TWI365482B - Substrate processing apparatus, history information recording method, history information recording program, and history information recording system - Google Patents

Substrate processing apparatus, history information recording method, history information recording program, and history information recording system

Info

Publication number
TWI365482B
TWI365482B TW095110768A TW95110768A TWI365482B TW I365482 B TWI365482 B TW I365482B TW 095110768 A TW095110768 A TW 095110768A TW 95110768 A TW95110768 A TW 95110768A TW I365482 B TWI365482 B TW I365482B
Authority
TW
Taiwan
Prior art keywords
information recording
history information
processing apparatus
substrate processing
program
Prior art date
Application number
TW095110768A
Other languages
English (en)
Other versions
TW200703444A (en
Inventor
Youichi Nakayama
Daisuke Morisawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200703444A publication Critical patent/TW200703444A/zh
Application granted granted Critical
Publication of TWI365482B publication Critical patent/TWI365482B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW095110768A 2005-03-29 2006-03-28 Substrate processing apparatus, history information recording method, history information recording program, and history information recording system TWI365482B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005095123A JP2006277298A (ja) 2005-03-29 2005-03-29 基板処理装置、履歴情報記録方法、履歴情報記録プログラム及び履歴情報記録システム

Publications (2)

Publication Number Publication Date
TW200703444A TW200703444A (en) 2007-01-16
TWI365482B true TWI365482B (en) 2012-06-01

Family

ID=37030598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110768A TWI365482B (en) 2005-03-29 2006-03-28 Substrate processing apparatus, history information recording method, history information recording program, and history information recording system

Country Status (5)

Country Link
US (1) US7266418B2 (zh)
JP (1) JP2006277298A (zh)
KR (1) KR100845990B1 (zh)
CN (1) CN100463104C (zh)
TW (1) TWI365482B (zh)

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US7462011B2 (en) * 2004-08-12 2008-12-09 Tokyo Electron Limited Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program
KR101204411B1 (ko) * 2006-01-27 2012-11-27 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
TWI287182B (en) * 2006-02-16 2007-09-21 Powerchip Semiconductor Corp Method for managing tools using statistical process control and storage medium therefor
JP4901442B2 (ja) * 2006-12-04 2012-03-21 東京エレクトロン株式会社 トラブル原因究明支援装置，トラブル原因究明支援方法，プログラムを記憶する記憶媒体
JP5138322B2 (ja) 2007-09-14 2013-02-06 東京エレクトロン株式会社 処理システムの制御装置、処理システムの制御方法および制御プログラムを記憶した記憶媒体
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
JP5374039B2 (ja) * 2007-12-27 2013-12-25 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記憶媒体
JP5294681B2 (ja) * 2008-04-28 2013-09-18 東京エレクトロン株式会社 基板処理装置及びその基板搬送方法
JP5942213B2 (ja) * 2009-01-26 2016-06-29 パナソニックＩｐマネジメント株式会社 プラズマ処理装置
JP5353265B2 (ja) 2009-01-26 2013-11-27 パナソニック株式会社 プラズマ処理装置
JP5353266B2 (ja) * 2009-01-26 2013-11-27 パナソニック株式会社 プラズマ処理装置
CN102934539B (zh) 2010-04-29 2015-12-02 富士机械制造株式会社 集中控制装置及集中控制方法
JP5750235B2 (ja) * 2010-04-29 2015-07-15 富士機械製造株式会社 製造作業機
JP5773613B2 (ja) * 2010-10-25 2015-09-02 東京エレクトロン株式会社 異常原因分析方法及び異常分析プログラム
JP5566265B2 (ja) * 2010-11-09 2014-08-06 東京エレクトロン株式会社 基板処理装置、プログラム、コンピュータ記憶媒体及び基板の搬送方法
JP5855841B2 (ja) * 2011-04-01 2016-02-09 株式会社日立国際電気 管理装置
JP2013045817A (ja) * 2011-08-23 2013-03-04 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
JP6049394B2 (ja) * 2012-10-22 2016-12-21 東京エレクトロン株式会社 基板処理システム及び基板の搬送制御方法
JP5802691B2 (ja) * 2013-02-15 2015-10-28 東京エレクトロン株式会社 基板処理装置、シミュレーション装置、プログラムおよびシミュレーション方法
JP2014229225A (ja) * 2013-05-27 2014-12-08 株式会社日立国際電気 基板処理装置、ファイル更新方法、半導体装置の製造方法及びプログラム
JP6291878B2 (ja) * 2014-01-31 2018-03-14 シンフォニアテクノロジー株式会社 ロードポート及びｅｆｅｍ
JP7137977B2 (ja) * 2018-07-05 2022-09-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN111290355B (zh) * 2020-02-27 2021-06-22 中电九天智能科技有限公司 记录及查找log的方法
US11449026B2 (en) * 2020-05-27 2022-09-20 Applied Materials, Inc. Variable loop control feature
JP7157786B2 (ja) * 2020-09-23 2022-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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JPH11354398A (ja) * 1998-06-08 1999-12-24 Kokusai Electric Co Ltd ウェーハ処理方法
US6267545B1 (en) 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
JP3365551B2 (ja) * 1999-05-20 2003-01-14 日本電気株式会社 ロット供給システム及びロット供給方法
US6952656B1 (en) * 2000-04-28 2005-10-04 Applied Materials, Inc. Wafer fabrication data acquisition and management systems
JP2002110496A (ja) 2000-09-27 2002-04-12 Hitachi Kokusai Electric Inc 半導体製造装置
JP4213871B2 (ja) * 2001-02-01 2009-01-21 株式会社日立製作所 半導体装置の製造方法
US7031792B2 (en) * 2001-04-04 2006-04-18 Tokyo Electron Limited Processing apparatus and information storage apparatus and method
JP4071461B2 (ja) * 2001-07-05 2008-04-02 大日本スクリーン製造株式会社 基板処理システム、基板処理装置、プログラム及び記録媒体
TWI244603B (en) * 2001-07-05 2005-12-01 Dainippon Screen Mfg Substrate processing system for managing device information of substrate processing device
US6901306B2 (en) * 2002-02-27 2005-05-31 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus and its diagnosis apparatus and operating system
TWI328164B (en) * 2002-05-29 2010-08-01 Tokyo Electron Ltd Method and apparatus for monitoring tool performance
US20030093174A1 (en) * 2002-06-12 2003-05-15 Serge Nikulin Fabrication process control system emulator
JP2004327465A (ja) * 2003-04-21 2004-11-18 Renesas Technology Corp 半導体装置の生産管理システム
JP4008899B2 (ja) * 2003-09-08 2007-11-14 株式会社東芝 半導体装置の製造システムおよび半導体装置の製造方法

Also Published As

Publication number Publication date
TW200703444A (en) 2007-01-16
US7266418B2 (en) 2007-09-04
CN100463104C (zh) 2009-02-18
US20060224265A1 (en) 2006-10-05
KR100845990B1 (ko) 2008-07-11
KR20060105518A (ko) 2006-10-11
CN1841653A (zh) 2006-10-04
JP2006277298A (ja) 2006-10-12

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