TWI370547B - Structure and method for making strained channel field effect transistor using sacrificial spacer - Google Patents

Structure and method for making strained channel field effect transistor using sacrificial spacer

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Publication number
TWI370547B
TWI370547B TW094132510A TW94132510A TWI370547B TW I370547 B TWI370547 B TW I370547B TW 094132510 A TW094132510 A TW 094132510A TW 94132510 A TW94132510 A TW 94132510A TW I370547 B TWI370547 B TW I370547B
Authority
TW
Taiwan
Prior art keywords
field effect
effect transistor
channel field
sacrificial spacer
strained channel
Prior art date
Application number
TW094132510A
Other languages
English (en)
Other versions
TW200616225A (en
Inventor
Huajie Chen
Dureseti Chidambarrao
Sang-Hyun Oh
Siddhartha Panda
Werner A Rausch
Henry K Utomo
Tsutomu Sato
Original Assignee
Ibm
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm, Toshiba Kk filed Critical Ibm
Publication of TW200616225A publication Critical patent/TW200616225A/zh
Application granted granted Critical
Publication of TWI370547B publication Critical patent/TWI370547B/zh

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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
TW094132510A 2004-09-29 2005-09-20 Structure and method for making strained channel field effect transistor using sacrificial spacer TWI370547B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/711,637 US7135724B2 (en) 2004-09-29 2004-09-29 Structure and method for making strained channel field effect transistor using sacrificial spacer

Publications (2)

Publication Number Publication Date
TW200616225A TW200616225A (en) 2006-05-16
TWI370547B true TWI370547B (en) 2012-08-11

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TW094132510A TWI370547B (en) 2004-09-29 2005-09-20 Structure and method for making strained channel field effect transistor using sacrificial spacer

Country Status (8)

Country Link
US (2) US7135724B2 (zh)
EP (1) EP1805796B1 (zh)
JP (1) JP5571286B2 (zh)
KR (1) KR101006306B1 (zh)
CN (2) CN101969030B (zh)
SG (1) SG142307A1 (zh)
TW (1) TWI370547B (zh)
WO (1) WO2006039377A1 (zh)

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JP2005332993A (ja) * 2004-05-20 2005-12-02 Sanyo Electric Co Ltd 半導体装置および半導体装置の製造方法
EP1650796A3 (fr) * 2004-10-20 2010-12-08 STMicroelectronics (Crolles 2) SAS Procédé de prise de contact sur une région d'un circuit intégré, en particulier sur les électrodes d'un transistor
US7217647B2 (en) * 2004-11-04 2007-05-15 International Business Machines Corporation Structure and method of making a semiconductor integrated circuit tolerant of mis-alignment of a metal contact pattern
US7397081B2 (en) * 2004-12-13 2008-07-08 International Business Machines Corporation Sidewall semiconductor transistors
US20080121932A1 (en) 2006-09-18 2008-05-29 Pushkar Ranade Active regions with compatible dielectric layers
US7545023B2 (en) * 2005-03-22 2009-06-09 United Microelectronics Corp. Semiconductor transistor
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