TWI354598B - - Google Patents

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Publication number
TWI354598B
TWI354598B TW097112893A TW97112893A TWI354598B TW I354598 B TWI354598 B TW I354598B TW 097112893 A TW097112893 A TW 097112893A TW 97112893 A TW97112893 A TW 97112893A TW I354598 B TWI354598 B TW I354598B
Authority
TW
Taiwan
Prior art keywords
substrate
polishing
film
peripheral portion
processing method
Prior art date
Application number
TW097112893A
Other languages
English (en)
Chinese (zh)
Other versions
TW200906541A (en
Inventor
Atsushi Shigeta
Dai Fukushima
Hiroyuki Yano
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200906541A publication Critical patent/TW200906541A/zh
Application granted granted Critical
Publication of TWI354598B publication Critical patent/TWI354598B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097112893A 2007-04-11 2008-04-09 Substrate processing method TW200906541A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007104068A JP4374038B2 (ja) 2007-04-11 2007-04-11 基板処理方法

Publications (2)

Publication Number Publication Date
TW200906541A TW200906541A (en) 2009-02-16
TWI354598B true TWI354598B (ja) 2011-12-21

Family

ID=39854147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112893A TW200906541A (en) 2007-04-11 2008-04-09 Substrate processing method

Country Status (3)

Country Link
US (1) US20080254719A1 (ja)
JP (1) JP4374038B2 (ja)
TW (1) TW200906541A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
JP2010162624A (ja) * 2009-01-13 2010-07-29 Ebara Corp 研磨装置および研磨方法
JP5571409B2 (ja) 2010-02-22 2014-08-13 株式会社荏原製作所 半導体装置の製造方法
JP2011177842A (ja) 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
JP6244962B2 (ja) * 2014-02-17 2017-12-13 株式会社Sumco 半導体ウェーハの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US6602439B1 (en) * 1997-02-24 2003-08-05 Superior Micropowders, Llc Chemical-mechanical planarization slurries and powders and methods for using same
JP4113282B2 (ja) * 1998-05-07 2008-07-09 スピードファム株式会社 研磨組成物及びそれを用いたエッジポリッシング方法
DE19842709A1 (de) * 1998-09-17 2000-03-30 Siemens Ag Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente
JP3141939B2 (ja) * 1998-11-26 2001-03-07 日本電気株式会社 金属配線形成方法
US6267649B1 (en) * 1999-08-23 2001-07-31 Industrial Technology Research Institute Edge and bevel CMP of copper wafer
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP2007012943A (ja) * 2005-06-30 2007-01-18 Toshiba Corp 基板処理方法

Also Published As

Publication number Publication date
US20080254719A1 (en) 2008-10-16
JP4374038B2 (ja) 2009-12-02
JP2008263027A (ja) 2008-10-30
TW200906541A (en) 2009-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees