TWI371075B - Apparatus for transfer semiconductor packages - Google Patents
Apparatus for transfer semiconductor packagesInfo
- Publication number
- TWI371075B TWI371075B TW097110651A TW97110651A TWI371075B TW I371075 B TWI371075 B TW I371075B TW 097110651 A TW097110651 A TW 097110651A TW 97110651 A TW97110651 A TW 97110651A TW I371075 B TWI371075 B TW I371075B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor packages
- transfer semiconductor
- transfer
- packages
- semiconductor
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070031716A KR100871670B1 (en) | 2007-03-30 | 2007-03-30 | Apparatus for Transfer Semiconductor Packages |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200845269A TW200845269A (en) | 2008-11-16 |
| TWI371075B true TWI371075B (en) | 2012-08-21 |
Family
ID=39808436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097110651A TWI371075B (en) | 2007-03-30 | 2008-03-26 | Apparatus for transfer semiconductor packages |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100871670B1 (en) |
| TW (1) | TWI371075B (en) |
| WO (1) | WO2008120876A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101704525B1 (en) * | 2014-11-27 | 2017-02-09 | 주식회사 라온테크 | Link-arm robot comprising vibration-reduction apparatus for improving accuracy |
| CN109822609B (en) * | 2019-03-25 | 2024-02-27 | 苏州富强科技有限公司 | Eccentric rotary type multi-station switching rotating device |
| KR102643958B1 (en) * | 2021-10-07 | 2024-03-07 | 주식회사 티에프이 | Picker assembly for semiconductor package and adsorption moudule used therefor |
| KR102363354B1 (en) * | 2021-11-03 | 2022-02-15 | 제너셈(주) | Picker apparatus |
| KR102362685B1 (en) * | 2021-11-03 | 2022-02-14 | 제너셈(주) | Picker apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100497574B1 (en) * | 2003-03-13 | 2005-07-01 | 한미반도체 주식회사 | Pick & place system for semiconductor manufacturing equipment |
| JP2005039087A (en) * | 2003-07-16 | 2005-02-10 | Yaskawa Electric Corp | Substrate processing device |
| KR100571513B1 (en) * | 2005-02-04 | 2006-04-14 | 세크론 주식회사 | Chip picker of sawing sorter system |
| KR200404835Y1 (en) * | 2005-10-19 | 2005-12-28 | 주식회사 프로텍 | The pick up cylinder for element of a semiconductor |
-
2007
- 2007-03-30 KR KR1020070031716A patent/KR100871670B1/en active IP Right Grant
-
2008
- 2008-03-17 WO PCT/KR2008/001489 patent/WO2008120876A1/en active Application Filing
- 2008-03-26 TW TW097110651A patent/TWI371075B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW200845269A (en) | 2008-11-16 |
| KR100871670B1 (en) | 2008-12-03 |
| WO2008120876A1 (en) | 2008-10-09 |
| KR20080088877A (en) | 2008-10-06 |
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