TWI352724B - Lead-free electrodeposition coating composition an - Google Patents
Lead-free electrodeposition coating composition an Download PDFInfo
- Publication number
- TWI352724B TWI352724B TW93105883A TW93105883A TWI352724B TW I352724 B TWI352724 B TW I352724B TW 93105883 A TW93105883 A TW 93105883A TW 93105883 A TW93105883 A TW 93105883A TW I352724 B TWI352724 B TW I352724B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- resin
- electrodeposition coating
- compound
- film
- Prior art date
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- 238000004070 electrodeposition Methods 0.000 title claims description 66
- 239000008199 coating composition Substances 0.000 title claims description 28
- 238000000576 coating method Methods 0.000 claims description 61
- 239000011248 coating agent Substances 0.000 claims description 60
- 229920005989 resin Polymers 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 47
- 150000001875 compounds Chemical class 0.000 claims description 45
- 125000002091 cationic group Chemical group 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 29
- 239000011159 matrix material Substances 0.000 claims description 24
- 150000003606 tin compounds Chemical class 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000011230 binding agent Substances 0.000 claims description 9
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 150000001768 cations Chemical class 0.000 claims description 5
- BVFSYZFXJYAPQJ-UHFFFAOYSA-N butyl(oxo)tin Chemical compound CCCC[Sn]=O BVFSYZFXJYAPQJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 3
- -1 aromatic carboxylate Chemical class 0.000 description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 18
- 239000007787 solid Substances 0.000 description 18
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- 238000004519 manufacturing process Methods 0.000 description 9
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- 230000000052 comparative effect Effects 0.000 description 6
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- 229910052707 ruthenium Inorganic materials 0.000 description 4
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- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- LLUFMOBSNCVXLA-UHFFFAOYSA-N C(CCCCCCC)[Sn](CCCCCCCC)(CCCCCCCC)CCCCCCCC.[Sn] Chemical compound C(CCCCCCC)[Sn](CCCCCCCC)(CCCCCCCC)CCCCCCCC.[Sn] LLUFMOBSNCVXLA-UHFFFAOYSA-N 0.000 description 2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/22—Catalysts containing metal compounds
- C08G18/24—Catalysts containing metal compounds of tin
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1352724 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種實質上具有無鉛化合物之陽離子電沉 積塗層組合物’其具有優異固化性並可用發亮外觀表面塗 佈,以及用組合物塗佈之物品。 【先前技術】 陽離子電沉積塗層組合物已使用於汽車之底塗車體及零 件’並要求形成具有高度财姓性之塗膜。塗膜需要在預定 丈共培溫度下充分固化以達成高度时姓性。二丁基錫化a物 通常用作固化劑供無鉛陽離子電沉積塗層、組合物用。例 如’氧化二丁基錫,其可用作觸媒供陽離子電沉積塗層組 合物之交聯反應用,揭示於jP_A_5_65438。此外,含有有機 錫化合物之陽離子電沉積塗層組合物亦揭示於 JP-A-7-258586,而含有二烷基錫芳香族羧酸鹽作為固化觸 媒之陽離子電沉積塗層組合物揭示於jp_A_2〇〇i_55538。 然而,一般而言,二丁基錫化合物之揮發性不佳。例如, 電沉積塗膜之表面溫度在烘焙薄膜、用修整底漆之上膜、 中間塗層等塗佈薄膜或烘焙上膜之過程中上升至15〇至丄 t。二丁基錫化合物在該高溫下自電沉積塗膜之表面揮 發,轉移入修整底漆之鄰接上膜或中間塗層内,進而在特 定情況下不利地影響薄膜性能或成品塗膜之外觀。 【發明内容】 本發明之目的為提供一種具有優異固化性之無鉛電沉積 之塗層組合物及經塗層物品,組合物可形成塗層薄膜,其 9l727.doc 24 放出低錫化合物以致不會料成品塗膜之外觀及薄膜性 匕本:明之無錯陽離子電沉積之塗層組合物包㈣合劑樹 月曰及-種或多種有機錫化合物作為固化觸媒,叾中黏合叫 樹脂包含陽離子基質樹脂及交聯劑,有機錫化合物對黏: 劑樹脂之固體含量之f量比為〇1至1()質量%,有機錫化合 物I 3根據有機錫化合物之全部值量超過5 〇質量%單烷美 錫化合物。 本發明之無鉛陽離子電沉積之塗層組合物最好包含1〇〇 ^2,= 〇 ppm鋅離子。陽離子基質樹脂較佳為胺基-環氧樹 脂。單烷基錫化合物可為氧化單丁基錫。 本發明之經塗層物品包含基材及形成於上之電沉積塗 膜,其包含無鉛陽離子電沉積之塗層組合物。經塗層物品 在許多情況下具有至少-種修整底漆之薄膜在電沉積塗: 上。在本發明中,可達成優異薄膜性能,即使在修整底漆 使黏著性或外觀容易受錫原子自電沉積塗膜之轉移不利影 響之情況下亦然。 以下詳述本發明。在本發明之無鉛陽離子電沉積之塗層 組合物中,術語”無鉛"意指組合物實質上不含鉛(包括鉛/匕 合物内之鉛)。鉛之偵測限度因分析儀器之發展而逐年降 低,在本發明中,術語"無鉛"特指組合物之鉛含量為1〇ppm 或以下。 本發明之無鉛陽離子電沉積之塗層組合物包含—種或多 種有機錫化合物作為固化觸媒(或嵌段聚異氰酸酯化合物 9l727.doc 1352724 之解離)。有機錫化合物包含單烷基錫化合物。單烷基錫化 合物最佳為氧化單丁基銷’但對其並無特定限制。單淀基 錫化合物之例包括三辛醯酸單丁基錫、三醋酸單丁基錫、 三苯’酸單丁基錫、三辛酸單丁基錫'三月桂酸單丁基錫、 三肉豆蔻酸單丁基錫、三f酸單甲基錫、三醋酸單甲基錫、 三辛酸單子基錫、三醋酸單辛基錫、三辛酸單辛基錫、三 月桂酸單辛基錫'三醋酸單月桂基錫、三辛酸單月桂基錫 及三月桂酸單月桂基錫4Μ基錫化合物可單獨或以二 種或多種化合物之組合使用。 單院基錫化合物可與其他有機錫化合物使用。其他有機 錫化合物之例包括二烷基錫化合物,如氧化二丁基錫、氧 辛基錫、一月桂酸二丁基錫及二醋酸二丁基錫。在本 發明中,單絲錫化合物對全部有機錫化合物之質量比需 要超過50質量%。當質量比為5〇質量%或以下時,過量豆他 有機錫化合物轉移成薄膜’鄰接至電沉積塗膜而惡化薄膜 性能及成品塗膜之外觀。單烧基錫化合物對全部有機錫化 合物之質量比較佳為60至⑽質量%,更佳為75至1〇〇質量 當有機鎮化合物對包含陽離子基質樹腊及交聯劑之黏入 劑樹脂之固體含量之f量比低於01質量%時,催化活性不 足。另-方面’當有機錫化合物之質量比增加超過霄量 :夺,催化活性無法對應改良,而且有電沉積塗膜由爐供 =解之情況。單院基錫化合物對包含陽離子基質樹脂及 彻之點合劑樹脂之固體含量之質量比較佳為0.5至70 91727.doc 質量%。 種將有機錫化合物導入無鉛陽離子電沉積塗層組合物 内之方法不受特殊限制。在有機錫化合物為固體之情況 下,有機錫化合物較佳使用分散樹脂以及顏料分散。此外, 在有機錫化合物為液體之情況下,其可溶解於黏合劑樹脂 内或與黏合劑樹脂混合並導入作為部分黏合劑成分。 本發明之無鉛陽離子電沉積塗層組合物可含有鋅離子。 無機辞化合物如氧化鋅或無機鋅化合物可用以保持預定程 度之組成物之辞含量。鋅化合物可單獨或與二種或多種化 合物之組合使用。 有機鋅化合物之例包括有機單或二酸如甲酸、醋酸、丁 酸、己酸、辛酸、月桂酸、肉豆蔻酸、棕橺酸、硬脂酸' 山蓊酸、新癸酸、丙烯酸、巴豆酸、異巴豆酸、十一碳烯 酸、油酸、芥酸、山梨酸、亞油酸、亞油烯酸、聯苯基醋 酸、聯苯基丁酸、聯苯基丙酸、雙環戊烷羧酸、雙乙醯醋 酸、苯甲酸、甲基苯甲酸、雙〒氧基苯甲酸、雙(第三丁基) 苯甲酸、雙羥基苯甲酸、酞酸酐、對酞酸、琥珀酸、順丁 烯一酸、順丁烯二酸酐、及反丁烯二酸酐之辞鹽。 無鉛陽離子電沉積塗層組合物之鋅離子含量較佳為i00 至2,000 ppm,更佳為300至l,〇〇〇ppm。當辞離子含量低於 100 ppm時,後述解離觸媒無法顯示充分活性’導致電沉積 塗膜之固化不足。另一方面,當辞離子含量高於2,〇〇〇 ppm 時’薄膜之外觀及電沉積塗層作業性在特定情況下會劣化。 本發明所用之陽離子基質樹脂最好可使電沉積塗膜具有 9l727.doc 車乂 π耐蝕性。該陽離子基質樹脂之例包括胺基-環氧樹脂、 3胺基之丙烯酸樹脂、含胺基之聚酯樹脂等。其中,以胺 基-¾氧樹脂較佳。可得胺基_環氧樹脂,環氧樹脂之環氧環 仏藉胺化合物如第_、第二或第三胺之酸性鹽開啟並陽離 子化。 用作原料供陽離子基質樹脂用之胺基-環氧樹脂可為多 酚-聚縮水甘油醚型環氧樹脂,其為表氯醇與多環狀酚化合 物如雙酚A'雙酚F、雙酚s '苯酚酚醛清漆、及甲酚酚醛 /月漆或具有嘮唑烷酮環之改質環氧樹脂間之反應產物。環 氧树月曰較佳為具有〇号唾院酮環之改質環氧樹脂。改質環氧 樹脂可藉環氧樹脂與由二異氰酸酯化合物與一種活性氫化 5物間之反應製備之雙尿烧化合物或與由二異氰酸g旨化合 物與—種或多種活性氫化合物間之反應製備之雜尿炫化合 物之脫醇化反應獲得。在使用具有„号唑烧酮環之改質環氧 树月曰作為基質樹脂之情況下,電沉積塗膜在耐姓性與物性 方面均優異。 陽離子基質樹脂之胺值較佳為30至130,更佳為40至80, 數目平均分子量較佳為1,〇〇〇至20,000。當胺值低於3〇時, 很難乳化陽離子基質樹脂。當胺值高於13〇時,恐怕會增加 樹脂之導電性’進而降低氣體銷特性,減少庫倉(c〇ul〇mb) 效率’或在電沉積塗層作業性包括再溶解度等方面不利。 中和陽離子基質樹脂之酸之例包括水溶性有機酸如甲 酸、醋酸、丙酸、乳酸、檸檬酸、蘋果酸、酒石酸、丙稀 酸;及無機酸如鹽酸、磷酸、及胺磺醯酸。其中,以醋酸、 91727.doc 10 1352724 乳酸、丙酸、F酸及胺磺醯酸較佳。 嵌段聚異氰酸酯化合物及醚化蜜胺樹脂較佳可用作包含 於本發明無鉛陽離子電沉積室廣組合物内之交聯劑。喪段 聚異氰酸酯化合物可使聚異氰酸醋化合物之異氰酸g旨基由 嵌段劑完全或局部嵌段。嵌段聚異氰酸酯化合物内之嵌段 劑係在電沉積後於烘焙法内藉加熱解離,再生異氛酸g旨基 係與陽離子基質樹脂之活性氫基反應,藉此硬化樹脂。醚 化蜜胺樹脂係用醇如曱醇及丁醇醚化蜜胺獲得。醚化蜜胺 樹脂用陽離子基質樹脂轉移醚化以促進在電沉積塗層作為 欣^又聚異亂酸自旨化合物後於洪培過程内之交聯反濟、。 用作嵌段聚異氰酸酯化合物材料之聚異氰酸酷化合物之 例包括脂肪族二異氰酸酯化合物如三亞曱基二異氛酸醋、 四亞甲基二異氰酸酯、五亞曱基二異氰酸酯、六亞曱基二 異氰酸酯、1,2-伸丙基二異氰酸酯、丨,2_伸丁基二異氛酸 δ旨、伸丁基二異氰酸g旨、1,3_伸丁基二異氛酸醋、亞乙 基一異氰酸酯、及亞丁基二異氰酸酯;脂肪族環狀二異氰 酸酯化合物如環戊烷二異氰酸酯、丨,4_環己烷二異氰酸 酯、1,2-環己烷二異氰酸酯、異弗爾酮二異氰酸酯、及原冰 片烷二異氰酸S旨;脂肪族-芳香族異氰酸酯化合物如間伸苯 二異氰酸s旨、對伸苯二異氰m 4,4,·聯基伸笨二異氛酸 醋、1’5-萘二異氰酸醋、二異氰酸醋、4,4,-二苯基甲 烷二異氰酸酯、2,4-或2,6-甲笨-里备純# τ本一異虱酸酯或其混合物、 4,4’-曱苯胺二異氰酸酯、及丄4_ _ ,一T本一異貳酸酯;芳香族 一異氰酸酿化合物如二茴香胺二里宠缺 牧一異1酸酯、4,4,-二苯基醚 91727.doc 1352724 一異氰酸酷、及氣二笨基二異氰酸酯;三異氰酸酯化合物 如二苯基曱烷-4,4’,4”-三異氰酸酯、ι,3,5-三異氰酸酯苯及 2,4,6 -二異氣酸S旨曱本,四異乱酸g旨化合物如4,4,_二笨基_ 一甲基甲烧-2,2 -5,5 -四異氰酸自旨;及聚合聚異氰酸g旨化合 物如曱苯二異氰酸醋二聚合物及甲苯二異氰酸醋三聚合 物。其中,較佳聚異氰酸酯化合物為異弗爾酮二異氰酸醋、 原冰片烷二異氰酸酯及4,4’-二苯基甲烷二異氰酸酯。 嵌段異氰酸酯基之嵌段劑之例包括鹵化烴類如丨-氯-^丙 醇及伸乙氯醇;脂肪族或雜環狀醇如正丙醇、呋喃醇、及 經烷基取代之呋喃醇;酚化合物如苯酚、間甲酚、對硝基 苯酚、對氯苯酚、及壬基苯酚;辟化合物如f基乙基酮拆、 甲基異丁基酮肟、丙酮辟及環己酮肟;活性亞甲基化合物 如乙醯丙_、乙醯酷酸乙醋、及丙二酸二乙醋;脂肪族醇 如卜己内酿胺、甲醇、乙醇、及異丙醇;芳香族醇如节醇; 二醇鍵如乙二醇單甲謎H單乙n乙二醇單甲鍵 等°其中’以甲基乙基㈣及ε-己内醯胺較佳。 在本發明之無錯陽離子電沉積塗層組合物中,陽離子基 質樹脂/交聯劑之固體含量比較佳為50/50至90/10質量,更 佳為嶋至咖質量。當比率不在觸至9Gm範圍内 時’固化效率通常不足。 有機溶劑可與水用於無錯陽離子電沉積塗層組合物内。 繼劑之:包括水混溶性有機溶劑如甲氧丙醇、乙基溶 纖劏、丙基溶纖劑、丁基溶 分纖•涮、2-乙基己基溶纖劑、正 己基溶纖劑 '甲醇、乙醇' 異丙醇'正丁醇、異丁醇、乙 91727.doc -12- 1352724 二醇二曱醚、二丙酮醇、丙酮、曱基乙基酮、曱氧丁醇、 二气烧及乙:醇單乙㈣㈣;及水不混溶性有機溶劑如 二甲苯、曱苯、曱基異丁酮、己烷、四氣化碳、2·乙基己 醇、異弗爾酮'環己烧及苯。其中,較佳有機溶劑為丁基 溶纖劑、2-乙基己基溶纖劑、及正己基溶纖劑,其在薄^ 形成性方面優異。有機溶劑之量較佳為每⑽至質量份陽離 子基質樹脂之固體含量及交聯劑為〇丨至i 〇質量份。 在本發明中,雖然含有超過50質量%單烷基錫化合物之 有機錫化合物用作解離鼓段劑之解離觸媒,惟其他解離觸 媒亦可使用,只要其不會降低本發明之有利影響即可。其 解離觸媒之例包括胺化合物如^甲基嗎I及金屬如/、、 銘及銅之鹽。其他解離觸媒之量可為每⑽f量份主觸媒之 有機錫化合物200質量份或以下。 此外’必要時,交聯樹絲子、顏料及各種添加劑可加 入本發明之無鉛陽離子電沉積塗層組合物内。保持經塗層 4:品端部厚度之效率可藉加入交聯樹脂粒子改良。交聯: 月曰粒子可自丙烯酸樹脂、環氧樹脂、酚樹脂、蜜胺樹脂等 產生自生產谷易性觀點*言,交聯樹脂粒子最好使用丙 烤酸樹脂。交聯樹脂粒子之數目平均粒子大小較佳為〇〇2 至30微米。 顏料之例包括衫色顏料如氧化欽、氧化鐵紅、及碳黑; 油漆調和顏料如矽酸鋁、沉澱硫酸鋇、及氧化 料如紹鹽、高鐵鹽、欽鹽、錯鹽、猛鹽、料、錄鹽= 鹽、鋅鹽、或翻酸之石夕鹽。在無鉛陽離子沉積塗層組合 91727.doc 1352724 物含有該顏科之情況下 樹脂。 組合物可進一 步含有分散顏料之 藉分散成分於 和劑之有機溶 本發明之無鉛陽離子沉積塗層組合物較佳 含有上述水溶性有㈣或上述無機酸作為中 劑與水之水性介質内製備。 本發明之㈣層物品係藉用本發明之 厗έ日八私♦ /士,* %防離子 >儿積塗 物塗佈導電基材獲得。組合物可電沉積在導電基材 以形成電沉積塗膜,必要時’其可用超塗膜塗佈。 導電基材可包含任何可電沉積塗佈之材料,如鐵料、鋼 料及銘料。本發明之無㈣離子沉積塗層組合物最好用去 離子水稀釋以具有固體濃度為5至4〇質量%,較佳為Μ。 質篁=,、组合物之ρΗ值調整至5 5至8 5,然後組合物導入電 /儿積浴内’以形成電沉積塗膜。電沉積塗膜最好在電沉積 岭狐度為20至35°C、塗層電壓為1〇〇至45〇 ν及塗佈時間為工 至5刀知之條件下實施。在電沉積後供培電沉積塗膜之過程 中,基材溫度為1GG至25(rc,較佳為14()至22(^,固化時 間為5至60分鐘,較佳為1〇至3〇分鐘。此等烘焙時間亦可應 用於電沉積塗膜在固化電沉積塗膜以前用修整底漆薄膜或 中間塗膜濕/濕塗佈並烘焙薄膜之情況下。電沉積塗膜之乾 燥厚度適當為5至40微米,更佳為1〇至3〇微米。可控制上述 電沉積塗佈條件以得乾燥厚度。 修整底漆薄膜及中間塗膜可以此順序或以相反順序形成 在如此形成之電沉積塗膜上,然後,必要時,超塗薄膜如 含有上光劑薄膜及透明薄膜可形成於其上。中間塗膜及超 91727.doc 1352724 塗薄臈可使用已知組合物在塗佈汽車外板等之已知條件下 形成。 修整底漆薄膜形成在金層物品如車體、護襴、及交通標 誌上以防止金屬物品之塗膜被路面等濺出之石塊弄破或剝 離。修整底漆可自薄膜之強度及耐衝擊性之觀點選擇,例 如,可具有包含酸接枝聚烯烴及丁基化蜜胺樹脂之组合之 組合物。該聚烯烴之例包括含有50莫耳%或以上丙烯之乙 烯-丙烯共聚物,酸接枝聚烯烴之酸成分可為順丁烯二酸、 順丁烯二酸肝等。該順丁稀二酸聚稀烴樹脂敘述於 JP-A-9-208882、JP-A-4-363371 等,Kansai Paint公司製造之 T-5H’ Sakai Chemical Industrial公司製造之B〇R_9〇4為市售 順丁烯二酸聚烯烴樹脂。在本發明之經塗層物品中,大量 單烷基錫化合物用作觸媒供固化上述電沉積塗膜,因而二 烷基錫化合物之量相對小。因此,僅小量二烷基錫化合物 在烘焙各薄膜等之過程中揮發’藉此可得薄膜性能及外觀 優異之經塗層物品’即使在修整底漆使黏著性或外觀容易 受原子自電沉積塗膜之轉移而不利影響亦然。 【實施方式】 以下參照不希望用纟限制本發明範圍之實例及t匕較例詳 述本發明。須知實例中"份”意指"質量份"。 [製造例1固化劑之製備] 723份異㈣酮二異氰酸g|、333份甲基異丁基酮及〇〇1 份二月桂酸二丁基錫加入設有攪拌器、冷凝器、氮氣入口 管、溫度計及滴液漏斗之燒瓶内並加熱至7(TC。在均勻溶 9I727.doc •15- 1352724 解内含物後,滴入6 1 0份曱基乙基酮肟歷2小時,在保持反 應溫度在70°C下實施反應。在反應期間測定反應混合物之 紅外線光譜’持續反應,直到異氰酸酯基之吸收消失為止, 以得固化劑。 [製造例2環氧化物改質之陽離子基質樹脂之製備] 92份2,4-/2,6-二異氰酸甲苯酯(值量比8/2)、95份曱基異丁 基酮(MIBK)及0.5份二月桂酸二丁基錫加入設有攪拌器、冷 凝器、氮氣入口管、溫度計及滴液漏斗之燒瓶内,2 1份甲 醇滴入其中同時攪拌之。反應在室溫下開始,反應混合物 之溫度係藉熱產生作用上升至60。(:》在反應30分鐘後,57 份乙二醇單-2-乙基己醚自滴液漏斗滴入反應混合物内,另 外再加入42份雙紛A-氧化乙烯5莫耳加成物。反應主要在溫 度範圍為60至65 C内實施,並測定紅外線光譜,直到異氰 酸酯基之吸收消失為止。 365份具有環氧當量為188之環氧樹脂,其係自雙酚A及表 氣醇合成,加入如此所得之嵌段聚異氰酸酯内,反應溫度 上升至1 25 C。然後,1 ·〇份苄基二甲胺加入混合物内,並 在130C下反應,直到環氧化物當量變成41〇為止。87份雙 酚A加入燒瓶内並在12〇艽下反應,結果,環氧化物當量變 成1,190。在冷卻所得混合物後,丨丨份二乙醇胺、24份N_曱 基乙醇胺及25份胺基乙醇胺酮亞胺化合物之乃質量 %MIBK溶液加入混合物内並在11〇艺下反應2小時。然後, 混合物係用MIBK稀釋,使非揮發性成分之比為8〇%,以得 具有陽離子基之環氧化物改質基質樹脂。 9l727.doc 16 1352724 [製造例3主溶劑之製備] 將672份(固體含量)製造例2所得之基質樹脂及2〇9 1份 (固體含量)製造例1所得之固化劑均勻混合,根據固體含量 之質量3質量%乙二醇單_2-乙基己越加入所得混合物内。甲 酸加入所得混合物内,使令和比(令和樹脂之陽離子基之比) 為41.7%,加入25質量%醋酸鋅與離子交換水25%水溶液以 稀釋混合物,使固體含量之質量比為3〇 〇質量%。然後,在 減壓下除去MIBK與水之昆合物,直到固體含量之質量比變 成3 6.0質量%為止,以便製備主溶劑。 [製造例4顏料分散性清漆之製備] 具有%氧化物當量為450之雙紛型環氧樹脂與2_乙基己 醇·半嵌^又異弗爾鲷一異亂酸酷反應。所得物用丨_(2_經基乙 基硫基)-2-丙醇及二羥甲基丙酸轉化成第三锍,以製備樹脂 清漆供分散具有第三锍轉化比為7〇 6質量%及固態樹脂含 量為60質量%之顏料。 [實例1] <無錯電沉積塗層組合物之製備> 5 0.0伤分散製造例4製造之顏料之樹脂清漆、1〇〇 〇份離子 交換樹脂及100.0份表1所示之顆粒狀混合物係藉砂磨機分 散,並進一步碾磨,直到顆粒大小變成5微米或以下為止, 以得含有52.0質量%固體含量之分散膏,其含有4〇質量%氧 化單丁基錫及顏料,以及12質量%固態樹脂。 91727.doc 17 表1 顆粒狀混合物 質量比 根據全部顏料之質量比 氧化單丁基錫 1.5 - 二氧化鈦 47.5 48.2 碳黑 1 1 面嶺土 50 50.8 1352724 然後,將2,000份去離子水、1,5〇〇份製造例3之主溶劑及 500.0份分散膏混合以得具有固體含量為2〇 〇質量%之無鉛 電沉積塗層組合物。氧化單丁基錫對黏合劑之固體含量之 質量比為0.5質量%,組合物之辞離子含量為7〇〇 ρριη。 <電沉積塗層> _ 製備冷滾壓未加工鋼板之樣品。將樣品脫脂並用作為負 電極之以磷酸鋅為主化學處理劑(商品名稱SURFDYNE 5000, Nippon Paint公司製造)預處理,上述電沉積塗層組合 物係在施加電壓為15〇至250 V及浴溫為3(TC之條件下電沉 積以付具有乾燥厚度為25微米之電沉積塗膜。電沉積塗 膜用水洗滌並在1 70。(:下烘焙20分鐘。電沉積塗膜受到固化 能力試驗(丙酮摩擦試驗)並對化合物自電沉積塗膜轉移至 形成在電沉積塗膜上之上膜作評估。其結果顯示於表2。 〈丙酮摩擦試驗〉 電沉積塗膜之表面用浸泡丙酮之紗網前後摩擦5或6次。 評估表面之脫色及光澤,顏色及光澤未變之樣品視為令人 滿意產品。 <錫化合物轉移試驗> 修整底漆(Τ-5Η由Kansai Paint公司製造)塗敷至電沉積塗 膜,使修整底漆之薄膜具有乾燥厚度為3微米並在14〇。匸下 91727.doc 1352724 烘焙20分鐘。修整底漆薄膜表面之錫原子濃度(質量%)係由 ESC A測定0 <電沉積塗膜之黏著試驗> 修整底漆(T-5Η由Kansai Paint公司製造)塗敷至電沉積塗 膜,使修整底漆之薄膜具有乾燥厚度為3微米、中間塗層 (HS-48由Kansai Paint公司製造)塗敷至修整底漆,塗二 =:,下烘培2°分鐘。薄膜之黏著性係藉柵條試驗Ο [貫例2至4及比較例1至3]
除了改變氧彳卜i -p f A 虱化早丁基錫、鋅離子及顏料 - 實例1相同方式製備益 之里以外,以如 .、·、軍/儿積塗層組合物、略. 並評估其耐蝕性。兑沾 电沉積至樣品 八、·、〇禾顯不於表2。
9l727.doc 1352724 ^^^#Λ1:^Λ^ιέ^^^^0θ^^1:~^·Ι:ντσ·(^1:%)^^'!^^^^1:(ρρη1)^^#^ 鄺1 2000霉Τ繇6^贫命穿一 + ~±.缽淨~靡左命赛瓣荈;龄缴韋Λ t衾鉍塒t i钋; t菡IOT-啉其麥:^漭瘃th,^>M--e-s啄蒎l_J醬~ #皭鉍斜祕犇~rrb。 評怙 顏料 -Η» 孫 屮 命 錫化合物 m 柵極黏著試驗(殘餘 比) 錫化合物轉移試驗 丙酮磨面試驗 | Kaolin 丨 Carbon black |Titanium dioxide | νψ ςχ Ό 旦 氧化二丁基錫 三辛酸單丁基錫 氧化單丁基錫 100/100 〇 優異 I 50.8 1 b 1_4^2__I 700 1 t 〇 實例1 | 1 100/100 〇 k) 優異 _53-2 1 Μ* Η— !_45.7 | 730 1 1 NJ 〇 實例2 100/100 〇 UJ 優異 (-Λ Η— 1_47.8 | 710 1 1 〇 實例3 100/100 1 p 優異 | 50.8 1 1_48.2 1 750 1 〇 1 實例4 100/100 p >—* 良好 1 50.8 1 1—· 1_48.2 | g 1 1 〇 ί_Λ 實例5 100/100 〇 bo 優異 I 50.8 | »•4 _48-2 1 690 〇 Ln 1 二 實例6 100/100 〇 不良 | 50.5 | 1—* | 48.5 | 720 〇 LO 1 1 比較例1 50/100 U) k) 優異 | 53.2 | _45.7 690 N) 〇 1 1 比較例2 50/100 ί〇 優異 1 53.2 1 二 _45-7 1 690 C: 1 〇 ί_η 比較例3 〔>2〕 9I727.doc -20· 1352724 由上述結果可知無鉛電沉積塗層組合物,其根據包含陽 離子基質樹脂及交聯劑之黏合劑樹脂之固體含量含有特定 量之單丁基錫化合物及特定濃度之鋅離子,顯示足夠薄膜 固化能力並放出較低錫化合物。另一方面,使用小量氧化 二丁基錫之比較例1之組合物顯示不足薄膜固化能力,而使 用大量氧化二丁基錫之比較例2及3之組合物則放出更多錫 化合物,因而導致塗膜間之黏著性之減少。 本發明之無鉛電沉積塗層組合物含有特定量之單烷基錫 化合物以顯示優異薄膜固化能力。此外,單烷基錫化合物 具有低揮發性,因而很難在形成電沉積塗膜之過程中轉移 至修整底漆薄膜或中間塗膜。因此,組合物可形成具有優 異薄膜性能之電沉積塗膜。此外,胺基-環氧樹脂可用作陽 離子基質樹脂以增加耐钱性。@ &,本發明之經塗層物品 可用於需要高品質及發亮外觀之物品,如車體及家用雷器 用具。 ,。= 91727.doc -21 -
Claims (1)
1352724 第093105883號專利申請案 中文申請專利範圍替換本〇〇〇年3月) 十、申請專利範圍: 1· 一種無錯陽離子電沉積之塗 月匕及一插赤々接士 、,σ物,其包含黏合劑樹 曰 種或夕種有機錫化合物作為固化觸媒, 其中該黏合劍樹脂包含陽離子基質樹脂及钱 s曰㈣劑、’該有機錫化合物對該點合劑樹脂之固體含量 質:!:比為〇·1至10質’基於該有機錫化合物之總質 量,該有機錫化合物包含超過5〇質量%之氧化單丁基錫, 其中該無㈣離子電沉積之塗層組合物包含^至 2,000 ppm鋅離子。 2.如申請專利範圍第!項之無鉛陽離子電沉積之塗層組合 物, 其中該陽離子基質樹脂為胺基-環氧樹脂。 3. —種經塗層物品,包含基材及形成於其上之電沉積塗膜, 其中電沉積塗膜包含如申請專利範圍第丨至】項中任一 項之無錯陽離子電沉積之塗層組合物。 4 ·如申晴專利範圍第3項之經塗層物品, 其中該經塗層物品包含形成在該電沉積塗膜上之包含 修整底漆之膜。 5.如申請專利範圍第4項之經塗層物品, 其中該修整底漆為使用聚烯烴作為基質樹脂之底漆。 91727-1000318.doc
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JP2003059027A JP4248898B2 (ja) | 2003-03-05 | 2003-03-05 | 鉛フリー電着塗料組成物及び塗装物 |
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TW200500426A TW200500426A (en) | 2005-01-01 |
TWI352724B true TWI352724B (en) | 2011-11-21 |
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TW93105883A TWI352724B (en) | 2003-03-05 | 2004-03-05 | Lead-free electrodeposition coating composition an |
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US (1) | US7297406B2 (zh) |
JP (1) | JP4248898B2 (zh) |
CN (1) | CN100381511C (zh) |
CA (1) | CA2519851A1 (zh) |
GB (1) | GB2414478B (zh) |
TW (1) | TWI352724B (zh) |
WO (1) | WO2004078856A1 (zh) |
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JP5338661B2 (ja) * | 2007-05-29 | 2013-11-13 | 旭硝子株式会社 | オキシアルキレン重合体の製造方法 |
CN103436121A (zh) * | 2013-08-23 | 2013-12-11 | 苏州长盛机电有限公司 | 水性铁红阻燃防锈涂料 |
Family Cites Families (12)
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DE3044106A1 (de) * | 1979-11-30 | 1981-09-03 | Yoshitomi Pharmaceutical Industries, Ltd., Osaka | Verfahren zur herstellung von polyurethanen |
US4419467A (en) * | 1981-09-14 | 1983-12-06 | Ppg Industries, Inc. | Process for the preparation of cationic resins, aqueous, dispersions, thereof, and electrodeposition using the aqueous dispersions |
US4973392A (en) * | 1988-12-27 | 1990-11-27 | The Sherwin-Williams Company | Curable coating compositions comprising crosslinked components |
GB2246572B (en) * | 1990-08-01 | 1993-08-18 | Nippon Paint Co Ltd | Impact resistant primer |
AT396372B (de) | 1991-03-05 | 1993-08-25 | Vianova Kunstharz Ag | Dibutylzinnoxid-zubereitungen und ihre verwendung zur katalysierung der vernetzungsreaktionen von kationischen lackbindemitteln |
JP3387615B2 (ja) * | 1994-03-18 | 2003-03-17 | 日本ペイント株式会社 | カチオン電着塗料組成物 |
DE19650157A1 (de) * | 1996-12-04 | 1998-06-10 | Basf Coatings Ag | Verfahren zur Beschichtung von Substraten, vorzugsweise aus Metall |
US6669835B1 (en) * | 1997-02-18 | 2003-12-30 | Atofina Chemicals, Inc. | Aqueous dispersions of polymerizable reactants and a water incompatible catalyst sorbed on an inorganic particulate carrier |
JP4088371B2 (ja) * | 1998-06-25 | 2008-05-21 | 日本ペイント株式会社 | カチオン電着塗料組成物 |
JP2001055538A (ja) | 1999-08-18 | 2001-02-27 | Kansai Paint Co Ltd | カチオン電着塗料組成物 |
US20040180779A1 (en) * | 2001-11-26 | 2004-09-16 | Hiroshi Ishikawa | Fired composition and electrodeposition coating |
JP4204353B2 (ja) * | 2003-03-05 | 2009-01-07 | 本田技研工業株式会社 | 鉛フリー電着塗料用組成物の塗装方法および塗装物 |
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- 2004-03-03 CA CA 2519851 patent/CA2519851A1/en not_active Abandoned
- 2004-03-03 US US10/547,908 patent/US7297406B2/en not_active Expired - Fee Related
- 2004-03-03 WO PCT/JP2004/002681 patent/WO2004078856A1/en active Application Filing
- 2004-03-03 CN CNB200480005650XA patent/CN100381511C/zh not_active Expired - Fee Related
- 2004-03-03 GB GB0518597A patent/GB2414478B/en not_active Expired - Fee Related
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US7297406B2 (en) | 2007-11-20 |
GB2414478A (en) | 2005-11-30 |
WO2004078856A1 (en) | 2004-09-16 |
GB0518597D0 (en) | 2005-10-19 |
JP4248898B2 (ja) | 2009-04-02 |
US20070167582A1 (en) | 2007-07-19 |
CN100381511C (zh) | 2008-04-16 |
JP2004269582A (ja) | 2004-09-30 |
TW200500426A (en) | 2005-01-01 |
CN1756810A (zh) | 2006-04-05 |
GB2414478A8 (en) | 2005-12-05 |
CA2519851A1 (en) | 2004-09-16 |
GB2414478B (en) | 2007-05-09 |
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