TWI354598B - - Google Patents
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- Publication number
- TWI354598B TWI354598B TW097112893A TW97112893A TWI354598B TW I354598 B TWI354598 B TW I354598B TW 097112893 A TW097112893 A TW 097112893A TW 97112893 A TW97112893 A TW 97112893A TW I354598 B TWI354598 B TW I354598B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- polishing
- film
- peripheral portion
- processing method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007104068A JP4374038B2 (ja) | 2007-04-11 | 2007-04-11 | 基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200906541A TW200906541A (en) | 2009-02-16 |
TWI354598B true TWI354598B (ko) | 2011-12-21 |
Family
ID=39854147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097112893A TW200906541A (en) | 2007-04-11 | 2008-04-09 | Substrate processing method |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080254719A1 (ko) |
JP (1) | JP4374038B2 (ko) |
TW (1) | TW200906541A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5254575B2 (ja) * | 2007-07-11 | 2013-08-07 | 株式会社東芝 | 研磨装置および研磨方法 |
JP2010162624A (ja) * | 2009-01-13 | 2010-07-29 | Ebara Corp | 研磨装置および研磨方法 |
JP5571409B2 (ja) | 2010-02-22 | 2014-08-13 | 株式会社荏原製作所 | 半導体装置の製造方法 |
JP2011177842A (ja) | 2010-03-02 | 2011-09-15 | Ebara Corp | 研磨装置及び研磨方法 |
DE102010042040A1 (de) | 2010-10-06 | 2012-04-12 | Siltronic Ag | Verfahren zum Schleifen einer Halbleiterscheibe |
JP6244962B2 (ja) | 2014-02-17 | 2017-12-13 | 株式会社Sumco | 半導体ウェーハの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
US6602439B1 (en) * | 1997-02-24 | 2003-08-05 | Superior Micropowders, Llc | Chemical-mechanical planarization slurries and powders and methods for using same |
JP4113282B2 (ja) * | 1998-05-07 | 2008-07-09 | スピードファム株式会社 | 研磨組成物及びそれを用いたエッジポリッシング方法 |
DE19842709A1 (de) * | 1998-09-17 | 2000-03-30 | Siemens Ag | Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente |
JP3141939B2 (ja) * | 1998-11-26 | 2001-03-07 | 日本電気株式会社 | 金属配線形成方法 |
US6267649B1 (en) * | 1999-08-23 | 2001-07-31 | Industrial Technology Research Institute | Edge and bevel CMP of copper wafer |
JP4090247B2 (ja) * | 2002-02-12 | 2008-05-28 | 株式会社荏原製作所 | 基板処理装置 |
JP2007012943A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 基板処理方法 |
-
2007
- 2007-04-11 JP JP2007104068A patent/JP4374038B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-09 TW TW097112893A patent/TW200906541A/zh not_active IP Right Cessation
- 2008-04-10 US US12/100,450 patent/US20080254719A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW200906541A (en) | 2009-02-16 |
JP4374038B2 (ja) | 2009-12-02 |
US20080254719A1 (en) | 2008-10-16 |
JP2008263027A (ja) | 2008-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |