JP2007059785A5 - - Google Patents

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Publication number
JP2007059785A5
JP2007059785A5 JP2005245832A JP2005245832A JP2007059785A5 JP 2007059785 A5 JP2007059785 A5 JP 2007059785A5 JP 2005245832 A JP2005245832 A JP 2005245832A JP 2005245832 A JP2005245832 A JP 2005245832A JP 2007059785 A5 JP2007059785 A5 JP 2007059785A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005245832A
Other versions
JP2007059785A (ja
JP4914589B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005245832A external-priority patent/JP4914589B2/ja
Priority to JP2005245832A priority Critical patent/JP4914589B2/ja
Priority to TW095111955A priority patent/TWI303088B/zh
Priority to US11/412,990 priority patent/US7481885B2/en
Priority to DE102006032730.6A priority patent/DE102006032730B4/de
Priority to DE102006062990.6A priority patent/DE102006062990B3/de
Priority to KR1020060066138A priority patent/KR100778353B1/ko
Priority to DE102006062913.2A priority patent/DE102006062913B4/de
Priority to CN2006101055543A priority patent/CN1921071B/zh
Priority to CN201010113008A priority patent/CN101826508A/zh
Publication of JP2007059785A publication Critical patent/JP2007059785A/ja
Publication of JP2007059785A5 publication Critical patent/JP2007059785A5/ja
Priority to US12/332,409 priority patent/US7977787B2/en
Priority to US13/160,204 priority patent/US8324657B2/en
Publication of JP4914589B2 publication Critical patent/JP4914589B2/ja
Application granted granted Critical
Priority to US13/666,473 priority patent/US8609443B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005245832A 2005-08-26 2005-08-26 半導体製造装置、半導体製造方法および半導体装置 Active JP4914589B2 (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP2005245832A JP4914589B2 (ja) 2005-08-26 2005-08-26 半導体製造装置、半導体製造方法および半導体装置
TW095111955A TWI303088B (en) 2005-08-26 2006-04-04 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device
US11/412,990 US7481885B2 (en) 2005-08-26 2006-04-28 Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device
DE102006032730.6A DE102006032730B4 (de) 2005-08-26 2006-07-14 Halbleitervorrichtungs-Herstelllungsvorrichtung, Halbleitervorrichtungs-Herstellungsverfahren und Halbleitervorrichtung
DE102006062990.6A DE102006062990B3 (de) 2005-08-26 2006-07-14 Verfahren zur Herstellung einer Halbleitervorrichtung, welche ein nichtflüchtiger Speicher ist, und Halbleitervorrichtung, welche ein nichtflüchtiger Speicher ist
KR1020060066138A KR100778353B1 (ko) 2005-08-26 2006-07-14 반도체 제조장치, 반도체 제조방법 및 반도체 장치
DE102006062913.2A DE102006062913B4 (de) 2005-08-26 2006-07-14 Halbleitervorrichtung
CN201010113008A CN101826508A (zh) 2005-08-26 2006-07-18 半导体装置
CN2006101055543A CN1921071B (zh) 2005-08-26 2006-07-18 半导体制造装置及半导体制造方法
US12/332,409 US7977787B2 (en) 2005-08-26 2008-12-11 Semiconductor device
US13/160,204 US8324657B2 (en) 2005-08-26 2011-06-14 Semiconductor device
US13/666,473 US8609443B2 (en) 2005-08-26 2012-11-01 Semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005245832A JP4914589B2 (ja) 2005-08-26 2005-08-26 半導体製造装置、半導体製造方法および半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011276921A Division JP2012109581A (ja) 2011-12-19 2011-12-19 半導体製造方法および半導体装置

Publications (3)

Publication Number Publication Date
JP2007059785A JP2007059785A (ja) 2007-03-08
JP2007059785A5 true JP2007059785A5 (ja) 2008-02-14
JP4914589B2 JP4914589B2 (ja) 2012-04-11

Family

ID=37715688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005245832A Active JP4914589B2 (ja) 2005-08-26 2005-08-26 半導体製造装置、半導体製造方法および半導体装置

Country Status (6)

Country Link
US (4) US7481885B2 (ja)
JP (1) JP4914589B2 (ja)
KR (1) KR100778353B1 (ja)
CN (2) CN1921071B (ja)
DE (3) DE102006032730B4 (ja)
TW (1) TWI303088B (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5084236B2 (ja) * 2006-11-30 2012-11-28 東京エレクトロン株式会社 デバイス製造装置およびデバイス製造方法
JP2008270472A (ja) * 2007-04-19 2008-11-06 Elpida Memory Inc 半導体装置および製造方法
JP2009054706A (ja) * 2007-08-24 2009-03-12 Ulvac Japan Ltd 電子デバイスの製造方法
US8318540B2 (en) 2008-05-19 2012-11-27 Infineon Technologies Ag Method of manufacturing a semiconductor structure
US20110157752A1 (en) * 2008-09-08 2011-06-30 Mitsubishi Electric Corporation Overcurrent detection circuit, inverter, compressor, and air-conditioning machine, and adjusting method for adjusting overcurrent detection circuit
JP2010182776A (ja) * 2009-02-04 2010-08-19 Konica Minolta Holdings Inc 導電膜パターンおよび導電膜パターンの形成方法
TWI385388B (zh) * 2009-04-02 2013-02-11 Hon Tech Inc Micro - sensing IC test classification machine
WO2011036718A1 (ja) * 2009-09-25 2011-03-31 株式会社アドバンテスト プローブ装置および試験装置
EP3062343B1 (de) 2010-02-22 2022-08-17 Swiss Technology Enterprise GmbH Verfahren zum herstellen eines halbleitermoduls
US9059407B2 (en) 2010-08-18 2015-06-16 National Institute Of Advanced Industrial Science And Technology Method for manufacturing organic semiconductor thin film and monocryastalline organic semiconductor thin film
JP5685467B2 (ja) * 2010-09-16 2015-03-18 富士フイルム株式会社 パターン形成方法及びパターン形成装置
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers
CN102279220A (zh) * 2011-03-11 2011-12-14 潘元志 制造芯片的方法、气体传感器装置、在芯片上镀碳纳米管的方法
CN103377954B (zh) * 2012-04-28 2016-12-14 无锡华润上华科技有限公司 栅极焊盘和源极焊盘的形成方法
US9672316B2 (en) 2013-07-17 2017-06-06 Arm Limited Integrated circuit manufacture using direct write lithography
CN103886113A (zh) * 2014-04-04 2014-06-25 东莞铭丰集团有限公司 晶片盒内晶片的数据的采集与处理的方法及装置
CN104977518B (zh) * 2014-04-09 2018-05-01 中芯国际集成电路制造(上海)有限公司 一种晶圆出货检验方法
JP6428564B2 (ja) 2015-10-28 2018-11-28 株式会社ダイフク 搬送台車
DE102017103310A1 (de) * 2016-02-19 2017-08-24 Infineon Technologies Ag Substrat einer elektronischen vorrichtung und verfahren zum herstellen desselben
US9786568B2 (en) 2016-02-19 2017-10-10 Infineon Technologies Ag Method of manufacturing an integrated circuit substrate
US10269635B2 (en) 2016-02-19 2019-04-23 Infineon Technologies Ag Integrated circuit substrate and method for manufacturing the same
CN107799432B (zh) * 2016-09-06 2020-05-05 中芯国际集成电路制造(上海)有限公司 管芯分拣装置
US10580753B2 (en) 2017-07-21 2020-03-03 Infineon Technologies Ag Method for manufacturing semiconductor devices
CN110376504B (zh) * 2019-06-27 2022-06-17 瑞芯微电子股份有限公司 一种关于ic高压损伤模拟系统及方法
CN111632794B (zh) * 2020-05-12 2021-02-19 杭州沃镭智能科技股份有限公司 一种igbt模块导热硅脂涂覆装置及其使用方法
TWI786459B (zh) * 2020-11-03 2022-12-11 研能科技股份有限公司 晶圓結構
CN115295476B (zh) * 2022-10-08 2023-01-10 四川洪芯微科技有限公司 一种芯片脱膜装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5034786A (en) 1986-08-29 1991-07-23 Waferscale Integration, Inc. Opaque cover for preventing erasure of an EPROM
EP0408054A3 (en) 1989-07-14 1991-10-30 Kabushiki Kaisha Toshiba Ultraviolet erasable non-volatile semiconductor memory apparatus
JPH05291258A (ja) 1992-04-06 1993-11-05 Hitachi Ltd 配線修正方法
US5984470A (en) * 1995-04-20 1999-11-16 Canon Kabushiki Kaisha Apparatus for producing color filter with alignment error detection
DE69631428T2 (de) * 1995-10-13 2004-12-02 Nordson Corp., Westlake System und verfahren zur beschichtung der unterseite von flip chips
JP3386943B2 (ja) * 1995-10-30 2003-03-17 三菱電機株式会社 半導体装置
KR100302677B1 (ko) * 1996-06-26 2001-11-22 사토 게니치로 칩저항기및그제조방법
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
JP4003273B2 (ja) 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
JP4541560B2 (ja) 1999-02-08 2010-09-08 キヤノン株式会社 電子デバイス、電子源及び画像形成装置の製造方法
US6509217B1 (en) 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
US6703132B1 (en) 1999-12-22 2004-03-09 Mitsubishi Denki Kabushiki Kaisha Magnetoresistance sensor element and method of fabricating the magnetoresistance element
US20020086547A1 (en) * 2000-02-17 2002-07-04 Applied Materials, Inc. Etch pattern definition using a CVD organic layer as an anti-reflection coating and hardmask
CA2471842A1 (en) * 2001-07-27 2003-02-13 Eikos, Inc. Conformal coatings comprising carbon nanotubes
US6728591B1 (en) * 2001-08-01 2004-04-27 Advanced Micro Devices, Inc. Method and apparatus for run-to-run control of trench profiles
JP2003059940A (ja) 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
JP3838964B2 (ja) * 2002-03-13 2006-10-25 株式会社リコー 機能性素子基板の製造装置
JP2004012902A (ja) 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 描画装置及びこの描画装置を用いた描画方法
GB2391385A (en) 2002-07-26 2004-02-04 Seiko Epson Corp Patterning method by forming indent region to control spreading of liquid material deposited onto substrate
US6903442B2 (en) * 2002-08-29 2005-06-07 Micron Technology, Inc. Semiconductor component having backside pin contacts
KR100724475B1 (ko) * 2002-11-13 2007-06-04 엘지.필립스 엘시디 주식회사 액정 표시패널의 실 디스펜서 및 이를 이용한 실 패턴의단선 검출방법
JP2004253791A (ja) * 2003-01-29 2004-09-09 Nec Electronics Corp 絶縁膜およびそれを用いた半導体装置
JP2004276232A (ja) 2003-02-24 2004-10-07 Mitsubishi Electric Corp カーボンナノチューブ分散液およびその製造方法
JP4357189B2 (ja) 2003-03-07 2009-11-04 株式会社リコー 半導体装置の製造装置及び半導体装置の製造方法
JP4094984B2 (ja) * 2003-04-24 2008-06-04 三菱電機株式会社 半導体装置
US7030469B2 (en) 2003-09-25 2006-04-18 Freescale Semiconductor, Inc. Method of forming a semiconductor package and structure thereof
US7768405B2 (en) 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
JP4583904B2 (ja) 2003-12-17 2010-11-17 株式会社半導体エネルギー研究所 表示装置の作製方法
KR101270180B1 (ko) * 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 검사장치 및 검사방법과, 반도체장치 제작방법
JP4667756B2 (ja) * 2004-03-03 2011-04-13 三菱電機株式会社 半導体装置
JP3928638B2 (ja) * 2004-09-28 2007-06-13 セイコーエプソン株式会社 配線基板の製造方法、及び電子機器
JP2006148063A (ja) * 2004-10-22 2006-06-08 Renesas Technology Corp 配線構造、半導体装置、ｍｒａｍおよび半導体装置の製造方法
JP4863665B2 (ja) * 2005-07-15 2012-01-25 三菱電機株式会社 半導体装置およびその製造方法

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