TWI350102B - Solid-state imaging device, method of driving solid-state imagine device, and camera - Google Patents

Solid-state imaging device, method of driving solid-state imagine device, and camera

Info

Publication number
TWI350102B
TWI350102B TW096107262A TW96107262A TWI350102B TW I350102 B TWI350102 B TW I350102B TW 096107262 A TW096107262 A TW 096107262A TW 96107262 A TW96107262 A TW 96107262A TW I350102 B TWI350102 B TW I350102B
Authority
TW
Taiwan
Prior art keywords
solid
state
camera
imaging device
driving
Prior art date
Application number
TW096107262A
Other languages
English (en)
Other versions
TW200746807A (en
Inventor
Yoshinori Muramatsu
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200746807A publication Critical patent/TW200746807A/zh
Application granted granted Critical
Publication of TWI350102B publication Critical patent/TWI350102B/zh

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N3/00Scanning details of television systems; Combination thereof with generation of supply voltages
    • H04N3/10Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
    • H04N3/14Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
    • H04N3/15Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
    • H04N3/155Control of the image-sensor operation, e.g. image processing within the image-sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW096107262A 2006-03-06 2007-03-02 Solid-state imaging device, method of driving solid-state imagine device, and camera TWI350102B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006059022A JP4959207B2 (ja) 2006-03-06 2006-03-06 固体撮像装置

Publications (2)

Publication Number Publication Date
TW200746807A TW200746807A (en) 2007-12-16
TWI350102B true TWI350102B (en) 2011-10-01

Family

ID=38588405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107262A TWI350102B (en) 2006-03-06 2007-03-02 Solid-state imaging device, method of driving solid-state imagine device, and camera

Country Status (5)

Country Link
US (1) US7864237B2 (zh)
JP (1) JP4959207B2 (zh)
KR (1) KR101331365B1 (zh)
CN (1) CN101035191B (zh)
TW (1) TWI350102B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107269B2 (ja) * 2004-02-23 2008-06-25 ソニー株式会社 固体撮像装置
US8237808B2 (en) * 2007-01-17 2012-08-07 Sony Corporation Solid state imaging device and imaging apparatus adjusting the spatial positions of pixels after addition by controlling the ratio of weight values during addition
JP4386118B2 (ja) * 2007-08-31 2009-12-16 ソニー株式会社 撮像回路
TWI504256B (zh) * 2008-04-07 2015-10-11 Sony Corp 固態成像裝置,其訊號處理方法,及電子設備
JP5178458B2 (ja) * 2008-10-31 2013-04-10 キヤノン株式会社 固体撮像装置、撮像システム、および、固体撮像装置の駆動方法
FR2939919A1 (fr) * 2008-12-16 2010-06-18 New Imaging Technologies Sas Capteur matriciel
JP5272860B2 (ja) * 2009-04-08 2013-08-28 ソニー株式会社 固体撮像素子およびカメラシステム
JP5417055B2 (ja) 2009-06-15 2014-02-12 シャープ株式会社 A/d変換器、固体撮像装置、及び電子情報機器
JP5429547B2 (ja) 2009-10-02 2014-02-26 ソニー株式会社 固体撮像装置、撮像装置、ad変換方法
US8817153B2 (en) * 2011-07-25 2014-08-26 Aptina Imaging Corporation Column parallel readout image sensors with shared column analog-to-digital converter circuitry
JP6041500B2 (ja) * 2012-03-01 2016-12-07 キヤノン株式会社 撮像装置、撮像システム、撮像装置の駆動方法、撮像システムの駆動方法
JP6083137B2 (ja) * 2012-06-26 2017-02-22 ソニー株式会社 制御装置および制御方法
US9294703B2 (en) 2012-12-03 2016-03-22 Samsung Electronics Co., Ltd. Image sensor including data transmission circuit having split bus segments
JP6045379B2 (ja) * 2013-02-08 2016-12-14 オリンパス株式会社 撮像装置
CN107948553B (zh) * 2016-10-12 2020-05-01 原相科技股份有限公司 影像传感器、使用于其的模拟数字讯号处理方法和装置
JP2019092143A (ja) * 2017-11-10 2019-06-13 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
WO2019092994A1 (en) * 2017-11-10 2019-05-16 Sony Semiconductor Solutions Corporation Solid-state imaging apparatus
DE112019005940T5 (de) 2018-12-28 2021-08-12 Japan Display Inc. Erkennungsvorrichtung
US10951840B1 (en) * 2019-08-29 2021-03-16 Omnivision Technologies, Inc. Versatile image sensor circuit
US11368639B2 (en) * 2019-09-30 2022-06-21 Canon Kabushiki Kaisha Photoelectric conversion apparatus, image capturing system, method for driving photoelectric conversion apparatus, and moving object

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831688A (ja) * 1981-08-19 1983-02-24 Hitachi Ltd 固体カラ−撮像装置
US4658287A (en) * 1984-02-29 1987-04-14 Fairchild Camera And Instrument Corp. MOS imaging device with monochrome-color compatibility and signal readout versatility
US5841126A (en) * 1994-01-28 1998-11-24 California Institute Of Technology CMOS active pixel sensor type imaging system on a chip
US6563540B2 (en) * 1999-02-26 2003-05-13 Intel Corporation Light sensor with increased dynamic range
JP4777496B2 (ja) * 2000-02-10 2011-09-21 富士フイルム株式会社 固体撮像素子
JP3990857B2 (ja) * 2000-07-03 2007-10-17 キヤノン株式会社 撮像装置及び撮像システム
JP3507800B2 (ja) * 2001-02-02 2004-03-15 有限会社リニアセル・デザイン アナログ−デジタル変換器及びこれを用いたイメージセンサ
US7084912B2 (en) * 2001-09-20 2006-08-01 Yuen-Shung Chieh Method for reducing coherent row-wise and column-wise fixed pattern noise in CMOS image sensors
JP4164263B2 (ja) * 2002-01-29 2008-10-15 キヤノン株式会社 固体撮像装置、カメラ及び情報処理装置
JP4192510B2 (ja) * 2002-06-14 2008-12-10 日本電気株式会社 半導体装置
JP2004274578A (ja) * 2003-03-11 2004-09-30 Toshiba Corp 固体撮像装置
CN101478646B (zh) * 2004-02-23 2012-08-08 索尼株式会社 固态图像拾取设备及其驱动的方法
DE102004023855B4 (de) * 2004-05-13 2006-11-30 Infineon Technologies Ag Schaltkreis-Anordnung
JP4380439B2 (ja) * 2004-07-16 2009-12-09 ソニー株式会社 データ処理方法およびデータ処理装置並びに物理量分布検知の半導体装置および電子機器

Also Published As

Publication number Publication date
KR101331365B1 (ko) 2013-11-19
TW200746807A (en) 2007-12-16
CN101035191B (zh) 2013-03-20
US7864237B2 (en) 2011-01-04
CN101035191A (zh) 2007-09-12
JP4959207B2 (ja) 2012-06-20
JP2007243265A (ja) 2007-09-20
US20080117321A1 (en) 2008-05-22
KR20070091553A (ko) 2007-09-11

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