TWI354362B - Semiconductor device with strain relieving bump de - Google Patents

Semiconductor device with strain relieving bump de Download PDF

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Publication number
TWI354362B
TWI354362B TW093122939A TW93122939A TWI354362B TW I354362 B TWI354362 B TW I354362B TW 093122939 A TW093122939 A TW 093122939A TW 93122939 A TW93122939 A TW 93122939A TW I354362 B TWI354362 B TW I354362B
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TW
Taiwan
Prior art keywords
layer
laterally extending
extending portion
passivation layer
conductor
Prior art date
Application number
TW093122939A
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English (en)
Chinese (zh)
Other versions
TW200518308A (en
Inventor
James Jen-Ho Wang
Jin-Wook Jang
Alfredo Mendoza
Rajashi Runton
Russell Shumway
Original Assignee
Freescale Semiconductor Inc
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Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200518308A publication Critical patent/TW200518308A/zh
Application granted granted Critical
Publication of TWI354362B publication Critical patent/TWI354362B/zh

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
TW093122939A 2003-07-31 2004-07-30 Semiconductor device with strain relieving bump de TWI354362B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/631,102 US6790759B1 (en) 2003-07-31 2003-07-31 Semiconductor device with strain relieving bump design

Publications (2)

Publication Number Publication Date
TW200518308A TW200518308A (en) 2005-06-01
TWI354362B true TWI354362B (en) 2011-12-11

Family

ID=32927915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122939A TWI354362B (en) 2003-07-31 2004-07-30 Semiconductor device with strain relieving bump de

Country Status (6)

Country Link
US (2) US6790759B1 (enExample)
JP (1) JP2007502530A (enExample)
KR (1) KR101106832B1 (enExample)
CN (1) CN1926674A (enExample)
TW (1) TWI354362B (enExample)
WO (1) WO2005013319A2 (enExample)

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JP2006303452A (ja) * 2005-03-25 2006-11-02 Sanyo Electric Co Ltd 半導体装置及びその製造方法
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US20070246805A1 (en) * 2006-04-25 2007-10-25 Ligang Zhang Multi-die inductor
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JP4354469B2 (ja) * 2006-08-11 2009-10-28 シャープ株式会社 半導体装置および半導体装置の製造方法
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US6790759B1 (en) 2004-09-14
WO2005013319A2 (en) 2005-02-10
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US7208841B2 (en) 2007-04-24
US20050023680A1 (en) 2005-02-03

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