KR20040009803A - Pick and place apparatus for semiconductor chip package that vacuum pad pitch setting is free - Google Patents
Pick and place apparatus for semiconductor chip package that vacuum pad pitch setting is free Download PDFInfo
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- KR20040009803A KR20040009803A KR1020020043869A KR20020043869A KR20040009803A KR 20040009803 A KR20040009803 A KR 20040009803A KR 1020020043869 A KR1020020043869 A KR 1020020043869A KR 20020043869 A KR20020043869 A KR 20020043869A KR 20040009803 A KR20040009803 A KR 20040009803A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 반도체 칩 패키지 이송 장치에 관한 것으로서, 더욱 상세하게는 공정 설비에서 또는 그 공정 설비와 트레이간의 반도체 칩 패키지 이송에 사용되는 진공흡착패드 피치의 조절이 자유로운 반도체 칩 패키지 이송 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip package transfer device, and more particularly, to a semiconductor chip package transfer device that can freely adjust a vacuum adsorption pad pitch used in a process facility or a semiconductor chip package transfer between a process facility and a tray.
일반적으로 반도체 칩 패키지 이송 장치는 반도체 칩 패키지를 제조하기 위한 조립(assembly) 공정과 검사(test) 공정 등에서 반도체 칩 패키지를 공정 설비 내 또는 공정 설비와 반도체 칩 패키지가 수납되는 트레이(tray)간의 패키지 이송을 담당하는 장치이다. 최근 주로 사용되고 있는 반도체 칩 패키지 이송 장치를 소개하기로 한다.In general, a semiconductor chip package transfer device includes a semiconductor chip package in a process facility or a tray between trays in which a process facility and a semiconductor chip package are accommodated in an assembly process and a test process for manufacturing a semiconductor chip package. It is a device in charge of the transfer. The semiconductor chip package transfer device which is mainly used recently will be introduced.
도 1은 종래 기술에 따른 반도체 칩 패키지 이송 장치의 개략 구성도이다.1 is a schematic configuration diagram of a semiconductor chip package transfer device according to the prior art.
도 1을 참조하면, 종래에 주로 사용되는 반도체 칩 패키지 이송 장치(110)는 소위 분류 픽커(sorting picker)라고 불리기도 하며 반도체 칩 패키지(1)를 흡착하는 복수 개의 진공흡착패드(112)와, 그 진공흡착패드(112)의 수직 위치를 변화시키는 진공흡착패드 수직 구동기(113)를 포함하는 픽커 어셈블리(picker assembly; 111)와, 그 픽커 어셈블리(111)가 결합되는 픽커 어셈블리 이송 하우징(123), 및 그 픽커 어셈블리 이송 하우징(123)의 위치 이동을 안내하는 픽커 어셈블리 이송 하우징 샤프트(131)등을 구비하여 구성되어 있다.Referring to FIG. 1, a conventional semiconductor chip package transfer device 110 may be referred to as a sorting picker, and may include a plurality of vacuum adsorption pads 112 that adsorb the semiconductor chip package 1. A picker assembly 111 including a vacuum suction pad vertical driver 113 for changing the vertical position of the vacuum suction pad 112 and a picker assembly transfer housing 123 to which the picker assembly 111 is coupled. And a picker assembly transfer housing shaft 131 for guiding the positional movement of the picker assembly transfer housing 123.
반도체 칩 패키지(1)를 이송시키기 위하여 먼저 픽커 어셈블리 이송 하우징(123)이 반도체 칩 패키지(1)의 상부에 진공흡착패드(112)가 위치하도록 이동된다. 이동이 완료되면 진공흡착패드 수직 구동기(113)가 동작되어 진공흡착패드(112)를 하강시킨다. 진공흡착패드(112)의 하강이 완료되면 진공흡착패드(112)에 인가되는 진공흡입력에 의해 트레이(3)에 수납된 반도체 칩 패키지(1)가 흡착되고, 그 상태에서 진공흡착패드(112)가 진공흡착패드 수직 구동기(113)에 의해 상승된다. 상승이 완료되면 픽커 어셈블리 이송 하우징(123)이 반도체 칩 패키지(1)를 옮기고자 하는 위치로 이동시킨다. 이동이 완료되면 다시 진공흡착패드 수직 구동기(113)에 의해 진공흡착패드(112)가 하강되고 진공흡입력이 해제되어 반도체 칩 패키지(1)를 놓게 된다. 그리고나서, 진공흡착패드 수직 구동기(113)에 의해 진공흡착패드(112)가 상승된다. 상승이 완료되면 1사이클(cycle)의 패키지 분류 작업이 완료된다.In order to transfer the semiconductor chip package 1, the picker assembly transfer housing 123 is first moved so that the vacuum adsorption pad 112 is positioned on the semiconductor chip package 1. When the movement is completed, the vacuum suction pad vertical driver 113 is operated to lower the vacuum suction pad 112. When the lowering of the vacuum adsorption pad 112 is completed, the semiconductor chip package 1 accommodated in the tray 3 is adsorbed by the vacuum suction input applied to the vacuum adsorption pad 112, and the vacuum adsorption pad 112 is in that state. Is lifted by the vacuum suction pad vertical driver 113. When the lifting is completed, the picker assembly transfer housing 123 moves the semiconductor chip package 1 to the position to be moved. When the movement is completed, the vacuum suction pad 112 is lowered by the vacuum suction pad vertical driver 113, and the vacuum suction input is released to place the semiconductor chip package 1. Then, the vacuum suction pad 112 is lifted by the vacuum suction pad vertical driver 113. Once the ascent is complete, one cycle of package classification is completed.
이와 같은 종래의 반도체 칩 패키지 이송 장치(110)는 진공흡착패드(112)의 피치와 작업 위치에 놓여지는 반도체 칩 패키지(1)들의 피치(pitch) 및 트레이(3)에 형성된 포켓(5)의 피치가 P1로서 모두 동일한 경우 동시 픽-업(pick-up) 또는 동시 픽-다운(pick-down) 작업이 이루어진다. 그리고, 어느 하나의 피치가 다를 경우 선택적으로 개별 픽-업 또는 개별 픽-다운이 이루어지도록 하고 있다. 예를 들어, 복수 개의 진공흡착패드 피치와 이송하고자 하는 반도체 칩 패키지 피치가 같고 포켓(5)의 피치가 다를 경우 동시 픽-업 후 개별 픽-다운이 이루어진다.The conventional semiconductor chip package transfer device 110 may include a pitch of the vacuum adsorption pad 112 and a pitch of the semiconductor chip packages 1 placed at a working position and a pocket 5 formed in the tray 3. Simultaneous pick-up or simultaneous pick-down operations are made when the pitches are all the same as P 1 . When either pitch is different, an individual pick-up or an individual pick-down is selectively performed. For example, when a plurality of vacuum suction pad pitches and a semiconductor chip package pitch to be transferred are the same and the pitches of the pockets 5 are different, individual pick-downs are performed after simultaneous pick-up.
그러나, 이와 같은 종래의 반도체 칩 패키지 이송 장치는 반도체 칩 패키지와 포켓 및 진공흡착패드의 피치가 서로 다를 경우에 개별 픽-업 또는 개별 픽-다운이 이루어지기 때문에 생산성이 현저히 저하되는 문제점을 가지고 있다. 특히, 진공흡착패드의 개수가 많아지면 많아질수록 동시 픽-업 또는 픽-다운이 어렵게 된다. 이를 방지하기 위해서는 반도체 칩 패키지 이송 장치를 변경하거나 필요에 따라 품종 교체 키트(kit)를 교체해 주어야 하는 등 번거로움이 따르며 설비 유지관리 항목이 증가하게 되어 그에 따른 업무 손실이 발생하게 된다.However, such a conventional semiconductor chip package transfer apparatus has a problem in that productivity is significantly reduced since individual pick-up or individual pick-down is performed when the pitches of the semiconductor chip package, the pocket and the vacuum suction pad are different from each other. . In particular, as the number of vacuum suction pads increases, the simultaneous pick-up or pick-down becomes difficult. In order to prevent this, it is cumbersome, such as changing the semiconductor chip package transfer device or replacing a varieties replacement kit (kit) if necessary, and the maintenance of the facility is increased, resulting in a loss of work.
따라서 본 발명의 목적은 공정 설비 내에서의 반도체 칩 패키지 피치 변화나 트레이의 포켓 피치 변화에 따른 진공흡착패드의 피치 조절이 자유로운 반도체 칩 패키지 이송 장치를 제공하는 데에 있다.Accordingly, an object of the present invention is to provide a semiconductor chip package transfer device that can freely adjust the pitch of a vacuum adsorption pad according to a change in pitch of a semiconductor chip package or a change in pocket pitch of a tray in a process facility.
도 1은 종래 기술에 따른 반도체 칩 패키지 이송 장치의 개략 구성도,1 is a schematic configuration diagram of a semiconductor chip package transfer device according to the prior art,
도 2는 본 발명에 따른 반도체 칩 패키지 이송 장치의 개략 구성도이다.2 is a schematic configuration diagram of a semiconductor chip package transfer device according to the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1; 반도체 칩 패키지3; 트레이(tray)One; Semiconductor chip package 3; Tray
5; 포켓(pocket)10; 반도체 칩 패키지 이송 장치5; Pocket 10; Semiconductor Chip Package Transfer Device
11; 픽커 어셈블리12; 진공흡착패드11; Picker assembly 12; Vacuum adsorption pad
13; 진공흡착패드 수직 구동기(actuator)13; Vacuum Suction Pad Vertical Actuator
15; 피치 조절용 샤프트(shaft)15; Pitch Shaft
17; 나사산 하우징(housing)19; 나사산17; Threaded housings 19; Thread
21; 피치 조절용 모터(motor)23; 픽커 어셈블리 이송 하우징21; Pitch motor 23; Picker Assembly Transfer Housing
31; 픽커 어셈블리 이송 하우징 샤프트31; Picker Assembly Transfer Housing Shaft
이와 같은 목적을 달성하기 위한 본 발명에 따른 진공흡착패드의 피치의 조절이 자유로운 반도체 칩 패키지 이송 장치는, 반도체 칩 패키지를 흡착하는 복수의 진공흡착패드와 각각의 진공흡착패드가 결합되어 그 진공흡착패드를 수직으로 이동시키는 진공흡착패드 수직 구동기를 포함하는 픽커 어셈블리와, 각각의 진공흡착패드 수직 구동기가 수평이동이 가능하도록 결합되는 픽커 어셈블리 이송 하우징과, 그 픽커 어셈블리 이송 하우징의 이동을 안내하는 픽커 어셈블리 이송 하우징 샤프트와, 각각의 진공흡착패드 수직 구동기에 독립적으로 장착되며 나사산이 형성된 피치 조절용 샤프트 삽입구멍이 형성된 나사산 하우징과, 그 나사산 하우징이 각각 결합되는 복수 개의 나사산부들이 진공흡착패드들을 양분하는 중심을 기준으로 좌우 서로 반대 방향의 나사산을 가지며 나사산 하우징들간에 동일 간격이 유지되면서 피치를 증가시키는 나사산 비율로 나사산이 형성된 피치 조절용 샤프트, 및 그 피치 조절용 샤프트를 회전 운동시켜 상기 나사산 하우징의 간격을 변동시키는피치 조절용 모터를 포함하는 것을 특징으로 한다.In order to achieve the above object, the semiconductor chip package transfer device of which the pitch of the vacuum adsorption pad can be freely adjusted according to the present invention includes a plurality of vacuum adsorption pads for adsorbing the semiconductor chip package and respective vacuum adsorption pads coupled to the vacuum adsorption pad. A picker assembly comprising a vacuum adsorption pad vertical driver for vertically moving the pad, a picker assembly transport housing to which each of the vacuum adsorption pad vertical drivers is coupled to allow horizontal movement, and a picker for guiding movement of the picker assembly transport housing; An assembly transfer housing shaft, a threaded housing having a threaded pitch adjusting shaft insertion hole independently mounted to each vacuum suction pad vertical actuator, and a plurality of threads to which the threaded housing is coupled divide the vacuum suction pads. Half to the left and right relative to the center A pitch adjusting shaft having a thread in a direction and having a thread ratio increasing the pitch while maintaining the same spacing between the thread housings, and a pitch adjusting motor for rotating the pitch adjusting shaft to rotate the pitch adjusting shaft to vary the spacing of the thread housing. Characterized in that.
바람직하게는 피치 조절용 샤프트가 진공흡착패드들을 양분하는 중심으로부터 1번째 나사산부의 나사산 피치 비율을 1로 할 때 n번째 나사산부의 나사산 피치 비율이 2n-1을 이루는 나사산부들을 갖도록 한다.Preferably, the pitch adjusting shaft has thread portions in which the thread pitch ratio of the nth thread portion is 2n-1 when the thread pitch ratio of the first thread portion is 1 from the center for dividing the vacuum suction pads.
이하 첨부 도면을 참조하여 본 발명에 따른 피치의 조절이 자유로운 반도체 칩 패키지 이송 장치를 보다 상세하게 설명하고자 한다.Hereinafter, a semiconductor chip package transfer device in which pitch can be freely adjusted according to the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 반도체 칩 패키지 이송 장치의 개략 구성도이고, 도 3은 본 발명에 따른 반도체 칩 패키지 이송 장치의 부분 사시도이며, 도 4는 도 3에서 나사산 하우징과 피치 조절용 샤프트의 결합 구조를 나타낸 부분 사시도이며 도 5는 도 3에서 나사산 하우징과 피치 조절용 샤프트의 단면도이다.2 is a schematic configuration diagram of a semiconductor chip package transfer device according to the present invention, FIG. 3 is a partial perspective view of the semiconductor chip package transfer device according to the present invention, and FIG. 4 is a coupling structure of a threaded housing and a pitch adjusting shaft in FIG. 5 is a cross-sectional view of a threaded housing and a pitch adjusting shaft in FIG. 3.
도 2내지 도 5를 참조하면, 본 발명에 따른 반도체 칩 패키지 이송 장치(10)는, 반도체 칩 패키지(1)를 트레이(3)의 포켓(5)에 수납시키거나 포켓(5)에 수납된 반도체 칩 패키지(1)를 작업의 진행을 위한 특정 위치로 이송시키기 위한 장치로서, 반도체 칩 패키지(1)에 접촉되어 인가되는 진공흡입력에 의해 반도체 칩 패키지(1)를 흡착하는 진공흡착패드(12) 복수 개를 포함하고 각각의 진공흡착패드(12)에는 진공흡착패드(12)의 수직 위치를 이동시키는 진공흡착패드 수직 구동기(actuator; 13)가 결합되어 있는 구조의 픽커 어셈블리(11)를 구비한다.2 to 5, the semiconductor chip package transfer device 10 according to the present invention accommodates the semiconductor chip package 1 in the pocket 5 of the tray 3 or is stored in the pocket 5. An apparatus for transferring the semiconductor chip package 1 to a specific position for the progress of the work, the vacuum adsorption pad 12 for adsorbing the semiconductor chip package 1 by the vacuum suction input applied in contact with the semiconductor chip package 1 Each of the vacuum suction pads 12 includes a plurality of picker assemblies 11 having a vacuum suction pad vertical actuator 13 for moving the vertical position of the vacuum suction pad 12. do.
