TWI368291B - A semiconductor package fixing assembly - Google Patents

A semiconductor package fixing assembly

Info

Publication number
TWI368291B
TWI368291B TW096131889A TW96131889A TWI368291B TW I368291 B TWI368291 B TW I368291B TW 096131889 A TW096131889 A TW 096131889A TW 96131889 A TW96131889 A TW 96131889A TW I368291 B TWI368291 B TW I368291B
Authority
TW
Taiwan
Prior art keywords
semiconductor package
fixing assembly
package fixing
assembly
semiconductor
Prior art date
Application number
TW096131889A
Other languages
Chinese (zh)
Other versions
TW200818377A (en
Inventor
Hyun Gyun Jung
Jai Young Lim
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of TW200818377A publication Critical patent/TW200818377A/en
Application granted granted Critical
Publication of TWI368291B publication Critical patent/TWI368291B/en

Links

TW096131889A 2006-08-28 2007-08-28 A semiconductor package fixing assembly TWI368291B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060081492 2006-08-28
KR1020070066992A KR100915444B1 (en) 2006-08-28 2007-07-04 A Semiconductor Package Fixing Assembly

Publications (2)

Publication Number Publication Date
TW200818377A TW200818377A (en) 2008-04-16
TWI368291B true TWI368291B (en) 2012-07-11

Family

ID=39394810

Family Applications (3)

Application Number Title Priority Date Filing Date
TW096131885A TWI372436B (en) 2006-08-28 2007-08-28 A position changing device and system for manufacturing semiconductor package
TW096131889A TWI368291B (en) 2006-08-28 2007-08-28 A semiconductor package fixing assembly
TW096131887A TWI349326B (en) 2006-08-28 2007-08-28 A semiconductor package fixing jig assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW096131885A TWI372436B (en) 2006-08-28 2007-08-28 A position changing device and system for manufacturing semiconductor package

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW096131887A TWI349326B (en) 2006-08-28 2007-08-28 A semiconductor package fixing jig assembly

Country Status (2)

Country Link
KR (7) KR100920988B1 (en)
TW (3) TWI372436B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101066823B1 (en) * 2009-10-15 2011-09-27 정병직 Commong jig for testing performance of mobilestation
KR200454092Y1 (en) * 2010-05-12 2011-06-15 주식회사 아이엔티 Multi Assembly Jig with Slit Structure
KR101324946B1 (en) * 2012-03-07 2013-11-04 한미반도체 주식회사 Semiconductor Material Sawing Device
KR101306191B1 (en) * 2012-07-06 2013-09-30 주식회사 이젠테크놀 Test device forgery check and quantity count of rfid casino chips
KR102440451B1 (en) * 2016-01-29 2022-09-06 한미반도체 주식회사 Semiconductor Package Processing Apparatus
KR102037189B1 (en) * 2018-07-04 2019-10-28 제너셈(주) Loading-unloading apparatus of semiconductor package
KR102044159B1 (en) * 2019-08-23 2019-11-13 제너셈(주) Loading-unloading apparatus of semiconductor package
KR102617583B1 (en) * 2022-05-27 2023-12-27 주식회사 에스엔티 Chip carrier exchanging apparatus
CN116690399B (en) * 2023-08-07 2023-09-26 烟台一诺电子材料有限公司 Bonding wire polishing coating integrated device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000232080A (en) 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd Workpiece to be processed dividing system, and pellet- shifting apparatus
JP2001077057A (en) 1999-09-06 2001-03-23 Disco Abrasive Syst Ltd Csp substrate splitter
JP4449124B2 (en) * 1999-11-08 2010-04-14 パナソニック株式会社 Tray support method and apparatus, and tray handling apparatus thereby
KR100368574B1 (en) * 2000-06-22 2003-01-24 메카텍스 (주) Pivot rotating device for module IC test handler
KR100347382B1 (en) * 2000-10-19 2002-08-03 동양반도체장비 주식회사 Reversing device of a semiconductor package materials and its method
KR20020054713A (en) * 2000-12-28 2002-07-08 박종섭 jig for setting feeder rail of wire bonding equipment in fabrication of semiconductor packag
KR100384845B1 (en) * 2000-12-30 2003-05-22 주식회사 하이닉스반도체 A method for repair of surface mount technology type package and dipping apparatus for applying the same
KR100799209B1 (en) * 2002-02-26 2008-01-29 삼성테크윈 주식회사 Turn table machine for manufacturing semiconductor package
KR100366371B1 (en) * 2002-03-04 2002-12-31 주식회사 로보텍 System for spraying paint
KR20040009803A (en) * 2002-07-25 2004-01-31 삼성전자주식회사 Pick and place apparatus for semiconductor chip package that vacuum pad pitch setting is free
KR20040081531A (en) * 2003-03-13 2004-09-22 삼성전자주식회사 Method for setting up pick up coordinates for sorter equipment used in assembling semiconductor device
KR100479417B1 (en) * 2003-03-31 2005-03-25 한미반도체 주식회사 A sawing apparatus and a control method for manufacturing processes of semiconductor package
KR100574584B1 (en) * 2003-05-31 2006-04-27 한미반도체 주식회사 sawing and handler system for manufacturing semiconductor package
KR100501799B1 (en) * 2003-07-14 2005-07-20 최록일 Auto molding system for fabricating semiconductor package
KR20060087720A (en) * 2005-01-31 2006-08-03 삼성전자주식회사 Chip scale package sawing and sorting apparatus
KR100714106B1 (en) * 2005-12-15 2007-05-02 (주)테크윙 Test handler and operation method of test handler
KR200436944Y1 (en) 2006-12-27 2007-10-18 주식회사 휘닉스 디지탈테크 Transferring system

Also Published As

Publication number Publication date
KR100855361B1 (en) 2008-09-04
KR20080019535A (en) 2008-03-04
KR20080019524A (en) 2008-03-04
KR100915444B1 (en) 2009-09-04
KR100909257B1 (en) 2009-07-27
KR100884056B1 (en) 2009-02-19
TWI349326B (en) 2011-09-21
KR20080019537A (en) 2008-03-04
KR20080019526A (en) 2008-03-04
TW200818377A (en) 2008-04-16
KR20080019538A (en) 2008-03-04
KR20080019534A (en) 2008-03-04
KR100920988B1 (en) 2009-10-09
TW200822280A (en) 2008-05-16
KR100884057B1 (en) 2009-02-19
KR20080019536A (en) 2008-03-04
TWI372436B (en) 2012-09-11
TW200816356A (en) 2008-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees