TWI360133B - - Google Patents

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Publication number
TWI360133B
TWI360133B TW096120547A TW96120547A TWI360133B TW I360133 B TWI360133 B TW I360133B TW 096120547 A TW096120547 A TW 096120547A TW 96120547 A TW96120547 A TW 96120547A TW I360133 B TWI360133 B TW I360133B
Authority
TW
Taiwan
Prior art keywords
pair
platform
guiding portions
beams
supported
Prior art date
Application number
TW096120547A
Other languages
English (en)
Chinese (zh)
Other versions
TW200818217A (en
Inventor
Makoto Harada
Yuuji Kobayashi
Tatsuya Kohara
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200818217A publication Critical patent/TW200818217A/zh
Application granted granted Critical
Publication of TWI360133B publication Critical patent/TWI360133B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Machine Tool Units (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096120547A 2006-06-19 2007-06-07 Stage apparatus TW200818217A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006169422A JP4402078B2 (ja) 2006-06-19 2006-06-19 ステージ装置

Publications (2)

Publication Number Publication Date
TW200818217A TW200818217A (en) 2008-04-16
TWI360133B true TWI360133B (https=) 2012-03-11

Family

ID=38931053

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120547A TW200818217A (en) 2006-06-19 2007-06-07 Stage apparatus

Country Status (4)

Country Link
JP (1) JP4402078B2 (https=)
KR (1) KR100919391B1 (https=)
CN (1) CN100521143C (https=)
TW (1) TW200818217A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101339914B (zh) * 2008-08-27 2010-06-16 中国科学院长春光学精密机械与物理研究所 二维电动位移平台
JP4964853B2 (ja) * 2008-09-24 2012-07-04 住友重機械工業株式会社 ステージ装置
KR102482124B1 (ko) * 2016-01-25 2022-12-27 한화정밀기계 주식회사 칩 부품 마운터의 오차 최소화 방법
CN107580413A (zh) * 2016-07-05 2018-01-12 翔庆精密工业有限公司 平台水平自动校正装置
JP6771160B2 (ja) * 2018-08-21 2020-10-21 パナソニックＩｐマネジメント株式会社 搬送ステージとそれを使用したインクジェット装置
KR102704356B1 (ko) 2022-01-06 2024-09-09 에스케이실트론 주식회사 하정반 마모도 자동 보정 시스템 및 이를 구비한 웨이퍼 래핑 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746730B2 (ja) * 2002-04-24 2006-02-15 株式会社目白プレシジョン ステージ装置
JP4443891B2 (ja) * 2003-10-23 2010-03-31 住友重機械工業株式会社 ステージ装置
JP2005331402A (ja) * 2004-05-20 2005-12-02 Sumitomo Heavy Ind Ltd ステージ装置

Also Published As

Publication number Publication date
JP4402078B2 (ja) 2010-01-20
JP2007331087A (ja) 2007-12-27
CN100521143C (zh) 2009-07-29
KR100919391B1 (ko) 2009-09-29
CN101093813A (zh) 2007-12-26
KR20070120441A (ko) 2007-12-24
TW200818217A (en) 2008-04-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees