TWI367246B - - Google Patents
Info
- Publication number
- TWI367246B TWI367246B TW095142436A TW95142436A TWI367246B TW I367246 B TWI367246 B TW I367246B TW 095142436 A TW095142436 A TW 095142436A TW 95142436 A TW95142436 A TW 95142436A TW I367246 B TWI367246 B TW I367246B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
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JP2005334235 | 2005-11-18 | ||
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TW100112010A TW201202375A (en) | 2005-11-18 | 2006-11-16 | Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
TW095142436A TW200730599A (en) | 2005-11-18 | 2006-11-16 | Adhesive composition, circuit connecting material, connecting structure circuit member connecting method |
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TW100112010A TW201202375A (en) | 2005-11-18 | 2006-11-16 | Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
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JP (2) | JP4877230B2 (ja) |
KR (2) | KR20110048079A (ja) |
CN (1) | CN101309993B (ja) |
TW (2) | TW201202375A (ja) |
WO (1) | WO2007058159A1 (ja) |
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JP5018270B2 (ja) * | 2007-06-22 | 2012-09-05 | パナソニック株式会社 | 半導体積層体とそれを用いた半導体装置 |
CN103484035A (zh) * | 2007-08-02 | 2014-01-01 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
KR101130377B1 (ko) * | 2007-10-18 | 2012-03-27 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체 |
JP4623224B2 (ja) * | 2008-06-26 | 2011-02-02 | 日立化成工業株式会社 | 樹脂フィルムシート及び電子部品 |
JP4862921B2 (ja) * | 2008-07-01 | 2012-01-25 | 日立化成工業株式会社 | 回路接続材料、回路接続構造体及びその製造方法 |
US20110300326A1 (en) * | 2009-02-27 | 2011-12-08 | Hitachi Chemical Company, Ltd. | Adhesive material reel |
JP4640531B2 (ja) * | 2009-07-02 | 2011-03-02 | 日立化成工業株式会社 | 導電粒子 |
JP5375374B2 (ja) * | 2009-07-02 | 2013-12-25 | 日立化成株式会社 | 回路接続材料及び回路接続構造体 |
JP4640532B2 (ja) * | 2009-07-02 | 2011-03-02 | 日立化成工業株式会社 | 被覆導電粒子 |
CN102474024B (zh) * | 2009-07-02 | 2014-09-17 | 日立化成株式会社 | 导电粒子 |
JP5589361B2 (ja) * | 2009-11-16 | 2014-09-17 | 日立化成株式会社 | 導電粒子及びその製造方法 |
JP5580729B2 (ja) * | 2010-12-28 | 2014-08-27 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
KR101151366B1 (ko) | 2011-11-24 | 2012-06-08 | 한화케미칼 주식회사 | 도전성 입자 및 이의 제조방법 |
KR101987509B1 (ko) * | 2012-01-19 | 2019-06-10 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전 재료 및 접속 구조체 |
JP5936882B2 (ja) * | 2012-03-02 | 2016-06-22 | デクセリアルズ株式会社 | 回路接続材料、及びそれを用いた実装体の製造方法 |
WO2014088095A1 (ja) * | 2012-12-06 | 2014-06-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP6212366B2 (ja) * | 2013-08-09 | 2017-10-11 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
TWI624356B (zh) * | 2013-11-11 | 2018-05-21 | Nippon Steel & Sumitomo Metal Corp | Metal joint structure using metal nanoparticle, metal joint method, and metal joint material |
KR20160106004A (ko) * | 2014-01-08 | 2016-09-09 | 세키스이가가쿠 고교가부시키가이샤 | 백 콘택트 방식의 태양 전지 모듈용 도전성 입자, 도전 재료 및 태양 전지 모듈 |
WO2015107996A1 (ja) * | 2014-01-14 | 2015-07-23 | 東洋アルミニウム株式会社 | 複合導電性粒子、それを含む導電性樹脂組成物および導電性塗布物 |
JP2015195178A (ja) * | 2014-03-26 | 2015-11-05 | デクセリアルズ株式会社 | 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体 |
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JP7007138B2 (ja) * | 2016-09-09 | 2022-02-10 | 積水化学工業株式会社 | 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
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JP4563110B2 (ja) * | 2004-08-20 | 2010-10-13 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
JP4593302B2 (ja) * | 2005-02-03 | 2010-12-08 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
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JP4860163B2 (ja) * | 2005-02-15 | 2012-01-25 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
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JP4936678B2 (ja) * | 2005-04-21 | 2012-05-23 | 積水化学工業株式会社 | 導電性粒子及び異方性導電材料 |
JP2006331714A (ja) * | 2005-05-24 | 2006-12-07 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
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JP4718926B2 (ja) * | 2005-07-29 | 2011-07-06 | 積水化学工業株式会社 | 導電性微粒子、及び、異方性導電材料 |
JP2007035574A (ja) * | 2005-07-29 | 2007-02-08 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
JP4598621B2 (ja) * | 2005-07-29 | 2010-12-15 | 積水化学工業株式会社 | 導電性微粒子、及び、異方性導電材料 |
JP4950451B2 (ja) * | 2005-07-29 | 2012-06-13 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
-
2006
- 2006-11-14 CN CN2006800430380A patent/CN101309993B/zh active Active
- 2006-11-14 KR KR1020117009581A patent/KR20110048079A/ko not_active Application Discontinuation
- 2006-11-14 WO PCT/JP2006/322628 patent/WO2007058159A1/ja active Application Filing
- 2006-11-14 JP JP2007545234A patent/JP4877230B2/ja not_active Expired - Fee Related
- 2006-11-14 KR KR1020087011623A patent/KR101049609B1/ko active IP Right Grant
- 2006-11-16 TW TW100112010A patent/TW201202375A/zh unknown
- 2006-11-16 TW TW095142436A patent/TW200730599A/zh unknown
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2011
- 2011-06-01 JP JP2011123727A patent/JP2011231326A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW200730599A (en) | 2007-08-16 |
KR101049609B1 (ko) | 2011-07-14 |
JP4877230B2 (ja) | 2012-02-15 |
WO2007058159A1 (ja) | 2007-05-24 |
CN101309993B (zh) | 2012-06-27 |
JP2011231326A (ja) | 2011-11-17 |
CN101309993A (zh) | 2008-11-19 |
KR20110048079A (ko) | 2011-05-09 |
JPWO2007058159A1 (ja) | 2009-04-30 |
TW201202375A (en) | 2012-01-16 |
KR20080072658A (ko) | 2008-08-06 |
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