TWI372717B - Apparatus for transferring substrate - Google Patents

Apparatus for transferring substrate

Info

Publication number
TWI372717B
TWI372717B TW096148009A TW96148009A TWI372717B TW I372717 B TWI372717 B TW I372717B TW 096148009 A TW096148009 A TW 096148009A TW 96148009 A TW96148009 A TW 96148009A TW I372717 B TWI372717 B TW I372717B
Authority
TW
Taiwan
Prior art keywords
transferring substrate
transferring
substrate
Prior art date
Application number
TW096148009A
Other languages
English (en)
Other versions
TW200925083A (en
Inventor
Juichung Cheng
Original Assignee
Prime View Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prime View Int Co Ltd filed Critical Prime View Int Co Ltd
Priority to TW096148009A priority Critical patent/TWI372717B/zh
Priority to JP2008034467A priority patent/JP2009147283A/ja
Priority to US12/104,687 priority patent/US20090156082A1/en
Priority to KR1020080050645A priority patent/KR100982818B1/ko
Publication of TW200925083A publication Critical patent/TW200925083A/zh
Application granted granted Critical
Publication of TWI372717B publication Critical patent/TWI372717B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096148009A 2007-12-14 2007-12-14 Apparatus for transferring substrate TWI372717B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW096148009A TWI372717B (en) 2007-12-14 2007-12-14 Apparatus for transferring substrate
JP2008034467A JP2009147283A (ja) 2007-12-14 2008-02-15 基板搬送装置
US12/104,687 US20090156082A1 (en) 2007-12-14 2008-04-17 Apparatus for Transferring Substrate
KR1020080050645A KR100982818B1 (ko) 2007-12-14 2008-05-30 기판 운반을 위한 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096148009A TWI372717B (en) 2007-12-14 2007-12-14 Apparatus for transferring substrate

Publications (2)

Publication Number Publication Date
TW200925083A TW200925083A (en) 2009-06-16
TWI372717B true TWI372717B (en) 2012-09-21

Family

ID=40753880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148009A TWI372717B (en) 2007-12-14 2007-12-14 Apparatus for transferring substrate

Country Status (4)

Country Link
US (1) US20090156082A1 (zh)
JP (1) JP2009147283A (zh)
KR (1) KR100982818B1 (zh)
TW (1) TWI372717B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108190519A (zh) * 2018-01-26 2018-06-22 江苏大丰和顺电子有限公司 一种平板电视机保护玻璃转运系统
KR20220062045A (ko) * 2019-11-29 2022-05-13 엘지전자 주식회사 자기부상 반송장치
CN111302062A (zh) * 2020-02-21 2020-06-19 深圳市华星光电半导体显示技术有限公司 加工平台

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
US5297910A (en) * 1991-02-15 1994-03-29 Tokyo Electron Limited Transportation-transfer device for an object of treatment
JPH0529435A (ja) * 1991-07-24 1993-02-05 Tokyo Electron Ltd 搬送装置
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
JP2598768Y2 (ja) * 1993-03-31 1999-08-16 芝浦メカトロニクス株式会社 搬送装置
KR100280947B1 (ko) * 1993-10-04 2001-02-01 마쓰바 구니유키 판 형상체 반송장치
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
ATE225969T1 (de) * 1997-02-08 2002-10-15 Jackson Technology Ltd Positionsgerät
JPH1111663A (ja) * 1997-06-27 1999-01-19 Tokyo Electron Ltd 基板搬送装置
US6053688A (en) * 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
JP4296587B2 (ja) * 1998-02-09 2009-07-15 株式会社ニコン 基板支持装置、基板搬送装置及びその方法、基板保持方法、並びに露光装置及びその製造方法
JP3260683B2 (ja) 1998-02-23 2002-02-25 鹿児島日本電気株式会社 基板移載装置
JP2002517088A (ja) * 1998-05-27 2002-06-11 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 半導体ウエハハンドリング用バッチ式エンドエフェクタ
US6450755B1 (en) * 1998-07-10 2002-09-17 Equipe Technologies Dual arm substrate handling robot with a batch loader
JP2001110874A (ja) * 1999-10-07 2001-04-20 Texas Instr Japan Ltd 半導体ウェハの搬送ハンド
EP1260126B1 (en) * 2000-02-17 2005-04-27 Matsushita Electric Industrial Co., Ltd. Recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
DE10013413C2 (de) * 2000-03-17 2003-06-05 Harry Gaus Rollsportgerät
US6464445B2 (en) * 2000-12-19 2002-10-15 Infineon Technologies Richmond, Lp System and method for improved throughput of semiconductor wafer processing
JP2003086659A (ja) * 2001-09-11 2003-03-20 Hirata Corp 基板の移載装置
JP3916473B2 (ja) * 2002-01-31 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2004022807A (ja) 2002-06-17 2004-01-22 Renesas Technology Corp 半導体処理装置およびその調整方法
ATE500057T1 (de) * 2002-07-29 2011-03-15 Du Pont Kohlefaser-kompositmaterial mit reflektierender oberfläche für transferelemente
JP3779702B2 (ja) * 2003-06-27 2006-05-31 株式会社シマノ 自転車用フロントフォーク、自転車用ハブ、及びそれらを備えた自転車用電力供給システム
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
TWI293281B (en) * 2003-08-22 2008-02-11 Innolux Display Corp Substrate transfer
KR20050038134A (ko) * 2003-10-21 2005-04-27 삼성전자주식회사 기판 스토킹 시스템
TWI241934B (en) * 2003-12-03 2005-10-21 Quanta Display Inc Apparatus and method for inspecting and repairing circuit defect
JP2006156667A (ja) * 2004-11-29 2006-06-15 Fujitsu Ltd ウェハ移載装置及び半導体装置の製造方法
KR20060100519A (ko) * 2005-03-17 2006-09-21 삼성전자주식회사 웨이퍼 핸들링을 위한 진공 트위져
DE102006026503B3 (de) * 2006-06-06 2008-01-31 Kuka Innotec Gmbh Vorrichtung und Verfahren zum Aufnehmen und Übergeben von Glassubstratplatten
KR100772846B1 (ko) * 2006-08-30 2007-11-02 삼성전자주식회사 반도체 소자 제조를 위한 종형 확산로의 웨이퍼 검출장치와방법

Also Published As

Publication number Publication date
US20090156082A1 (en) 2009-06-18
JP2009147283A (ja) 2009-07-02
KR20090064271A (ko) 2009-06-18
TW200925083A (en) 2009-06-16
KR100982818B1 (ko) 2010-09-16

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