픽커 어셈블리(11)는 픽커 어셈블리 이송 하우징(23)에 수평 이동이 가능하도록 결합되며, 픽커 어셈블리 이송 하우징(23)은 픽커 어셈블리 이송 하우징 샤프트(31)에 결합된다. 여기서는, 픽커 어셈블리 이송 하우징(23)에 안내 레일(24)을형성하고 그 안내 레일(24)에 진공흡착패드 수직 구동기(13)가 결합되도록 하여 픽커 어셈블리(11)가 픽커 어셈블리 이송 하우징(23)의 안내 레일(24) 상에서 수평 이동이 가능하도록 하고 있다.The picker assembly 11 is coupled to the picker assembly transfer housing 23 so as to be horizontally movable, and the picker assembly transfer housing 23 is coupled to the picker assembly transfer housing shaft 31. Here, the guide rail 24 is formed in the picker assembly transfer housing 23 and the vacuum adsorption pad vertical driver 13 is coupled to the guide rail 24 so that the picker assembly 11 is connected to the picker assembly transfer housing 23. The horizontal movement is made possible on the guide rail 24.
각각의 진공흡착패드 수직 구동기(13)에는 나사산이 형성된 샤프트 삽입구멍(18)을 갖는 나사산 하우징(17a~17f)이 장착되어 있고, 복수의 나사산 하우징(17a~17f)들의 샤프트 삽입구멍(18)에 피치 조절용 샤프트(15)가 결합되어 있다. 그리고, 피치 조절용 샤프트(15)는 피치 조절용 모터(21)에 결합되어 그로부터 회전 운동의 구동력을 전달받아 회전운동이 가능하다Each vacuum suction pad vertical driver 13 is equipped with threaded housings 17a to 17f having threaded shaft insertion holes 18, and shaft insertion holes 18 of the plurality of threaded housings 17a to 17f. Pitch adjusting shaft 15 is coupled to. And, the pitch adjusting shaft 15 is coupled to the pitch adjusting motor 21 is received from the driving force of the rotational movement from it is possible to rotate the movement
한편 피치 조절용 샤프트(15)는 도 5에 나타난 것과 같이 복수 개의 진공흡착수단 수직 구동기(13)들을 양분하는 중심(도 5의 O)을 기준으로 좌우로 서로 반대 방향의 나사산이 형성된 복수 개의 나사산부(16a~16f)가 일정 간격으로 형성되어 있고 그 나사산부(16a~16f) 위치에 나사산 하우징(17a~17f)이 각각 결합되어 있다. 피치 조절용 샤프트(15)상에서 나사산 하우징(17a~17f)간의 간격이 동일하게 변화될 수 있도록 중심으로부터 1번째 나사산부(16c와 16d)의 나사산 피치 비율을 1로 할 때 n번째 나사산부의 나사산 피치 비율은 2n-1로 한다. 예컨대, 2번째 나사산부(16b와 16e)의 나사산 피치 비율은 3으로 하고 3번째 나사산부(16a와 16f)의 나사산 피치 비율은 5로 한다. 이는 피치 조절용 모터(21)의 구동에 따른 진공흡착패드 수직 구동기(13)들의 위치를 이동시킬 때 동일 간격이 유지될 수 있도록 하기 위한 것이다.Meanwhile, as shown in FIG. 5, the pitch adjusting shaft 15 has a plurality of threaded portions in which threads of opposite directions are formed from side to side on the basis of the center (O of FIG. 5) for dividing the plurality of vacuum suction means vertical drivers 13. 16a-16f are formed in fixed space | interval, and the threaded housing 17a-17f is couple | bonded with the threaded part 16a-16f position, respectively. The thread pitch ratio of the nth threaded portion when the thread pitch ratio of the first threaded portions 16c and 16d from the center is 1 so that the distance between the thread housings 17a to 17f on the pitch adjusting shaft 15 can be changed equally. Is 2n-1. For example, the thread pitch ratio of the second threaded portions 16b and 16e is set to 3, and the thread pitch ratio of the third threaded portions 16a and 16f is set to 5. This is to maintain the same spacing when moving the position of the vacuum suction pad vertical driver 13 according to the drive of the motor 21 for pitch adjustment.
