TWI372436B - A position changing device and system for manufacturing semiconductor package - Google Patents

A position changing device and system for manufacturing semiconductor package

Info

Publication number
TWI372436B
TWI372436B TW096131885A TW96131885A TWI372436B TW I372436 B TWI372436 B TW I372436B TW 096131885 A TW096131885 A TW 096131885A TW 96131885 A TW96131885 A TW 96131885A TW I372436 B TWI372436 B TW I372436B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
changing device
manufacturing semiconductor
position changing
manufacturing
Prior art date
Application number
TW096131885A
Other languages
English (en)
Chinese (zh)
Other versions
TW200816356A (en
Inventor
Hyun Gyun Jung
Kyu Seok Hwang
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of TW200816356A publication Critical patent/TW200816356A/zh
Application granted granted Critical
Publication of TWI372436B publication Critical patent/TWI372436B/zh

Links

TW096131885A 2006-08-28 2007-08-28 A position changing device and system for manufacturing semiconductor package TWI372436B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060081492 2006-08-28
KR1020060139252A KR100920988B1 (ko) 2006-08-28 2006-12-31 위치변경장치 및 반도체 패키지 가공시스템

Publications (2)

Publication Number Publication Date
TW200816356A TW200816356A (en) 2008-04-01
TWI372436B true TWI372436B (en) 2012-09-11

Family

ID=39394810

Family Applications (3)

Application Number Title Priority Date Filing Date
TW096131885A TWI372436B (en) 2006-08-28 2007-08-28 A position changing device and system for manufacturing semiconductor package
TW096131889A TWI368291B (en) 2006-08-28 2007-08-28 A semiconductor package fixing assembly
TW096131887A TWI349326B (en) 2006-08-28 2007-08-28 A semiconductor package fixing jig assembly

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW096131889A TWI368291B (en) 2006-08-28 2007-08-28 A semiconductor package fixing assembly
TW096131887A TWI349326B (en) 2006-08-28 2007-08-28 A semiconductor package fixing jig assembly

Country Status (2)

Country Link
KR (7) KR100920988B1 (ko)
TW (3) TWI372436B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101066823B1 (ko) * 2009-10-15 2011-09-27 정병직 단말기 기능테스트용 공용지그
KR200454092Y1 (ko) * 2010-05-12 2011-06-15 주식회사 아이엔티 슬릿구조를 가지는 멀티 어셈블리 지그
KR101324946B1 (ko) * 2012-03-07 2013-11-04 한미반도체 주식회사 반도체 자재 절단장치
KR101306191B1 (ko) * 2012-07-06 2013-09-30 주식회사 이젠테크놀 알에프아이디 카지노 칩의 위변조체크 및 수량 카운트 검사장치
KR102440451B1 (ko) * 2016-01-29 2022-09-06 한미반도체 주식회사 반도체 패키지 처리장치
KR102037189B1 (ko) * 2018-07-04 2019-10-28 제너셈(주) 반도체 패키지 로딩언로딩 장치
KR102044159B1 (ko) * 2019-08-23 2019-11-13 제너셈(주) 반도체 패키지 로딩언로딩 장치
KR102617583B1 (ko) * 2022-05-27 2023-12-27 주식회사 에스엔티 반전 공급된 칩 캐리어의 칩 이전 장치
CN116690399B (zh) * 2023-08-07 2023-09-26 烟台一诺电子材料有限公司 一种键合丝抛光涂层一体化装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232080A (ja) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置
JP2001077057A (ja) 1999-09-06 2001-03-23 Disco Abrasive Syst Ltd Ｃｓｐ基板分割装置
JP4449124B2 (ja) * 1999-11-08 2010-04-14 パナソニック株式会社 トレイの支持方法と装置、これによるトレイの取り扱い装置
KR100368574B1 (ko) * 2000-06-22 2003-01-24 메카텍스 (주) 피씨 베이스 모듈아이씨 테스트 핸들러의 위치변환장치
KR100347382B1 (ko) * 2000-10-19 2002-08-03 동양반도체장비 주식회사 반도체패키지 자재의 리버싱 장치 및 그 방법
KR20020054713A (ko) * 2000-12-28 2002-07-08 박종섭 반도체 패키지 제조용 와이어 본딩 장비의 피더레일셋팅용 지그
KR100384845B1 (ko) * 2000-12-30 2003-05-22 주식회사 하이닉스반도체 표면실장형 패키지의 리패어 방법 및 상기 방법에적용되는 딥핑장치
KR100799209B1 (ko) * 2002-02-26 2008-01-29 삼성테크윈 주식회사 반도체 팩키지 제조용 회전 테이블 장치
KR100366371B1 (ko) * 2002-03-04 2002-12-31 주식회사 로보텍 도료 분사 시스템
KR20040009803A (ko) * 2002-07-25 2004-01-31 삼성전자주식회사 진공흡착패드의 피치 조절이 자유로운 반도체 칩 패키지이송 장치
KR20040081531A (ko) * 2003-03-13 2004-09-22 삼성전자주식회사 반도체 소자 조립 공정에 사용되는 소터 장비에서 픽업좌표를 설정하는 방법
KR100479417B1 (ko) * 2003-03-31 2005-03-25 한미반도체 주식회사 반도체 패키지 제조공정용 쏘잉 장치 및 그 제어방법
KR100574584B1 (ko) * 2003-05-31 2006-04-27 한미반도체 주식회사 반도체 패키지 제조공정용 절단 및 핸들러시스템
KR100501799B1 (ko) * 2003-07-14 2005-07-20 최록일 반도체패키지 제조용 자동몰딩시스템
KR20060087720A (ko) * 2005-01-31 2006-08-03 삼성전자주식회사 칩 스케일 패키지 쏘잉 및 소팅 장치
KR100714106B1 (ko) * 2005-12-15 2007-05-02 (주)테크윙 테스트핸들러 및 테스트핸들러의 작동방법
KR200436944Y1 (ko) 2006-12-27 2007-10-18 주식회사 휘닉스 디지탈테크 이송시스템

Also Published As

Publication number Publication date
KR100920988B1 (ko) 2009-10-09
KR20080019538A (ko) 2008-03-04
TW200818377A (en) 2008-04-16
KR20080019535A (ko) 2008-03-04
KR20080019524A (ko) 2008-03-04
KR100915444B1 (ko) 2009-09-04
KR20080019534A (ko) 2008-03-04
TWI368291B (en) 2012-07-11
TW200822280A (en) 2008-05-16
KR20080019536A (ko) 2008-03-04
KR100855361B1 (ko) 2008-09-04
KR20080019526A (ko) 2008-03-04
TWI349326B (en) 2011-09-21
KR100884056B1 (ko) 2009-02-19
KR100884057B1 (ko) 2009-02-19
KR100909257B1 (ko) 2009-07-27
KR20080019537A (ko) 2008-03-04
TW200816356A (en) 2008-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees