JP2006196548A5 - - Google Patents
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- Publication number
- JP2006196548A5 JP2006196548A5 JP2005004383A JP2005004383A JP2006196548A5 JP 2006196548 A5 JP2006196548 A5 JP 2006196548A5 JP 2005004383 A JP2005004383 A JP 2005004383A JP 2005004383 A JP2005004383 A JP 2005004383A JP 2006196548 A5 JP2006196548 A5 JP 2006196548A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005004383A JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
TW094144455A TWI306726B (en) | 2005-01-11 | 2005-12-15 | Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board |
KR1020060002492A KR100750019B1 (ko) | 2005-01-11 | 2006-01-10 | 가요성 프린트 배선판 및 다층 가요성 프린트 배선판, 상기다층 가요성 프린트 배선판을 이용한 휴대 전화 단말 |
CN200610000573XA CN1805652B (zh) | 2005-01-11 | 2006-01-11 | 软性印刷电路板和多层软性印刷电路板及便携式电话终端 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005004383A JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008035730A Division JP4954111B2 (ja) | 2008-02-18 | 2008-02-18 | フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006196548A JP2006196548A (ja) | 2006-07-27 |
JP2006196548A5 true JP2006196548A5 (ja) | 2007-03-01 |
JP4162659B2 JP4162659B2 (ja) | 2008-10-08 |
Family
ID=36802402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005004383A Active JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4162659B2 (ja) |
KR (1) | KR100750019B1 (ja) |
CN (1) | CN1805652B (ja) |
TW (1) | TWI306726B (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090035529A (ko) | 2006-07-19 | 2009-04-09 | 비-코아 인코포레이티드 | 광학식 심볼 및 그것이 부착된 물품 및 광학식 심볼을 물품에 부착하는 방법, 및 광학식 인식 코드 인식 방법 |
JP2008041960A (ja) | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
JP4845705B2 (ja) * | 2006-12-19 | 2011-12-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
JPWO2008102795A1 (ja) | 2007-02-20 | 2010-05-27 | 日立化成工業株式会社 | フレキシブル多層配線板 |
JP2008282352A (ja) | 2007-05-14 | 2008-11-20 | B-Core Inc | 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法 |
US8383230B2 (en) | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
CN101801156B (zh) * | 2009-02-06 | 2013-02-27 | 周伯如 | 软性印刷电路板的制造方法及其结构 |
CN102186304A (zh) * | 2011-03-15 | 2011-09-14 | 珠海元盛电子科技股份有限公司 | 用于翻盖/滑盖手机的分层fpc及制作方法 |
CN102529271B (zh) * | 2011-12-23 | 2014-12-24 | 云南云天化股份有限公司 | 用于柔性电路板的聚酰亚胺薄膜及其制备方法 |
DE102013202037A1 (de) * | 2013-02-07 | 2014-08-07 | Olympus Winter & Ibe Gmbh | Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument |
KR20140148111A (ko) * | 2013-06-21 | 2014-12-31 | 삼성전기주식회사 | 경연성 인쇄회로기판 및 그 제조방법 |
WO2015116076A1 (en) | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, Lp | Printed circuit board fluid ejection apparatus |
TWI607677B (zh) * | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07312469A (ja) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | 多層フレキシブル回路基板の屈曲部構造 |
JP2002261450A (ja) | 2001-02-28 | 2002-09-13 | Shin Etsu Chem Co Ltd | 多層フレキシブル印刷配線板 |
KR100828520B1 (ko) * | 2001-11-23 | 2008-05-13 | 삼성전자주식회사 | 액정 표시 모듈 |
US7661190B2 (en) | 2003-03-04 | 2010-02-16 | Zeon Corporation | Process for producing multilayer printed wiring board |
KR100477378B1 (ko) * | 2003-03-21 | 2005-03-18 | 주식회사 에스아이 플렉스 | 다층 연성 인쇄회로기판의 제조방법 |
-
2005
- 2005-01-11 JP JP2005004383A patent/JP4162659B2/ja active Active
- 2005-12-15 TW TW094144455A patent/TWI306726B/zh active
-
2006
- 2006-01-10 KR KR1020060002492A patent/KR100750019B1/ko active IP Right Grant
- 2006-01-11 CN CN200610000573XA patent/CN1805652B/zh active Active
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