの酸が鉱酸である請求項35に記載の粗化組成物。
- ハロゲン化物イオン源が、アルカリ金属ハロゲン化物塩及びオキソハロゲン化物塩からなる群から選択される請求項35に記載の粗化組成物。
- ハロゲン化物イオン源が塩化物イオン源である請求項35に記載の粗化組成物。
- 粗化組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.01g/L〜1.0g/Lの範囲である請求項35に記載の粗化組成物。
- 粗化組成物中のポリ(エチレンアミノプロピオニトリル)ポリマーの濃度が、約0.15g/L〜約0.70g/Lの範囲である請求項44に記載の粗化組成物。
- 粗化組成物がアジポニトリルを更に含む請求項35に記載の粗化組成物。
- アジポニトリルの濃度が約0.1mL/L〜1.0mL/Lである請求項46に記載の粗化組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/796,660 | 2007-04-27 | ||
US11/796,660 US7645393B2 (en) | 2007-04-27 | 2007-04-27 | Metal surface treatment composition |
PCT/US2008/000577 WO2008133760A1 (en) | 2007-04-27 | 2008-01-17 | Metal surface treatment composition |
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JP (1) | JP5139514B2 (ja) |
CN (1) | CN101668627B (ja) |
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JP2011144423A (ja) * | 2010-01-15 | 2011-07-28 | Mitsubishi Paper Mills Ltd | 銅または銅合金用エッチング液 |
WO2017141799A1 (ja) * | 2016-02-19 | 2017-08-24 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
JP2017150069A (ja) * | 2016-02-19 | 2017-08-31 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
JP6333455B1 (ja) * | 2017-08-23 | 2018-05-30 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
US11230644B1 (en) | 2020-07-20 | 2022-01-25 | Mec Company Ltd. | Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite |
US12091430B2 (en) | 2019-09-06 | 2024-09-17 | Shikoku Chemicals Corporation | Metal surface treatment liquid and liquid concentrate thereof, metal surface treatment liquid set, metal surface treatment method, and method for manufacturing printed wiring board |
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JP2011144423A (ja) * | 2010-01-15 | 2011-07-28 | Mitsubishi Paper Mills Ltd | 銅または銅合金用エッチング液 |
WO2017141799A1 (ja) * | 2016-02-19 | 2017-08-24 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
JP2017150069A (ja) * | 2016-02-19 | 2017-08-31 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
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US11230644B1 (en) | 2020-07-20 | 2022-01-25 | Mec Company Ltd. | Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite |
Also Published As
Publication number | Publication date |
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EP2132035A1 (en) | 2009-12-16 |
TW200902761A (en) | 2009-01-16 |
CN101668627B (zh) | 2013-09-04 |
WO2008133760A1 (en) | 2008-11-06 |
JP5139514B2 (ja) | 2013-02-06 |
US7645393B2 (en) | 2010-01-12 |
TWI372790B (en) | 2012-09-21 |
CN101668627A (zh) | 2010-03-10 |
US20080264900A1 (en) | 2008-10-30 |
EP2132035A4 (en) | 2016-03-23 |
MX2010000837A (es) | 2010-03-01 |
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