반도체 칩 패키지(1)를 수납하기 위한 트레이(3)의 포켓(5)들의 피치가 증가되어 진공흡착패드(12)들간의 피치가 그에 대응되게 증가되어야 할 필요가 있을 경우, 폭 조절용 모터(21)가 회전하여 폭 조절용 샤프트(15)를 회전시키게 된다. 이에 따라, 폭 조절용 샤프트(15)의 진공흡착패드(12)들을 양분하는 중심을 기준으로 나사산부(16a~16f)가 서로 반대 방향으로 형성되어 있기 때문에 나사산 하우징(17)은 중심을 기준으로 좌우로 간격이 벌어지게 되고, 동일 방향의 나사산부(16a~16f)간에도 나사산 피치 비율의 차이로 동일한 간격이 유지되며 벌어지게 된다. 따라서, 나사산 하우징(17)이 장착된 진공흡착패드 수직 구동기(13)의 간격이 벌어지게 된다. 이에 의해 진공흡착패드(12)들의 피치가 증가될 수 있다.When the pitch of the pockets 5 of the tray 3 for accommodating the semiconductor chip package 1 is increased so that the pitch between the vacuum suction pads 12 needs to be increased correspondingly, the motor 21 for width adjustment ) Rotates the shaft 15 for width adjustment. Accordingly, since the threaded portions 16a to 16f are formed in opposite directions with respect to the center for dividing the vacuum adsorption pads 12 of the shaft 15 for width adjustment, the threaded housing 17 is left and right relative to the center. The gaps of the furnace are opened, and the same intervals are maintained while the same between the threaded portions 16a to 16f in the same direction is maintained by the difference in the thread pitch ratio. Thus, the space between the vacuum suction pad vertical driver 13 on which the threaded housing 17 is mounted is widened. As a result, the pitch of the vacuum adsorption pads 12 may be increased.
요구되는 피치 변화량에 따른 폭 조절용 모터의 회전 정도를 프로그램으로 구현하여 제어할 수 있도록 하면, 변화된 피치 수치의 입력을 통하여 그에 대응되는 회전 정도가 자동으로 설정되어 그 설정 정도만큼 폭 조절용 모터가 회전되도록 할 수 있다.If the degree of rotation of the motor for controlling the width according to the required pitch change can be implemented and controlled by the program, the corresponding degree of rotation is automatically set by inputting the changed pitch value so that the motor for width adjustment is rotated by the setting degree. can do.
한편, 본 발명에 따른 반도체 칩 패키지 이송 장치는 전술한 실시예에 한정되지 않고 본 발명의 기술적 중심사상을 벗어나지 않는 범위 내에서 다양하게 변형 실시될 수 있다.On the other hand, the semiconductor chip package transfer apparatus according to the present invention is not limited to the above-described embodiment may be variously modified within the scope not departing from the technical spirit of the present invention.
이상과 같은 본 발명에 의한 반도체 칩 패키지 이송 장치에 따르면, 반도체 칩 패키지가 수납되는 포켓 또는 반도체 칩 패키지가 안착되는 설비의 작업 위치에서의 피치 변화에 따른 진공흡착패드 피치의 자유로운 조정이 용이하게 이루어질 수 있기 때문에 특정 진공흡착패드를 이용하여 1개씩 반도체 칩 패키지를 이송시켜야 하는 번거로움이 없이 동시 픽-업과 동시 픽-다운에 의해 다수의 반도체 칩 패키지를 한꺼번에 이송시킬 수 있다. 따라서, 설비 생산성이 향상될 수 있고, 제품 유형의 변화에 따라 그에 대응되는 피치를 갖는 교체 키트가 필요 없으며, 피치 변화에 따른 작업 정지 시간을 최소화할 수 있다.According to the semiconductor chip package conveying apparatus according to the present invention as described above, it is easy to freely adjust the pitch of the vacuum adsorption pad according to the change in the pitch at the working position of the pocket in which the semiconductor chip package or the semiconductor chip package is seated. Therefore, a plurality of semiconductor chip packages can be transferred at the same time by simultaneous pick-up and simultaneous pick-down, without the need to transfer the semiconductor chip packages one by one using a specific vacuum adsorption pad. Therefore, facility productivity can be improved, and a replacement kit having a corresponding pitch according to the change of the product type is not necessary, and downtime according to the change of the pitch can be minimized.
Claims (2)
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| KR1020020043869A KR20040009803A (en) | 2002-07-25 | 2002-07-25 | Pick and place apparatus for semiconductor chip package that vacuum pad pitch setting is free |
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| KR100462194B1 (en) * | 2002-10-04 | 2004-12-17 | 미래산업 주식회사 | Multi-Picker of Handler |
| KR100817254B1 (en) * | 2007-03-27 | 2008-03-27 | 한국뉴매틱(주) | Level compensator having a vacuum pump therein |
| KR100835135B1 (en) * | 2007-04-13 | 2008-06-04 | (주)제이티 | Tool for transferring semiconductor device |
| KR100915444B1 (en) * | 2006-08-28 | 2009-09-04 | 한미반도체 주식회사 | A Semiconductor Package Fixing Assembly |
| US7795076B2 (en) * | 2003-06-12 | 2010-09-14 | Symbol Technologies, Inc. | Method, system, and apparatus for transfer of dies using a die plate having die cavities |
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| US7795076B2 (en) * | 2003-06-12 | 2010-09-14 | Symbol Technologies, Inc. | Method, system, and apparatus for transfer of dies using a die plate having die cavities |
| KR100915444B1 (en) * | 2006-08-28 | 2009-09-04 | 한미반도체 주식회사 | A Semiconductor Package Fixing Assembly |
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| WO2008117928A1 (en) * | 2007-03-27 | 2008-10-02 | Korea Pneumatic System Co., Ltd | Level compensator having a vacuum pump therein |
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| KR100986597B1 (en) * | 2008-06-12 | 2010-10-08 | 무송기공(주) | Vacuum holder for vacuum feeding apparatus |
| KR101042693B1 (en) * | 2008-11-25 | 2011-06-20 | 세크론 주식회사 | Picker system of test handler |
| WO2013162475A1 (en) * | 2012-04-25 | 2013-10-31 | Ust Technology Pte. Ltd. | A packaging apparatus and method for transferring integrated circuits to a packaging |
| KR20150014377A (en) * | 2013-07-29 | 2015-02-06 | 토와 가부시기가이샤 | Apparatus and method for conveying singulated electronic component |
| KR101386526B1 (en) * | 2013-11-29 | 2014-04-17 | 문종현 | Apparatus for loading chip components |
| WO2019035557A1 (en) * | 2017-08-14 | 2019-02-21 | 삼성전자주식회사 | Electrical element transfer apparatus |
| CN110998819A (en) * | 2017-08-14 | 2020-04-10 | 三星电子株式会社 | Electric component conveying device |
| US11805633B2 (en) | 2017-08-14 | 2023-10-31 | Samsung Electronics Co., Ltd. | Electrical element transfer apparatus |
| CN110998819B (en) * | 2017-08-14 | 2023-11-28 | 三星电子株式会社 | Electrical component transfer device |
| WO2020077863A1 (en) * | 2018-10-16 | 2020-04-23 | 广东工业大学 | Mass transfer apparatus and transfer method for micro-led |
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