TWI354325B - - Google Patents
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- Publication number
- TWI354325B TWI354325B TW094106136A TW94106136A TWI354325B TW I354325 B TWI354325 B TW I354325B TW 094106136 A TW094106136 A TW 094106136A TW 94106136 A TW94106136 A TW 94106136A TW I354325 B TWI354325 B TW I354325B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- frame
- adhesive sheet
- workpiece
- sheet
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 claims description 60
- 230000001070 adhesive effect Effects 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 40
- 239000010409 thin film Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 107
- 238000005520 cutting process Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004055720A JP4768963B2 (ja) | 2004-03-01 | 2004-03-01 | ウェハの転写方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200532786A TW200532786A (en) | 2005-10-01 |
TWI354325B true TWI354325B (de) | 2011-12-11 |
Family
ID=34908879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094106136A TW200532786A (en) | 2004-03-01 | 2005-03-01 | Wafer transcription method |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4768963B2 (de) |
KR (1) | KR20060123462A (de) |
DE (1) | DE112005000448T5 (de) |
MY (1) | MY162177A (de) |
TW (1) | TW200532786A (de) |
WO (1) | WO2005083763A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006229021A (ja) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP5275553B2 (ja) * | 2006-06-27 | 2013-08-28 | スリーエム イノベイティブ プロパティズ カンパニー | 分割チップの製造方法 |
JP2011091293A (ja) * | 2009-10-26 | 2011-05-06 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP5533695B2 (ja) * | 2011-01-26 | 2014-06-25 | 豊田合成株式会社 | 半導体チップの製造方法および半導体チップの実装方法 |
JP6044986B2 (ja) * | 2012-11-13 | 2016-12-14 | 株式会社ディスコ | 切削装置 |
JP5855034B2 (ja) * | 2013-02-18 | 2016-02-09 | 古河電気工業株式会社 | 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法 |
JP5657828B1 (ja) * | 2014-07-17 | 2015-01-21 | 大宮工業株式会社 | 転写方法及び転写装置 |
KR102609560B1 (ko) * | 2017-09-08 | 2023-12-04 | 삼성전자주식회사 | 반도체 제조 장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2893741B2 (ja) * | 1989-08-02 | 1999-05-24 | 日本電気株式会社 | 電歪効果素子 |
JPH063321B2 (ja) * | 1989-10-13 | 1994-01-12 | 貞一 阿部 | 温水ボイラー |
JP2877997B2 (ja) * | 1991-08-29 | 1999-04-05 | 日東電工株式会社 | 半導体ウエハの処理方法 |
JP2001110757A (ja) * | 1999-10-06 | 2001-04-20 | Toshiba Corp | 半導体装置の製造方法 |
JP2001257222A (ja) * | 2000-03-09 | 2001-09-21 | Hitachi Ltd | 半導体実装装置およびその製造方法 |
JP3408805B2 (ja) * | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP2003086540A (ja) * | 2001-09-07 | 2003-03-20 | Toshiba Corp | 半導体装置の製造方法及びその製造装置 |
JP3624909B2 (ja) * | 2002-03-12 | 2005-03-02 | 浜松ホトニクス株式会社 | レーザ加工方法 |
-
2004
- 2004-03-01 JP JP2004055720A patent/JP4768963B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-25 DE DE112005000448T patent/DE112005000448T5/de not_active Withdrawn
- 2005-02-25 WO PCT/JP2005/003146 patent/WO2005083763A1/ja active Application Filing
- 2005-02-25 KR KR1020067013783A patent/KR20060123462A/ko not_active Application Discontinuation
- 2005-03-01 TW TW094106136A patent/TW200532786A/zh not_active IP Right Cessation
- 2005-03-01 MY MYPI20050837A patent/MY162177A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2005083763A1 (ja) | 2005-09-09 |
MY162177A (en) | 2017-05-31 |
JP4768963B2 (ja) | 2011-09-07 |
DE112005000448T5 (de) | 2007-03-29 |
KR20060123462A (ko) | 2006-12-01 |
TW200532786A (en) | 2005-10-01 |
JP2007220693A (ja) | 2007-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |