TWI371836B - Semiconductor device and method for fabricating the same - Google Patents

Semiconductor device and method for fabricating the same

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Publication number
TWI371836B
TWI371836B TW096127798A TW96127798A TWI371836B TW I371836 B TWI371836 B TW I371836B TW 096127798 A TW096127798 A TW 096127798A TW 96127798 A TW96127798 A TW 96127798A TW I371836 B TWI371836 B TW I371836B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
semiconductor device
semiconductor
Prior art date
Application number
TW096127798A
Other languages
English (en)
Other versions
TW200818425A (en
Inventor
Yoshitsugu Katoh
Tetsuya Fujisawa
Mitsutaka Sato
Eiji Yoshida
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Publication of TW200818425A publication Critical patent/TW200818425A/zh
Application granted granted Critical
Publication of TWI371836B publication Critical patent/TWI371836B/zh

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    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW096127798A 2006-09-14 2007-07-30 Semiconductor device and method for fabricating the same TWI371836B (en)

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JP5550225B2 (ja) * 2008-09-29 2014-07-16 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
US7906836B2 (en) * 2008-11-14 2011-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Heat spreader structures in scribe lines
JP2010147060A (ja) * 2008-12-16 2010-07-01 Sharp Corp 半導体装置
KR101027984B1 (ko) * 2009-05-26 2011-04-13 우진공업주식회사 히트싱크를 갖는 기판보드 어셈블리
KR101067980B1 (ko) * 2009-12-28 2011-09-26 주식회사 케이이씨 전력 반도체 패키지 및 그 제조 방법
JP2012004282A (ja) * 2010-06-16 2012-01-05 Mitsubishi Electric Corp 半導体装置
JP5606273B2 (ja) * 2010-10-29 2014-10-15 キヤノン株式会社 放射線画像撮影装置
JP2012164846A (ja) * 2011-02-08 2012-08-30 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び表示装置
US8962393B2 (en) * 2011-09-23 2015-02-24 Stats Chippac Ltd. Integrated circuit packaging system with heat shield and method of manufacture thereof
KR101608182B1 (ko) * 2012-08-02 2016-03-31 미쓰비시덴키 가부시키가이샤 방열판
CN104627438A (zh) * 2015-03-11 2015-05-20 南京一擎机械制造有限公司 电热丝紧固座、电热丝紧固装置及电热丝紧组件
US20170127567A1 (en) * 2015-10-28 2017-05-04 Stmicroelectronics (Grenoble 2) Sas Electronic device equipped with a heat sink
JP6678506B2 (ja) * 2016-04-28 2020-04-08 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及び半導体パッケージの製造方法
KR102086364B1 (ko) 2018-03-05 2020-03-09 삼성전자주식회사 반도체 패키지
FR3116944A1 (fr) * 2020-12-02 2022-06-03 Stmicroelectronics (Grenoble 2) Sas Boîtier de circuit integre
JPWO2023203754A1 (zh) * 2022-04-22 2023-10-26

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TW200818425A (en) 2008-04-16
KR20080024964A (ko) 2008-03-19
CN101145546A (zh) 2008-03-19
JP5017977B2 (ja) 2012-09-05
US20080067672A1 (en) 2008-03-20
KR100930283B1 (ko) 2009-12-09
CN101145546B (zh) 2010-06-09
US7692294B2 (en) 2010-04-06

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